Working Location: Buona Vista

Working Time: 5 day work week, 8:45am - 5:30pm

Job Description

● Utilise 3D CAD design tools and perform high precision 3D printing (FDM

& DLP)

● Utilise basic microcontrollers boards such as Arduino, ESP32 or STM32

to build simple circuit boards for sensor control and data acquisition

● Testing and assembly of electronics and mechanical parts and debugging

of software using basic tools like python or C++

● Familiar with maintenance of laboratory inventory and laboratory

administrative tasks (Procurement, equipment preventive

maintenance/repairs and safety matters)

● Enthusiastic, highly motivated, able to multitask, with excellent

interpersonal and communication skills.

● Administrative works, such as ordering and payment with SAP system.

Job Requirements

● Basic experience in 3D CAD design software, like Solidworks and Fusion360.

● Basic experience with microcontroller boards like Arduino, Esp32, STM32.

● Basic experience in handling simple electronics and basic hands-on soldering skills

● Prior experience or have interest in handling administrative tasks like raising Purchase Orders, payment requests, arranging preventive maintenance of equipment and liaising with vendors.

● Diploma/Higher Nitec/ Nitec holders in Bioengineering, Biophysics, physics, mechatronics, electrical engineering, mechanical engineering, computer engineering, or any related fields.

If you do not possess the above experience, your application will still be considered on individual merits and you may be contacted for other opportunities.

By submitting your personal data and/or resume, you give consent to the collection, use, and disclosure of your personal data and/or resume by the company (or its agent) for the purpose of the processing and administration by the company relating to this job application.

Please be notified that only shortlisted candidates will be notified.

EA Personnel.: Chan Jun Wei
EA Registered no.: R1543992
Recruit Now Singapore Pte Ltd
EA License no.: 21C0845

We are looking for a Package-Silicon Integration Engineer in Micron's Package Development Engineering(PDE) Group, who will be responsible for driving advanced package development for next generation silicon and package technologies. You will collaborate with various functional teams such as silicon wafer design, package design, wafer fab to meet project requirements. You will drive the technology development through multiple phases of product maturity and contribute to Micron's strategic objectives of Technology leadership.

RESPONSIBILITIES include but are not limited to:

• Work with package design and development teams to complete chip package interaction risk assessment.
• Work with scribe designers and assembly engineers to find solutions for dicing problems and implement relevant design rules/FMEA.
• Work with die designers to enable design for manufacturing in area like die size, scribe width and pad size.
• Collaborate with R&D/manufacturing wafer fabs and packaging teams to solve relevant issues, and improve yield, quality and manufacturability.
• Contribute to development of new silicon and package technologies by engaging with Micron’s internal factories.
• Define test vehicles, plan DOEs, characterize enabling technologies, document best-known-process and hand-off to manufacturing.
• Identify technology, quality, business process gaps and develop solutions.

EDUCATION, EXPERIENCE & QUALIFICATION REQUIRED

• Masters or Bachelor’s degree in Engineering (Mechanical, Materials Science, Electrical, Chemical) or related field
• 5-7 years of semiconductor fab experience in Chip package interaction and integration
• Strong Project / Program management skills
• Possess sound methodology for organizing work, decision-making and setting priorities
• Strong analytical, problem solving, and organizational skills
• Proficiency in computer applications like Excel, Word, Power Point.
• Self-motivated and team-oriented.
• Strong interpersonal, oral and written communications-skills.

Keen on the role? Apply now!

As a Non-Volatile Memory Quality & Reliability Assurance (NVMQRA) Engineer at Micron Technology, you will be responsible for performing formal Failure Analysis of customer reported failing devices via the Returned Material Authorization (RMA) process. You will be required to summarize lab analysis results at the electrical and physical level to identify root cause and establish an associated containment plan. In this role, you will have the opportunities to collaborate with various engineering and manufacturing stakeholders to evaluate and review Corrective Actions /Preventive Actions. You will provide documentation of the RMA findings and oversee the final customer report till closure. In addition, for the senior role, you will be asked to provide guidance and lead the team when solving complex unplanned deviations reported by our customers. Project management skills are necessary and the ability to make critical decisions that directly translate to quality and timely completion of the project is highly desirable. You will also be required to spearhead the sustaining efforts and keeping up to date on new product knowledge, as well as developing and mentoring new talents.

Responsibilities and Tasks

Perform Failure Analysis of Customer Returns

• Understand customer complaint of the memory component failure
• Initiate communication with Micron Customer-facing team for further details on customer complaint, requesting additional questions to provide best opportunity for successful analysis
• Perform bench level analysis including initial data image analyis/examination
• Perform Automated Test Equipment (ATE) analysis and interpret results
• Work with the appropriate engineering teams (e.g., PE, PYE) to perform detailed fault isolation when electrical failure has been confirmed
• Summarize findings and submit for physical failure analysis (PFA).

Provide FA Reports for Micron Customer Facing Team for Communication to External Customers

• Summarize analysis at electrical and physical level into customer friendly formats.
• Work with the appropriate manufacturing Global Quality teams through the appropriate request systems (example: GPSS) for Root Cause and/or Corrective Action and a containment plan
• Identify potential risk to external customers
• Communicate with respective BU (Business Unit) on potential impact to customers
• Communicate FA updates through interim reports or during scheduled meetings with the customers.
• Provide formal FA Report with findings

Sustain Knowledge of Device Capabilities and Characteristics

• Keep up to date with latest Fab/ASM process technology
• Understand datasheet specifications for each device and the differences from previous technode for NOR * NAND product family
• Comprehension of qualification data and potential impact to customer operation
• Stay up-to-date on common customer applications and usage model
• Partnering with customer support team to resolve ongoing customer issues

Qualifications and Experience

• Excellent verbal and written communication skills in English. The ability to communicate clearly and concisely both verbally and in writing is critical in this role.
• Good organization skills and ability to multitask and coordinate between multiple issue at any given time.
• Ability to work effectively in cross-functional teams and handle pressure situations in a professional manner
• Excellent problem-solving and analytical skills with strong attention to details.
• Familiarity with NexTest /Teradyne bench analytical tools, scripting in linux console will be an added advantage.

Candidates with 2-3 years of experience in the semiconductor industry as Product or QA engineer are preferred. Relevant experienced candidates will be considered for the Senior Role.

Education

A Bachelor or Masters Degree in Electrical Engineering or similar field of study.

UnaBiz is the leading IOT company in Singapore. HQ in Singapore, with office in Taiwan, Japan, France, Spain and providing IOT solution globally.

Join the company that supplies solutions to established local and MNC like SIA, CBRE, JLL, Certis, Engie, and many more!

Job Descriptions:

• Collaborate with clients to understand their needs and tailor solutions that align with their business objectives.
• Stay updated on industry trends, competitor offerings, and emerging technologies in the smart workspace domain.
• Conduct product presentations and demonstrations that showcase the features and benefits of our smart workspace solutions.

Job Requirements:

• Candidate must possess at least Bachelor's degree in Electrical, Electronics, Software, or related field.
• Excellent communication and interpersonal skills, with the ability to present to diverse audiences.
• Strategic thinker with the ability to identify market opportunities .
• Demonstrated ability to negotiate and close deals with a customer-centric approach.
• Strong organizational skills and ability to manage multiple priorities effectively.
• Self-motivated and results-oriented, with a proactive attitude toward problem-solving.

Rewards:

• Competitive salary
• Free lunch in office provided
• Free transport to/from office

As a Non-Volatile Memory Quality & Reliability Assurance (NVM QRA) Engineer at Micron Technology, you will be responsible for performing formal Failure Analysis of customer reported failing devices via the Returned Material Authorization (RMA) process. You will be required to summarize lab analysis results at the electrical and physical level to identify root cause and establish an associated containment plan. In this role, you will have the opportunities to collaborate with various engineering and manufacturing stakeholders to evaluate and review Corrective Actions /Preventive Actions. You will provide documentation of the RMA findings and oversee the final customer report till closure. In addition, for the senior role, you will be asked to provide guidance and lead the team when solving complex unplanned deviations reported by our customers. Project management skills are necessary and the ability to make critical decisions that directly translate to quality and timely completion of the project is highly desirable. You will also be required to spearhead the sustaining efforts and keeping up to date on new product knowledge, as well as developing and mentoring new talents.

Responsibilities and Tasks

Perform Failure Analysis of Customer Returns

• Understand customer complaint of the memory component failure
• Initiate communication with Micron Customer-facing team for further details on customer complaint, requesting additional questions to provide best opportunity for successful analysis
• Perform bench level analysis including initial data image analysis/examination
• Perform Automated Test Equipment (ATE) analysis and interpret results
• Work with the appropriate engineering teams (e.g., Product Engineering, Product Yield Enhancement) to perform detailed fault isolation when electrical failure has been confirmed
• Summarize findings and submit for physical failure analysis (PFA).

Provide FA Reports for Micron Customer Facing Team for Communication to External Customers

• Summarize analysis at electrical and physical level into customer friendly formats.
• Work with the appropriate manufacturing Global Quality teams through the appropriate request systems for Root Cause and/or Corrective Action and a containment plan
• Identify potential risk to external customers
• Communicate with respective BU (Business Unit) on potential impact to customers
• Communicate FA updates through interim reports or during scheduled meetings with the customers.
• Provide formal FA Report with findings

Sustain Knowledge of Device Capabilities and Characteristics

• Keep up to date with latest Fab/ASM process technology
• Understand datasheet specifications for each device and the differences from previous technode.
• Comprehension of qualification data and potential impact to customer operation
• Stay up-to-date on common customer applications and usage model
• Partnering with customer support team to resolve ongoing customer issues

Qualifications and Experience

• Excellent verbal and written communication skills in English. The ability to communicate clearly and concisely both verbally and in writing is critical in this role.
• Good organization skills and ability to multitask and coordinate between multiple issue at any given time.
• Ability to work effectively in cross-functional teams and handle pressure situations in a professional manner
• Excellent problem-solving and analytical skills with strong attention to details.
• Familiarity with NexTest /Teradyne bench analytical tools, scripting in linux console will be an added advantage.

Candidates with 2-3 years of experience in the semiconductor industry as Product or QA engineer are preferred. Relevant experienced candidates will be considered for the Senior Role.

Education

A Bachelor or Masters Degree in Electrical Engineering or similar field of study.

- Respond to network appliances connectivity issues and resolve any issues within the confines of the office.

- Collaborate with partners and service vendors to ensure that the proxy, firewalls, and network appliances stay operational.

- Responsible for configuration and maintaining Routers, Switches, Firewalls, Proxy/Web Isolation, Load-Balancer and Security Patches for equipment.

- Troubleshoot, provide resolution and raising tickets when networking equipment face issues.

- Create, maintain, and update documentation as it relates to configuration, process, and service records.

- Monitoring security measures for the protection of computer systems, networks, and information

- Responsible for providing customer support in solving all phases of complex information security related technical problems.

- Reviews and recommends information security solutions to customer problems based on an understanding of products/systems test results.

Key Requirements

- L2: 3 to 5 years’ experience in Network Infra Setup and Operations and at least 3 to 5 full delivery cycle implementations of relevant projects

- Required to work on wee hours, weekends, and public holidays.

- Knowledge of routing, switching, firewall, proxy/web isolation and data center operation.

- Able to work well in a team environment and use tools like Visio and Wireshark.

Key Responsibilities:

• System Development, Implementation and Support
• Evaluate requirements and analyze impact to the application
• Involve in design and development stage
• Involve in application setup and deployment
• Provide guidance towards testing phases
• Provide level 3 production support to relevant open systems applications 
• Coordinate with internal teams and vendors to resolve application and system issues
• Execute tasks related to project / change request / maintenance request

Key Requirements:

• Degree in Computer Science or equivalent
• 5 years of UNIX/LINUX/SQL/Korn Shell programming experience
• Hands-on experience on Oracle database, Webserver such as Apache, Java platform / J2EE and Java web container such as WebLogic, JBoss EAP, Tomcat
• Relevant working experience with good working knowledge in cards, loyalty, remote commerce, portals or digital payment domains.
• A good understanding of API frameworks will also be desired.
• Ability to multi-task and perform well under pressure

Key Responsibilities:

• Liaise with Solutions team to understand systems design
• Perform installation, configuration and maintenance of network devices and AD server / management server on-site
• Assist Project Managers and Engineers to prepare systems related diagram for the project implementation
• Ensure systems design conforms to contract and technical requirements
• Engage with back line support and/or with vendor’s support to diagnose and rectify technical problems to effectively resolve project implementation issues
• Attend to preventive and corrective maintenance to backend system
• Ensure all work activities comply with the company’s safe work procedures

Competence (Knowledge, Skills and Abilities):

• Skills in relating to and servicing the customers with a win-win mind set
• Skills in troubleshooting technical problems related to servers, routers, switches, and IoT devices.
• Good knowledge of the security and surveillance solutions landscape and industry trends
• Knowledge on Microsoft Clustering, Active Directory, Agent VI, Milestone, VMware and IT Security is required
• Knowledge of CentOS, Ubuntu, VMware (ESXi), Firewall, Networking, and Windows Server OS
• Proficient in Active Directory, Certificate Services, Virtualization technology, and cyber security is required
• Skills in planning and scheduling
• Professional Certificate in MCSE and CISSP would be an advantage

Requirements:

• Minimum Degree in Computer Engineering or related discipline
• At least 3 years’ experience in a similar capacity
• Experience in installation on Server / Client configuration, Network Storage and IT Network

For personal data protection (PDP) related matters, pls refer to our PDP policy via corporate website at oconnors.co Personal Data Protection Policy.

Role Profile

This technical solution focused role is accountable to setup applications and database and ensure their optimal performance to support various GovTech projects.

Key Responsibilities:

• Setup the application and database
• Perform analysis and review software application functionality and design and suggest improvement to enhance the design to cater for new services
• Consult with software development team, internal users, and clients to improve application performance
• Administer the application including user account management and configuration of the application
• Generate Test Plans and Test Procedures for User Acceptance Tests (UAT)
• Conduct UAT and prepare final UAT Reports
• Keep a record of configuration changes and scheduling application updates
• Support production issues such as establishing root causes of application issues and liaise with the software vendor to resolve issues
• Take care of application migration and new release roll-out
• Document processes and monitor application performance metrics
• Develop tools needed by L1/L2 that will help them with their investigation process

Competence (Knowledge, Skills and Abilities):

• Good understanding of the software and hardware environments for CCTV/networked cameras system
• Proficient in Video and IoT management application, software analysis and design, as well as proposal write up
• Good knowledge on the key features of the CCTV / Networked Video / Security Camera / Video Management product in the market
• Sound network knowledge (Internet Protocols, TCP/IP, DNS, DHCP, SNMP, Network Architecture etc.)
• Familiar with Golang, Node JS, JavaScript, Windows Server OS, CentOS, Ubuntu OS and MongoDB

Requirements:

• High level problem solving and communication skills
• Strong technical knowledge with and certification on in-house products
• Able to deal with routine tasks and may perform tasks with some level of complexity
• Take decisions for own tasks in defined degree of freedom
• Able to solve problems in most cases and within guidelines
• Works independently within guidelines, defined procedures and direction

Education & Experience:

• Bachelor’s Degree in Computer Science, Information Technology, Software Engineering or related field
• At least 3-5 years working experience in Video and IoT Management application, software analysis and design

For personal data protection (PDP) related matters, pls refer to our PDP policy via corporate website at oconnors.co Personal Data Protection Policy.

Epsilon operates a global IP/MPLS network as well as supporting transmission networks. We are seeking a candidate with strong IP/MPLS skills and experience. The candidate would be responsible for ongoing network optimization and technological development for our global IP/MPLS network which support layer2 and layer3 VPN services. The candidate should also express a willingness to participate in projects related to transmission network upgrades and planning exercises.

Responsibilities

• Responsible for the deployment and management of the global MPLS and VPLS (E-Line, E-LAN and IP-VPN) infrastructure.
• Work with solutions design, and technical sales teams to develop complex service solutions for bespoke customer applications.
• Responsible for the deployment and management of the global IP transit, IP peering, and the connection to IXP and CSP.
• Work cross-functionally with product team and project management to generate implementation plans including Method of Procedure (MOP), Bill of Materials (BOM) and Scope of Works (SOW)
• Participate in optical transmission network upgrades and migrations as needed.
• To take up the on-call rotation and out of hours work when required
• Maintain technical and training documentation and develop automation as needed.
• Provide guidance and training to NOC when required

Requirement

• 5+ years of working experience in telecom provider, ISP, CSP or content provider.
• Experience working within a multi-vendor network environment – Juniper, Alcatel-Lucent/Nokia and Cisco are relevant.
• Experience working with network automation tools (Ansible, Python, Jinja, Git) a plus
• Extensive knowledge and experience in Layer 2 switching and Layer 3 routing technologies and protocols including TCP/IP ,OSPF, BGP/MP-BGP, IS-IS, MPLS and RSVP etc.
• Experience working and knowledge in security and firewall.
• Experience working and knowledge in SD-WAN/SASE is a plus
• Knowledge or prior working experience with optical networks is a plus, but willingness to learn and understand the design and operational aspects of transmission technologies is required.
• Demonstrated ability to meet deadlines among multiple concurrent projects
• An enthusiastic and helpful attitude
• Willing to learn new technologies
• Must enjoy working in a fast-paced environment where a strong ability to multi-task is necessary
• Must be highly detail-oriented

Job Description:

• Facilitate execution of project plans and utilise appropriate methods and tools to track and drive progress of projects against set plans and timelines
• Collaborate and communicate effectively with relevant internal and external stakeholders related to the projects
• Track both internal and external quality project deliverables against project schedules
• Perform dimensional and geometrical measurements and inspection of manufactured components for evaluation of acceptability
• Approve parts for next process & data analysis.
• Review inspection result or data in accordance with inspection and test plans.
• Collate information for product and process quality metric management reports and provide summary statement to customers.
• Assist with various stakeholder to classify issues by implementing corrective and preventive actions (CAPA) plans
• Manage Internal and External CAR analysis
• Manage Sub-con NC parts investigation
• Identify opportunities and propose improvement on QMS related process & procedures within own work area and assist with the implementation of workflow improvements to improve efficiency
• Identify, diagnose and resolve process related issues by applying failure analysis, FMEA, 8D or SPC methodology
• Update and present QA monthly performance reports to internal stakeholder.

Requirements:

• Possess at least ITE/Diploma in Engineering (Mechanical), Engineering (Precision Engineering) or equivalent.
• Familiar with manufacturing process, precision engineering and quality assurance environment.
• High mix low volume work environment
• Independent and task prioritization
• Knowledge on Microsoft office software.
• Basic knowledge on ISO 9001.
• Knowledge on mechanical drawing, GD&T.
• Knowledge in CAPA / 8D / Root cause analysis
• Able to use basic measuring instruments like caliper, micrometer & profile projector.
• Able to do OGP smart scope program independently.
• Good email communication skills.

Service Desk Engineer

We are looking for experienced full-time Service Desk engineer to provide End User Computing or Service Desk support to APAC Region in Singapore.

Job Responsibilities:

• Provide level 1.5 End User Computing support and well verse in Windows OS
• Diagnosing end-user system failures and implement repair solutions.
• Diagnosing printer and other peripheral devise failures and implement repair solutions.
• Troubleshooting network devices in order to ensure connectivity from the PC to the Network.
• Providing installation and upgrading services of hardware and software.
• Configuration and troubleshooting of phones and other mobile devices, tablets, and PDAs.
• Setup and troubleshooting audio/video equipment such as projectors and video conference equipment

Job Requirement:

• Diploma/Bachelor’s degree in computer science / information technology or relevant field.
• At least 1-1.5 years of relevant working experiences.
• Knowledge of multiple manufacturers and operating systems.
• Excellent troubleshooting capability.
• Using established procedures and working under immediate supervision, performs assigned tasks.
• Work is routine and instructions are usually detailed.
• Resolves routine questions and problems and refers more complex issues to higher levels.
• A good team player.
• Excellent interpersonal skills.
• Customer centric and focus on service excellence.
• Excellent problem-solving and multitasking skills.
• Good verbal and written communication skills and ability to interact with other teams.
• Working location: Central, Singapore

It would be appreciated if you can share with me your interest on the same.

Have a friend or family member who may be interested in taking the next step in their career? Help them out by referring them to Ennovatez.

You can email your resume to us at [email protected]

Responsibilities

●Collaborate with the sales/business development team to understand customer requirements and use cases, and identify how company's Robotics solutions can address those needs.
● Conduct product demonstrations and presentations to potential customers, showcasing the features and benefits of our robotics solutions.
● Develop proof-of-concept capabilities through ad-hoc software development and mechanical/electrical design with the help of internal engineering teams.
● Work closely with customers to understand their specific use cases and provide expert guidance on the integration of our robots into their operations.
● Create technical proposals and documentation tailored to customer requirements.
● Develop a deep understanding of company's Robotics' products and stay up-to-date with the latest advancements in the field.
● Act as a technical liaison between customers and our internal engineering teams, ensuring a smooth transition from presales to implementation.
● Support the sales team by participating in customer meetings, technical discussions, and addressing customer inquiries.
● Provide feedback to our product development team based on customer needs and market trends.
● Excellent presentation and communication skills.
● Ability to understand and address customer requirements and translate them into technical solution

Requirements:

● Degree with a focus on robotics, mechatronics, or related fields. Background in Computer Science/Electrical Engineering/Mechanical Engineering can be considered as well.
● Strong technical knowledge in their domain and the ability to work with customers.
● Should have at least one of the following:
○ Experience in Python or Javascript or C++. (or)
○ Experience in CAD software such as SolidWorks. (or)
○ Experience in mechatronics design such as working with Arduino or custom PCBs.

Plus Qualifications (Good to have)
● Experience with cloud computing platforms (e.g., AWS, Azure, Google Cloud).
● Familiarity with Docker, Jenkins, and other deployment tools.
● Exposure to backend system design to support robotics applications.
● Previous experience in a presales or technical sales role.
● Participation in robotics-related hackathons or competitions.

HOW TO APPLY:

Interested applicants, kindly send your resume in MS WORD format to kenneth(at)trustrecruit.com.sg

We regret only shortlisted candidates will be notified.

Important Note: Trust Recruit Pte Ltd is committed to safeguarding your personal data in accordance with the Personal Data Protection Act (PDPA).

Please read our privacy statement on our corporate website www.trustrecruit.com.sg.

Trust Recruit Pte Ltd

EA License No: 19C9950

EA Personnel: Kenneth Tan Guan Quan

EA Personnel Reg No: R1550240

Advance Packaging Integration – Senior Engineer (Package Development Engineering, Silicon Technology Package Integration) (PDE STPI)

We are looking for a Package Silicon Integrator in Package Development Engineering (PDE) Senior Engineer who will lead and drive Micron’s Packaging Technology Development Projects meeting Time to Market (TTM) business unit needs as well as meeting performance targets for Thermal, Electrical, Mechanical, Reliability and Cost. You will collaborate with Micron’s multi-functional team that include Product Development, Wafer level process, Assembly, Test, Manufacturing and Global Quality. Together, we will be responsible for the designing Test Vehicle Development Strategy, and execution to definition, development, and delivery of state-of-the-art product/packages that will shape the future of advanced computing, automotive and mobile products.

Responsibilities will include, but are not limited to:

• Drive package technology integration activities for the silicon test chip development projects and support NPIs to keep roadmap items on track to meet “go to market” timelines.
• Coordinate core team in Development and NPI space of advanced 2.5D/3D packages and standard packaging to drive material and BOM choices, body sizes, manufacturability, and package constructions to achieve acceptable Design for Manufacturing (DFM) and Design for Reliability (DFR) requirements.
• Evaluate wafer design inclusive of bondpad, scribe, pillars/bump and polyimide, and drive materials and BOM choices such as die thickness and mold compound to meet chip package interaction requirements.
• Drive materials characterization from both package and die components to understand chip package interaction mechanism using TMA, DMA, nanoindentation, and packaging mechanical and thermal stress stimulus.
• Drive novel solutions with silicon design and product teams to recommend the optimum package solutions to meet electrical, mechanical (1st, 2nd, and 3rd level interconnect), thermal, reliability, cost, and other system level requirements.
• Interface closely with multi-functional team that include Product Development, Wafer Level Process, Assembly, Test, Manufacturing and Global Quality and manage the product/package to mass production.

Requirements:

• Bachelor/Masters of Science in physics, materials, mechanical, chemical, or electrical engineering. MS or PhD preferred
• 5+ years of relevant experience in semiconductor manufacturing or a related field, with hands-on experience in semiconductor packaging or Frontend processes, specifically in technology on
• Appreciation for Structured Problem Solving
• Ability to interpret die-, package-, and system-level design and simulation (thermal/mechanical/electrical) methodologies and results
• Knowledge in Chip Package Interaction (CPI)
• Experience and working knowledge with 2.5D/3D heterogeneous integration technologies such as WLFO, SoIC, CoWoS, WoW, InFO, and other chiplet/SiP architectures is a plus
• Experience with wafer bumping, package assembly, substrate technology, BOM selection, testing and product development lifecycle
• Excellent communication skills with the ability to convey complex technical concepts to both technical and non-technical partners
• Demonstrated leadership experience in guiding multi-functional teams and driving technical excellence

Keen on the role? Apply now!

Summary:

• Basic up to $6000 (Senior), $5000 (Junior)
• Performance bonus
• Location: AMK / YCK / Central
• 5 days work week
• Familiar with ACMV
• Career advancement & stability

Key Responsibilities:

• Manage and lead the electrical team
• Perform engineering duties: design, engineering calculations, planning, tender and etc
• Perform testing and commissioning of ACMV electrical system
• QA/QC
• Resolve any technical issue during any stage of the project
• Liaise with clients, project manager, contractor and etc
• Ensure the team follows all electrical codes and standards
• Other relevant ad-hoc duties

Key Requirements:

• Min 5 years of relevant experience in Construction Electrical field, including testing and commission
• Familiar with ACMV

Interested applicants, please submit your updated resume in MS Words / PDF format by using the APPLY NOW BUTTON.

By submitting your personal data and/or resume, you give consent to the collection, use, and disclosure of your personal data and/or resume by the company (or its agent) for the purpose of the processing and administration by the company relating to this job application.

Please be informed that only shortlisted candidates will be notified.

Your recruiter for this job: Stella

WhatsApp me @ 8772 4117 for a prompt response to your enquiry!

Stella Aw Yong See Hui | R24121552

Recruit Now Singapore Pte Ltd | EA No: 21C0845

Remuneration: Basic Up to $7,000 + AWS

Job Description:

• Design, configure, deploy, and maintain Wintel and Linux server environments, including Windows Server (2019, 2022) and Linux distributions (RHEL, SUSE). Conduct server hardening
• Lead virtualization initiatives using industry-standard platforms such as VMware vSphere, Hyper-V, or KVM.
• Design and manage Storage Area Networks (SAN/NAS), ensuring data availability, integrity, and optimal performance.
• Ensure compliance with industry standards and regulations related to infrastructure and data storage.
• Implement and administer key management and encryption.
• Implement and administer Active Directory, including user accounts, group policies, security settings, and domain controllers.
• Implement and administer AD Public Key Infrastructure and Network
• Policy Server RADIUS services.
• Implement and administer monitoring solutions such as eG
• Innovations, PRTG, Splunk, or Kiwi Syslog server.
• Implement and administer backup solutions like Veeam or Acronis.
• Implement advanced system monitoring solutions to proactively identify and resolve performance and security issues.
• Investigate and resolve complex technical issues related to Windows Server systems, collaborating with teams and vendors.
• Coordinate with third-party vendors, IT providers, and external support for effective service delivery.

Job Requirements:

• Bachelor's degree in Computer Science, Information Systems, Information Technology, or a related field.
• Minimum of 5 years of experience in IT infrastructure engineering with a focus on Windows Server administration.
• Storage implementation experience with Dell EMC / NetApp
• Experience with Wintel servers (Dell), VMware, Microsoft server products, Symantec
• Proven experience in designing on-prem data centre architectures.
• Proficiency in configuring, managing, and troubleshooting Windows Server environments.
• In-depth knowledge of Active Directory, Group Policies, and security best practices.
• Familiarity with virtualization technologies such as VMware or Hyper-V.
• Experience with scripting and automation tools.
• Relevant certifications (e.g., MCSA, MCSE, VCP) are highly advantageous

Daniel Wilson | Reg No.: R24125247

Recruit Now Singapore Pte Ltd | EA Licence No.: 21C0845

Advance Packaging Integration – Senior Engineer (Package Development Engineering, Silicon Technology Package Integration) (PDE STPI)

We are looking for a Package Silicon Integrator in Package Development Engineering (PDE) Senior Engineer who will lead and drive Micron’s Packaging Technology Development Projects meeting Time to Market (TTM) business unit needs as well as meeting performance targets for Thermal, Electrical, Mechanical, Reliability and Cost. You will collaborate with Micron’s multi-functional team that include Product Development, Wafer level process, Assembly, Test, Manufacturing and Global Quality. Together, we will be responsible for the designing Test Vehicle Development Strategy, and execution to definition, development, and delivery of state-of-the-art product/packages that will shape the future of advanced computing, automotive and mobile products.

Responsibilities will include, but are not limited to:

• Drive package technology integration activities for the silicon test chip development projects and support NPIs to keep roadmap items on track to meet “go to market” timelines.
• Coordinate core team in Development and NPI space of advanced 2.5D/3D packages and standard packaging to drive material and BOM choices, body sizes, manufacturability, and package constructions to achieve acceptable Design for Manufacturing (DFM) and Design for Reliability (DFR) requirements.
• Evaluate wafer design inclusive of bondpad, scribe, pillars/bump and polyimide, and drive materials and BOM choices such as die thickness and mold compound to meet chip package interaction requirements.
• Drive materials characterization from both package and die components to understand chip package interaction mechanism using TMA, DMA, nanoindentation, and packaging mechanical and thermal stress stimulus.
• Drive novel solutions with silicon design and product teams to recommend the optimum package solutions to meet electrical, mechanical (1st, 2nd, and 3rd level interconnect), thermal, reliability, cost, and other system level requirements.
• Interface closely with multi-functional team that include Product Development, Wafer Level Process, Assembly, Test, Manufacturing and Global Quality and manage the product/package to mass production.

Requirements:

• Bachelor/Masters of Science in physics, materials, mechanical, chemical, or electrical engineering. MS or PhD preferred
• 5+ years of relevant experience in semiconductor manufacturing or a related field, with hands-on experience in semiconductor packaging or Frontend processes, specifically in technology on
• Appreciation for Structured Problem Solving
• Ability to interpret die-, package-, and system-level design and simulation (thermal/mechanical/electrical) methodologies and results
• Knowledge in Chip Package Interaction (CPI)
• Experience and working knowledge with 2.5D/3D heterogeneous integration technologies such as WLFO, SoIC, CoWoS, WoW, InFO, and other chiplet/SiP architectures is a plus
• Experience with wafer bumping, package assembly, substrate technology, BOM selection, testing and product development lifecycle
• Excellent communication skills with the ability to convey complex technical concepts to both technical and non-technical partners
• Demonstrated leadership experience in guiding multi-functional teams and driving technical excellence

Keen on the role? Apply now!

Summary:

• Basic up to $3800
• AWS + Variable bonus
• Location: Buona Vista
• 5 days work week @ 8.45am - 5.30pm
• Fresh grad is welcomed to apply

Key Responsibilities:

• Utilise 3D CAD design tools and perform high precision 3D printing (FDM & DLP)
• Utilise basic microcontrollers boards such as Arduino, ESP32 or STM32 to build simple circuit boards
• Testing and assembly of electronics and mechanical parts and debugging of software
• Familiar with maintenance of laboratory inventory and laboratory administrative tasks (Preventive maintenance / safety matters)
• Administrative works, such as ordering and payment with SAP system
• Other relevant ad-hoc duties

Key Requirements:

• Min Nitec in bioengineering, biophysics, physics, mechatronics, electrical / mechanical engineering, computer engineering and etc
• Basic experience in 3D CAD design

Interested applicants, please submit your updated resume in MS Words / PDF format by using the APPLY NOW BUTTON.

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Please be informed that only shortlisted candidates will be notified.

Your recruiter for this job: Stella

WhatsApp me @ 8772 4117 for a prompt response to your enquiry!

Stella Aw Yong See Hui | R24121552

Recruit Now Singapore Pte Ltd | EA No: 21C0845

Main Responsibilities / Critical tasks

• Responsible to assist in the design of controls system and programming coding to meet the budget and time expectations as defined by Project Manager
• Able to Modify controls design and other documents according to the Mikron Processes & Standards and compliance to industry standards as according to customer URS.
• Develop specific program per customer and project requirements based on Mikron Coding Standard.
• Participate in controls and validation activities, conduct test and debug, internal buy-off, FAT and SAT.
• Work together with the Customer, Project Manager, Assistant Project Manager, Process Manager, Design Engineers and other project team members as required.
• Communication with Customer as per project requirements.
• Collaborate with suppliers as needed.
• Update PCT and task completion accordingly

Skills and knowledge requirements:

• Education: Bachelor’s degree/diploma in engineering or equivalent; or at least 5 years related experience and/or training; or equivalent combination of education and experience.
• Minimum 3 years of related work experience.
• Must be able to travel as requested
• Ability to make sound decisions, work independently and within a team structure
• Ability to function in a fast-paced work environment
• Well organized and respectful of project deadlines
• Ability to communicate in an open, clear, precise and effective manner with customers, peers and all levels of management
• Knowledge in Allen Bradley and Siemens-S7 programming.
• Computer skills including intermediate to advanced Microsoft Office Tools (Outlook, Word, PowerPoint) and Excel spreadsheet experience; Microsoft Project; Design software; Internet software; Manufacturing software and SQL/Dbase Database software.

Hardware Engineer

Responsibilities:

• Develop of real time embedded systems
• Able to execute development project independently throughout the development implementation and manufacturing process
• Perform debugging, testing and improvement of current products
• Provide in-house/on-site technical support, documentation and technical training

Requirement:

• Degree in Embedded system/Electronics/Electric or equivalent
• Experience in Electronic hardware design inclding circuit analysis, IO interface to microprocessor and component selection for the performance enhancement on current and new product
• Experience in PCB schematics and artwork layout is highly preferred
• Experience in C and Assembly language programming

In Schneider Electric everything we do promotes progress and sustainability for all — our colleagues, customers, partners, and the communities and societies where we live and work. From the products, software, and services driving the digital transformation of energy management and automation to corporate citizenship and volunteer activities, we make an impact by helping people and organizations become more resilient and efficient, more electric and digital.

Which is where you come in. Working at Schneider Electric means working toward a cleaner, better world. You're part of a global team built on inclusion, mastery, purpose, action, curiosity, and teamwork, turning sustainability ambitions into actions.

We are looking for Service Tender Engineer (Power System) to make an impact!

This position is accountable for preparing a response to the Request for proposal/Quotation on moderate size and complex Customer’s opportunity, from start to finish, so that the response offered the best Value Proposition. This includes reviewing the RFP/RFQ, determining the scope of works and tasks, determine the best product/equipment/software/services offers, liaising with factories and vendors, challenging the factories and vendors’ offer, costing and determining the market price level, working with various internal stakeholders, i.e. opportunity leader, business leader, project management, engineering, solution purchaser, legal, contract management, solution risk management, analyze risk and opportunities etc. To prepare/revise the offer till the closure of the opportunity, attend and support bid clarification with the opportunity leader, organized Contract Review as well as hand-over package to the project management team. This position is expected to be self-driven, taking ownership and initiative to complete the require task within the timeframe agreed with the Opportunity Leader.

What you will do:

• Take ownership of the tender process and drive the submission of the Offer
• Analyze request for proposals (RFP)/ request for quotation (RFQ) from Customer and determining the scope of works and tasks
• Liaise with factory personnel in preparing proposal packages and advising on technical matters to prospective clients / consultants
• Ensure and comply to company tendering process
• Build techno-commercial proposals by using standard tools and processes and integrating validated data provided by technical and commercial support functions.
• Prepare costing as per requirements and complete submission of Offer within deadline.
• Understand risk analysis and apply into the offer.
• Ensure compliance of Solution Risk Policy and coordinate for approval
• Conduct contract review with the required stakeholders to ensure contract alignment.
• Prepare and handover of opportunity to Execution & Project Team

What qualifications will make you successful for this role?

• Degree/Diploma in Electrical/Power Engineering
• At least 2 years of relevant experience in Tendering process and good experience and strong knowledge in Electrical Distribution equipment, systems and solutions especially Medium Voltage Switchgear
• Knowledge of Electrical industry, EPC and customers’ base in various segments such as Oil & Gas, Utilities, Commercial Buildings and other segments
• Adaptability and Teamwork oriented mindset
• Customer focused mindset and fluent in English language.
• Good communication skills and previous Commercial or Project Management experience would be an advantage.

Job Description

The Applications Development Engineer role is within the product division that designs and manufactures inspection and review equipment for the semiconductor manufacturing industry. Based in Singapore, the Applications Engineer will be responsible for product penetration/adoption and process optimization at customer facilities in fabs.

This includes gaining expertise on KLA equipment and customers’ semiconductor fabrication processes and applying them to solve critically important production problems.

The role also includes training customers and other applications engineers, handling/driving local applications issue processes, investigating customer technical needs/problems and providing solutions, conducting final acceptance, demonstrating products, and understanding competitive situations, methodology, and performance group analysis.

Characterization of new systems and features includes crafting and conducting experiments, collecting data, and publishing results and recommendations in the form of application notes, best-known methods, or

characterization studies.

Minimum Qualifications

• Minimum Bachelor's Level Degree in Engineering and related work experience of 8 years.
• Work experience in semiconductor processing or the equipment industry is preferred.
• This role requires up to 70% travel on short notice, including extensive international travel and working with other global cultures.
• Teamwork is critical, so having a good balance between technical skills and people skills is important.

• Recognised degree in civil engineering, construction management or related field.
• Minimum 5 years of experience in construction planning and preferably in MRT or large scale infrastructure projects.
• Profeciency in construction progress planning, data analysis and using BIM software such as Primavera P6, AutoCAD, Navisworks, Power BI & etc.
• Strong understanding and knowledge of tunnelling and underground construction and cut and cover technigues.
• Proven ability to analyse critical paths, manage project timelines and adapt plan effectively.
• Monitor project progress and adjust plans as necessary to mitigate risks and meet deadlines.
• Preparation of progress reports by forecasting and identifying delays and bottlenecks.
• Familiarity with ERSS walls, pile extraction, contaminated ground, railway protection requirement, WSM and large diameter bored tunnels.
• Able to work under pressure and manage multiple priorities.
• Applicants are required to submit their detailed CV and indicate the current and expected salary.

Responsibilities:

• Performs the set-up, calibration, testing and troubleshooting of circuits, components, instruments and mechanical assemblies
• Determines and may develop test specifications, methods and procedures from blueprints, drawings and diagrams.
• Tests and troubleshoots assemblies and/or final systems. May complete rework on assemblies and/or systems as a result of testing.
• Prepares technical reports summarizing findings and recommending solutions to technical problems.
• May assist in the selection and set-up of specialized test equipment.

Requirements:

• Diploma or Bachelor Degree in Engineering.
• Ability to read technical drawings/procedures and use a variety of precision testing and measuring instruments.
• Previous hands-on experience with semiconductor equipment
• Experience with optics alignment will be adventagous
• Strong troubleshooting and analytical skills to resolve technical problems, set up experiments, and perform data analysis.
• Excellent communication, teamwork, and people skills are required.
• Comfortable working in shifts and cleanroom environment

# Risk Management & Project Management

# Network Migrations - LAN & WAN, Network security

# Experience in Data Centre Project

Job Description:

• Plan and execute data centre migration
• Oversee procurement of new servers and network equipment
• Manage data migration and verification processes
• Set up new Server Room compliant with Green Book standard
• Other ad-hoc tasks assigned
• 
  
• Diploma/Degree Holder and above
• At least 5 years of experience of handling ICT projects such as DC relocation etc
• Relevant IT certifications (eg. ITIL, CISSP, PMP) preferred

Send your cv to [email protected]