Job level: 15+ Years

Technical Skills:

SAS tools like SAS VIYA, SAS VA, SAS DI and other related technologies

Key Responsibilities:

· Overall experience of 15+ years with recent experience in Project Management implementing large-scale projects managing the end-to-end technical delivery, including scope, cost, quality, and time management; stakeholder communications; risk, issue, and dependency management; and project reporting and governance.

· Develop and maintain project plans, status reports, and other project-related documentation to ensure effective communication among stakeholders and project team members.

· Lead and mentor a team of developers, providing guidance and support throughout the project lifecycle.

· Collaborate with cross-functional teams, including business analysts, project managers, and other stakeholders, to ensure alignment and effective communication.

· Identify and mitigate risks and issues related to technical deliverables, proactively resolving any roadblocks to ensure project success.

· Ensure adherence to coding standards, best practices, and security guidelines across all development activities.

· Provide regular updates on project progress, highlighting key milestones, risks, and issues to relevant stakeholders.

· Contribute to the continuous improvement of development processes and methodologies.

· Conduct code reviews and provide constructive feedback to team members to ensure high-quality deliverables.

Key Requirements:

· Between 6-8 years of working experience in various SAS tools like SAS VIYA, SAS VA, SAS DI and other related technologies

· Working experience in any Credit Portfolio Management application / tool

· Certification in any SAS tool

· Good understanding and experience in Software Development Life Cycle

· Experience of working in a vendor environment

· Ability to work in a fast-paced, team-oriented environment

· A strong & assertive communicator in speaking & writing Analytical mindset and good problem-solving skills.

Good-to-have Skills

· Pre-sales experience

· Experience in writing Test Plans, Test Scripts, Test cases for SAS applications

· L3 Support experience

Job level: 15+ Years

Technical Skills:

SAS tools like SAS VIYA, SAS VA, SAS DI and other related technologies

Key Responsibilities:

· Overall experience of 15+ years with recent experience in Project Management implementing large-scale projects managing the end-to-end technical delivery, including scope, cost, quality, and time management; stakeholder communications; risk, issue, and dependency management; and project reporting and governance.

· Develop and maintain project plans, status reports, and other project-related documentation to ensure effective communication among stakeholders and project team members.

· Lead and mentor a team of developers, providing guidance and support throughout the project lifecycle.

· Collaborate with cross-functional teams, including business analysts, project managers, and other stakeholders, to ensure alignment and effective communication.

· Identify and mitigate risks and issues related to technical deliverables, proactively resolving any roadblocks to ensure project success.

· Ensure adherence to coding standards, best practices, and security guidelines across all development activities.

· Provide regular updates on project progress, highlighting key milestones, risks, and issues to relevant stakeholders.

· Contribute to the continuous improvement of development processes and methodologies.

· Conduct code reviews and provide constructive feedback to team members to ensure high-quality deliverables.

Key Requirements:

· Between 6-8 years of working experience in various SAS tools like SAS VIYA, SAS VA, SAS DI and other related technologies

· Working experience in any Credit Portfolio Management application / tool

· Certification in any SAS tool

· Good understanding and experience in Software Development Life Cycle

· Experience of working in a vendor environment

· Ability to work in a fast-paced, team-oriented environment

· A strong & assertive communicator in speaking & writing Analytical mindset and good problem-solving skills.

Good-to-have Skills

· Pre-sales experience

· Experience in writing Test Plans, Test Scripts, Test cases for SAS applications

· L3 Support experience

The division facilitates research collaboration agreements with partners and manages the adoption of research outputs by identifying, protecting, and licensing project IP to the industry.

The candidate will report to Director of the division. S/he is responsible for managing Technology Transfer for the university, namely, managing the Intellectual Property (IP) portfolio arising from research output. The job scope includes drafting and negotiation of research and licensing agreements, educating and creating awareness of intellectual property to academic staff, protecting and valuing the IP, structuring and negotiating IP licensing deals, conduct market landscape analysis as well as managing IP database and analysis.

Responsibilities

• Regularly review, update and formulate Intellectual Property Policy to evolve with progress of the university and industry feedback
• Develop and regularly review IP licensing strategies, licensing structure and guidelines to maximise adoption of research output
• Structure and negotiate contracts, such as research collaboration and IP licensing agreements
• Perform prior art searches, including liaise with external IP firms on IP searches and filings
• Assess value of IP, structure and negotiate on IP licensing deals
• Develop and manage an IP Management System
• Conduct market landscape analysis to identify and engage research collaborators and potential licensees
• Generate statistical reports with analysis on the impact of research output
• Create IP awareness and education, as well as provide IP advisory to academic staff and colleagues; and
• Work on strategic cross-divisional initiatives and University-wide planning
• Any other responsibilities

Requirements

• Strong knowledge with minimum of 10 years of relevant experience in Intellectual Property (IP) Management;
• Recognised IP-related qualifications or legal qualifications with experience in managing IP;
• Experience in managing collaboration agreements and licensing negotiations;
• Enjoy working closely with industry, academic staff and students in an Institute of Higher Learning;
• Strong leadership qualities, and self-motivated to improve processes and solve problems;
• Able to multi-task and work in a fast-moving environment;
• Possess strong analytical skills, strategic thinking and an eye-for-details; and
• Have good persuasive writing, communication and interpersonal skills.

Interested candidates are invited to submit their MS Word formatted CV with the current and expected salary remunerations.

• JonDavidson Pte Ltd • EA Lic-22S1412 • MOM Reg No-R1440770 •

Advance Packaging Integration – Senior Engineer (Package Development Engineering, Silicon Technology Package Integration) (PDE STPI)

We are looking for a Package Silicon Integrator in Package Development Engineering (PDE) Senior Engineer who will lead and drive Micron’s Packaging Technology Development Projects meeting Time to Market (TTM) business unit needs as well as meeting performance targets for Thermal, Electrical, Mechanical, Reliability and Cost. You will collaborate with Micron’s multi-functional team that include Product Development, Wafer level process, Assembly, Test, Manufacturing and Global Quality. Together, we will be responsible for the designing Test Vehicle Development Strategy, and execution to definition, development, and delivery of state-of-the-art product/packages that will shape the future of advanced computing, automotive and mobile products.

Responsibilities will include, but are not limited to:

• Drive package technology integration activities for the silicon test chip development projects and support NPIs to keep roadmap items on track to meet “go to market” timelines.
• Coordinate core team in Development and NPI space of advanced 2.5D/3D packages and standard packaging to drive material and BOM choices, body sizes, manufacturability, and package constructions to achieve acceptable Design for Manufacturing (DFM) and Design for Reliability (DFR) requirements.
• Evaluate wafer design inclusive of bondpad, scribe, pillars/bump and polyimide, and drive materials and BOM choices such as die thickness and mold compound to meet chip package interaction requirements.
• Drive materials characterization from both package and die components to understand chip package interaction mechanism using TMA, DMA, nanoindentation, and packaging mechanical and thermal stress stimulus.
• Drive novel solutions with silicon design and product teams to recommend the optimum package solutions to meet electrical, mechanical (1st, 2nd, and 3rd level interconnect), thermal, reliability, cost, and other system level requirements.
• Interface closely with multi-functional team that include Product Development, Wafer Level Process, Assembly, Test, Manufacturing and Global Quality and manage the product/package to mass production.

Requirements:

• Bachelor/Masters of Science in physics, materials, mechanical, chemical, or electrical engineering. MS or PhD preferred
• 5+ years of relevant experience in semiconductor manufacturing or a related field, with hands-on experience in semiconductor packaging or Frontend processes, specifically in technology on
• Appreciation for Structured Problem Solving
• Ability to interpret die-, package-, and system-level design and simulation (thermal/mechanical/electrical) methodologies and results
• Knowledge in Chip Package Interaction (CPI)
• Experience and working knowledge with 2.5D/3D heterogeneous integration technologies such as WLFO, SoIC, CoWoS, WoW, InFO, and other chiplet/SiP architectures is a plus
• Experience with wafer bumping, package assembly, substrate technology, BOM selection, testing and product development lifecycle
• Excellent communication skills with the ability to convey complex technical concepts to both technical and non-technical partners
• Demonstrated leadership experience in guiding multi-functional teams and driving technical excellence

Keen on the role? Apply now!

Advance Packaging Integration – Senior Engineer (Package Development Engineering, Silicon Technology Package Integration) (PDE STPI)

We are looking for a Package Silicon Integrator in Package Development Engineering (PDE) Senior Engineer who will lead and drive Micron’s Packaging Technology Development Projects meeting Time to Market (TTM) business unit needs as well as meeting performance targets for Thermal, Electrical, Mechanical, Reliability and Cost. You will collaborate with Micron’s multi-functional team that include Product Development, Wafer level process, Assembly, Test, Manufacturing and Global Quality. Together, we will be responsible for the designing Test Vehicle Development Strategy, and execution to definition, development, and delivery of state-of-the-art product/packages that will shape the future of advanced computing, automotive and mobile products.

Responsibilities will include, but are not limited to:

• Drive package technology integration activities for the silicon test chip development projects and support NPIs to keep roadmap items on track to meet “go to market” timelines.
• Coordinate core team in Development and NPI space of advanced 2.5D/3D packages and standard packaging to drive material and BOM choices, body sizes, manufacturability, and package constructions to achieve acceptable Design for Manufacturing (DFM) and Design for Reliability (DFR) requirements.
• Evaluate wafer design inclusive of bondpad, scribe, pillars/bump and polyimide, and drive materials and BOM choices such as die thickness and mold compound to meet chip package interaction requirements.
• Drive materials characterization from both package and die components to understand chip package interaction mechanism using TMA, DMA, nanoindentation, and packaging mechanical and thermal stress stimulus.
• Drive novel solutions with silicon design and product teams to recommend the optimum package solutions to meet electrical, mechanical (1st, 2nd, and 3rd level interconnect), thermal, reliability, cost, and other system level requirements.
• Interface closely with multi-functional team that include Product Development, Wafer Level Process, Assembly, Test, Manufacturing and Global Quality and manage the product/package to mass production.

Requirements:

• Bachelor/Masters of Science in physics, materials, mechanical, chemical, or electrical engineering. MS or PhD preferred
• 5+ years of relevant experience in semiconductor manufacturing or a related field, with hands-on experience in semiconductor packaging or Frontend processes, specifically in technology on
• Appreciation for Structured Problem Solving
• Ability to interpret die-, package-, and system-level design and simulation (thermal/mechanical/electrical) methodologies and results
• Knowledge in Chip Package Interaction (CPI)
• Experience and working knowledge with 2.5D/3D heterogeneous integration technologies such as WLFO, SoIC, CoWoS, WoW, InFO, and other chiplet/SiP architectures is a plus
• Experience with wafer bumping, package assembly, substrate technology, BOM selection, testing and product development lifecycle
• Excellent communication skills with the ability to convey complex technical concepts to both technical and non-technical partners
• Demonstrated leadership experience in guiding multi-functional teams and driving technical excellence

Keen on the role? Apply now!

Job Responsibilities:

1. Responsible for developing and maintaining overseas recruitment channels, and maintaining good relationships with overseas human resource suppliers, headhunting companies, human resource channels, etc.

2. Familiar with business employment standards and needs to ensure that outstanding talents that meet the company culture and job requirements are attracted;

3. Responsible for interview arrangements, background checks, employment notices, entry procedures, etc. for domestic and international talents;

4. Analyze recruitment data and funnels to improve recruitment effectiveness;

5. Regularly report the progress and results of recruitment work to superiors to provide reference for company decision-making.

Qualifications:

1. Bachelor degree or above, more than 2 years of recruitment experience;

2. Those with ITO recruitment experience and headhunting work experience are preferred;

3. Fluent English speaking ability, other language skills will be considered as additional advantages; those with overseas study and work experience are preferred;

4. Excellent communication and interpersonal skills, able to communicate effectively with candidates from diverse backgrounds and cultural backgrounds.

Responsibilities:

• Install, test, commission, and conduct preventive and corrective maintenance (PM & CM) on healthcare equipment/systems.

• Address and resolve recurring issues promptly to ensure consistent customer satisfaction.

• Plan and schedule PM or CM tasks efficiently.

• Provide post-sales support as needed.

• Coordinate with manufacturers, vendors, contractors, and clients for project management.

• Assist the project team in executing projects smoothly.

• Respond promptly to service calls.

• Collaborate with team members to gather feedback and identify prospects.

• Undertake any additional tasks as assigned.

Requirements:

• NITEC/Diploma in Electrical/Electronic/Biomedical Engineering or equivalent.

• Proficient in using software-assisted technical service diagnostic and testing equipment.

• Minimum of 2-3 years' relevant experience preferred; fresh graduates with a keen learning attitude are encouraged to apply.

• Strong interpersonal skills and customer service orientation.

• Good command of English and familiarity with Microsoft Office and IT tools.

• Self-motivated, diligent, and reliable.

• Possession of a valid driving license is advantageous.

• Able to work independently as well as part of a team.

• Fluent in both spoken and written English.

About Nanowall Technology Pte Ltd

Founded in Singapore in 2013, Nanowall Technology specializes in high-tech cleaning solutions, including precision cleaning, nano-impregnation, and protective nano-coating. As a one-stop provider since 2019, we offer expertise in chemistry, processes, equipment, supply chain management, and materials. Our management team brings over 20 years of experience and maintains extensive partnerships with institutions, universities, and commercial partners globally. We serve industries such as mobile phones, hard disk drives, semiconductors, EVs, and medical instruments in China and Southeast Asia. We leverage innovative technologies like the NW-ELPIS solvent-based vacuum precision cleaning system and nano-impregnation solutions.

Key Responsibilities

Sales

• Cooperate with the Business Development unit to work on the target customers and sales targets within the assigned territories: China, Singapore, Malaysia, Thailand, the Philippines, Indonesia, and Vietnam.
• Develop and implement effective sales strategies with distributors in each country.
• Conduct sales analysis to understand trends and provide accurate sales and inventory forecasts.
• Prepare quotations and tender documents as necessary.
• Have a good understanding of Nanowall’s target market and effectively reach out to promote products and achieve monthly sales targets.
• Build and maintain strong relationships with clients and distributors.
• Conducted product and sales training for distributor staff.
• Address and manage product complaints.
• Identify and establish relationships with new customers who can benefit from Nanowall’s products and services.
• Identify and report on business opportunities within target markets.

Marketing

• Execute marketing plans and strategies, ensuring successful implementation.
• Perform market surveys and product evaluations and gather competitor and customer feedback for continuous product improvement.
• Organize promotional activities, including workshops, product presentations, and trade exhibitions.
• Collaborate with Regulatory Affairs Specialists to ensure compliance and qualification of new products.

Job Requirements

• Proven experience in regional sales, preferably within sectors relevant to electronics and technology (e.g., precision cleaning, semiconductor, EV, or related industries).
• Familiar with solvent cleaning and nanocoating will be an added advantage.
• Strong willingness to learn and grow with the company over the long term.
• Demonstrates a proactive attitude, committed to mastering the company’s product knowledge.
• Excellent communication skills to interact effectively with distributors, clients, and internal stakeholders.
• Availability for regional business trips
• Analytical skills for market surveys and sales analysis are an added advantage.
• Experience in organizing promotional activities and managing product complaints is a plus.

At Nanowall Technology, we are committed to innovation and excellence in high-tech cleaning solutions. Join a dynamic team where you can grow your career while contributing to cutting-edge advancements in precision cleaning and nano-coating technologies. As part of our team, you will have opportunities to engage with leading clients in rapidly growing industries and significantly impact the region.

Interested candidates are invited to submit your resumes and cover letters detailing your qualifications and experience relevant to the role. We look forward to welcoming dedicated and enthusiastic individuals to our team!

Roles & Responsibilities

• Attending to all service calls
• Order processing
• Preparation of delivery orders & invoices
• Tracking of orders/shipment
• Preparation forwarding shipper documentation and packing
• Retrieve company emails, print and file the important information
• Correspondence of fax and email
• Monitoring of tenders at designated website
• Assisting in preparation of quotation & tender submission
• Assist in keeping track of the office policies and procedures
• Assist in preparing simple correspondences

Requirements:

-Min. Education Level: GCE ‘O’ / ‘A’ Level / NITEC/ Diploma or equivalent

-2 to 3 years work experience

-Knowledge in accounting software or similar and MS office.

-Hardworking, meticulous, and able to work independently

Key Responsibilities:

• Provide comprehensive daily administrative support including but not limited to scheduling, meeting coordination, document management, and travel arrangements.
• Act as a liaison for internal and external communications, ensuring accurate and timely information flow and follow-up.
• Assist in the scheduling and organizing of meetings, including booking conference rooms, preparing materials, taking minutes, and following up on actions.
• Manage day-to-day tasks and projects delegated by the department, ensuring all work is completed on time.
• Handle the reception of clients, partners, and other visitors if needed, arranging necessary meetings and hospitality activities.
• General administrative support, including filing, stamping, and document management.
• Assist department payment schedule, and daily reimbursement.
• Perform other temporary tasks as assigned by the department.

How you can stand out:

• Bachelor’s degree or above, preferably in Administration, Business Management, English, or related fields.
• Excellent written and spoken communication skills in both English and Chinese, with the ability to handle bilingual documents and communication effectively.
• Proficiency in office software (e.g., Microsoft Office Suite), with strong information management and document processing skills.
• Outstanding interpersonal and coordination skills, with the ability to work efficiently.
• Highly meticulous with strong time management and multitasking abilities.
• High sense of responsibility and professional ethics, with the ability to adapt to urgent tasks and a fast-paced work environment.

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Desiwe is committed to providing equal employment opportunities in accordance with country, state, and local laws. Desiwe does not discriminate against employees or applicants based on conditions such as race, colour, gender identity and/or expression, sexual orientation, marital and/or parental status, religion, political opinion, nationality, ethnic background or social origin, social status, disability, age, indigenous status, and union.

Job Summary:

You will be responsible for creating sales opportunities through specification of ADLINK product solutions, so as to achieve profitability and growth in market share. Additionally, you will assist to advice and support the sales team in terms of product’s applications.

Job Responsibilities:

• Understand customer’s technical needs and project specifications, ensure client’s needs and expectations are attainable and realistic, in relation to the product solutions that we offer.
• Attend customer’s meetings, and to present technical solutions to potential customers.
• Expected to facilitate workshops and trainings for customers and internal staffs, whenever necessary.
• ·Also expected to provide pre- and post- sales technical support and product demonstration as and when necessary.
• Advice and support the sales team on the selection of suitable products, technical assistance, and product strategies to win more businesses.
• ·Work effectively as a part of a team to achieve individual, team and departmental objectives, sharing knowledge and skill as appropriate.
• Maintain a sound technical/ application knowledge base on all ADLINK product solutions.

Job Requirements:

• Diploma/Degree in Electronics / Electrical / Software Engineering.
• Minimum 3-5 years of working experiences.
• Possess good knowledge of Embedded Computing, Automation, Test & Measurement applications and solutions.
• Proficient knowledge of VB, VC++, C# Programming languages.
• Able to debug PC-based Automation Control, Test & Measurement peripheral card issues.
• Meticulous, Well organize and good working attitude
• Disciplined, independent and able to perform under pressure.
• Willing to travel within short notice e.g., Training, Trade shows, etc.

Duties :

1. Prepare and give pre-sales technical assistance and after sales support to customers

2. Communicate with the team to understand customer demands and offer sales support where necessary

3. Secure orders, ensure product standards and timely fulfilment of orders

4. Establish customer rapport and acceptance

5. Help customer to solve problems with product usage

6. Recommend new and improved products to customers and explain how product will be more cost effective

7. generate Sales leads, cold call, follow up with customer enquiries

Requirements :

1. Reliable technical background

2. Ability to work with others as a team

3. Ability to build customer relationships easily

4. Analytical ability and great problem-solving skills

5. Presentation skills and ability to convey product value

6. Self-confidence to support persuasion and sales efforts

7. Possess drive and self motivated

8. Diploma/ITE in Engineering (preferably in Mechanical Engineering)

9. 1-2 years experience through fresh graduate are welcome

Job description can include a variety of tasks, such as:

• Communication: Answering and redirecting phone calls, taking messages, and liaising with suppliers, contractors, and other departments
• Scheduling: Managing diaries, scheduling meetings, and booking rooms
• Travel and accommodation: Arranging travel and accommodation
• Office supplies: Ordering office supplies and consumables for office equipment
• Information management: Preparing, organizing, and storing information in paper and digital form
• Correspondence: Typing up letters and reports, and preparing correspondence
• File management: Filing electronic and paper copies
• Data entry: Updating computer records using a database
• Meeting minutes: Taking minutes at meetings
• Project management: Tracking deadlines and facilitating communication
• Accounting: Handling expense reporting, invoicing, and basic accounting tasks

Job requirement:

• Able to work well with others
• Able to work on your own.
• Sensitivity and understanding.
• Flexible and open to change.
• Excellent verbal communication skills.
• Customer service skills.
• Able to use a computer and the main software packages competently.
• Lauguage: English and Mandarin
• Be thorough and attentive to details

Job Title: Project Manager

Location: Singapore; APAC Region (Thailand, Indonesia, Malaysia)

About Freyr Technology:

Freyr Technology, founded in 2021, specializes in cutting-edge fields such as XR and AI, with business operations spanning the APAC region. As partners with industry leaders such as NVIDIA, we aim to revolutionize the digital landscape through innovative technologies and strategic investments across Southeast Asia.

We are seeking an experienced Project Manager to join our team. In this role, you will lead GPU cloud project deliveries, manage compute cluster construction, and evaluate technical solutions. You will collaborate closely with internal business and technical teams while engaging with external clients and product suppliers to ensure successful project execution and risk management.

Responsibilities:

• GPU Cloud Project Delivery: Oversee the implementation and delivery of GPU cloud projects and compute cluster construction.
• Technical Evaluation: Conduct technical solution reviews to ensure quality and feasibility.
• Internal Collaboration: Coordinate with internal business and technical teams to develop and refine industry-specific business scenarios and delivery models for application within the organization.
• External Communication: Act as the primary liaison between external clients and product suppliers to manage project timelines, mitigate risks, and ensure delivery quality.
• Best Practice Development: Explore and document industry-leading practices for delivery models and apply them to improve team processes.

Qualifications:

• Experience: At least 3 years of experience in cloud computing or related industries, with a track record of delivering medium to large-scale cloud and compute cluster projects.
• Certifications: PMP certification and experience with major cloud providers’ project solutions and delivery processes are preferred.
• Technical Expertise: Familiarity with mainstream enterprise cloud architectures, compute cluster solutions, and best practices for project delivery.

Skills:

• Strong project delivery and coordination capabilities.
• Excellent learning ability, communication, and logical thinking skills.
• A strong sense of responsibility, service awareness, and stress management skills.
• Team Building: Proven ability to develop internal project delivery capabilities and translate business scenarios into effective delivery practices.

As a PDE Central Process Integration Principal Engineer, you will lead the development and integration of assembly and packaging processes for cutting-edge semiconductor products, such as DRAM, NAND, controllers, graphics, 3D-stacked (3DS) technologies, and High Bandwidth Memory (HBM). The ideal candidate will drive innovation in packaging technology and ensure seamless process integration during new product introductions.

This position involves working closely with multi-functional teams to research, design, and implement new packaging solutions while optimizing production yields and ensuring the successful commercialization of next-generation semiconductor technologies.

JOB RESPONSIBILITIES

Promote worldwide synergy

• Improve benchmark performance and efficiency gains through global project management and execution
• Network BKM leveraging and enhancement, business process creation and re-engineering
• Maintain a strong and open relationship with peer group and managers in other functional areas within central team and outside in areas such as Sites, TD, Product Engineering, Global Quality
• Help drive and fix the issue where necessary

Drive FE-AT Integration initiatives

• Business process governance between Fab – Assembly (WSPEC, FE2BE forum, WPSWAT)
• Lead & drive FE-AT excursions
• Yield, DPM related issues that involves both Fab – Assembly

Cross sites benchmark & achieve BIC yield performance

• Lead PI programs, PI Loop taskforce and/or team in network to address yield and quality challenges, optimize process flow

Identify, Propose & Drive new initiatives programs

• Propose & lead strategic programs to shift left/ shorten cycle learning across TN phase (PD, NPI, HVM)
• Process flow simplifications & standardizations
• Cross technology streamline (Process, tools, etc)
• Sites expansions process & qualification requirements
• Drive roadmaps with multi-functional teams (FE, AT Procurement, APTD, APPDE)

JOB QUALIFICATIONS

• Bachelor's degree in Engineering (Electrical, Mechanical, Materials Science, or related field).
• 3+ years of experience in semiconductor packaging technology development, process integration, or new product introduction (NPI)
• Strong background in frontend fabrication processes (FAB)
• Proven experience in data analysis, statistical process control (SPC), and process optimization.
• Strong problem-solving skills, attention to detail, and a proactive approach to technology development.
• Excellent communication and teamwork skills, with the ability to work across departments and with external partners.
• Hands-on experience in the development and implementation of cutting-edge semiconductor packaging technologies.
• Experience leading multi-functional teams in process development, technology transfer, and ramp-up.
• In-depth knowledge of the latest industry standards and trends in semiconductor packaging and assembly.

As a PDE Central Process Integration (PI) Senior Engineer, you will lead the development and integration of assembly and packaging processes for cutting-edge semiconductor products, such as DRAM, NAND, controllers, graphics, 3D-stacked (3DS) technologies, and High Bandwidth Memory (HBM). The ideal candidate will drive innovation in packaging technology and ensure seamless process integration during new product introductions.

This position involves working closely with multi-functional teams to research, design, and implement new packaging solutions while optimizing production yields and ensuring the successful commercialization of next-generation semiconductor technologies.

JOB RESPONSIBILITIES

Promote worldwide alignment

• Improve benchmark performance and efficiency gains through global project management and execution
• Network BKM leveraging and enhancement, business process creation and re-engineering
• Maintain a strong and open relationship with peer group and managers in other functional areas within central team and outside in areas such as Sites, TD, Product Engineering, Global Quality
• Help drive and fix the issue where necessary

Drive FE-AT Integration initiatives

• Business process governance between Fab – Assembly (WSPEC, FE2BE forum, WPSWAT)
• Lead & drive FE-AT excursions
• Yield, DPM related issues that involves both Fab – Assembly

Cross sites benchmark & achieve BIC yield performance

• Lead PI programs, PI Loop taskforce and/or team in network to address yield and quality challenges, optimize process flow

Identify, Propose & Drive new initiatives programs

• Propose & lead strategic programs to shift left/ shorten cycle learning across TN phase (PD, NPI, HVM)
• Process flow simplifications & standardizations
• Cross technology streamline (Process, tools, etc)
• Sites expansions process & qualification requirements
• Drive roadmaps with multi-functional teams (FE, AT Procurement, APTD, APPDE)

Requirements

• Bachelor's degree in Engineering (Electrical, Mechanical, Materials Science, or related field).
• 3+ years of experience in semiconductor packaging technology development, process integration, or new product introduction (NPI)
• Strong background in frontend fabrication processes (FAB)
• Proven experience in data analysis, statistical process control (SPC), and process optimization.
• Strong problem-solving skills, attention to detail, and a proactive approach to technology development.
• Excellent communication and teamwork skills, with the ability to work across departments and with external partners.
• Hands-on experience in the development and implementation of cutting-edge semiconductor packaging technologies.
• Experience leading multi-functional teams in process development, technology transfer, and ramp-up.
• In-depth knowledge of the latest industry standards and trends in semiconductor packaging and assembly.

Keen on the role? Apply now!

Responsibilities:

• Maintain and update daily production reports.
• Perform accurate data entry for production reports.
• Verify and receive incoming shipments.
• Prepare purchase orders and ensure timely delivery.
• Handle other administrative duties as assigned.

Requirements:

• 1-2 years of relevant working experience.
• Strong communication and interpersonal skills.
• Able to start work on short notice.
• Great multitasking abilities.

Other Information:

• Work Schedule: 5-day work week (8:00 AM - 5:30 PM).
• Location: Woodlands.
• Transport: Complimentary transport provided from Woodlands MRT.

MOM Licences No: 02C5465

EA Personnel Registration No: R24125030

Responsibilities:

• Oversee and able to control group of inspection, leveraging on your manufacturing and QC experience.
• Apply knowledge of QC sampling techniques and operate measuring instruments effectively.
• Conduct QC sampling inspections to ensure compliance with quality standards.
• Prepare samples and perform quality testing as required.

Requirements:

• 1-2 years of relevant working experience in quality control or a related field.
• Strong communication and interpersonal skills.
• Ability to multitask and work in a fast-paced environment.

Other Information:

• Work Schedule: 5-day work week (8:00 AM - 5:30 PM)
• Location: Woodlands.
• Transport: Transport provided from Woodlands MRT

MOM Licences No: 02C5465

EA Personnel Registration No: R24125030

Job description

What will you be doing?

• Develop Applications using Elixir Ambience (Low code Development platform) and other 3rd party tools. Elixir Ambience modules include - ETL, Form Builder, Workflow, Dashboard etc.
• Write custom codes to Integrate External API with Elixir Ambience (Scala, Java, Js)
• Produce technical documentations such as Software Design Document
• Beside the project team, work with Infrastructure team ( internal or external )to setup the different environment such as UAT and PROD
• Be part of System Integration Testing (SIT) & User Acceptance Testing (UAT)
• Support application training for users

Who are we looking for?

• Strong problem-solving, analytical and communication skills
• Experience with Agile and Scrum development methodologies / software development life cycle (Preferred)
• Demonstrate how they can balance perfectionism and pragmatism, balancing speed, maintainability, performance and cost.
• Ability to learn quickly and work independently or as part of a team
• Provide technical feedback to project lead to manage expectations of customers or IT team during requirement gathering, with the desire to simplify instead of making things more complex to meet the business requirements
• Has a healthy sense of skepticism over their own codes and able to debug and test their own codes extensively
• Resourceful and self-driven to pick up new knowledge and skills to stay ahead of technology changes
• Demonstrated good teamwork and positive attitude in meeting project deadlines

Background / Competencies and Skills

• Diploma in Computer Science/ Information Technology or equivalent.
• Well-versed in Java, .NET, JavaScript/HTML5/CSS, SQL, Scala and general software development lifecycle and best practices.
• Understanding of NoSQL Database Architecture & Web Development
• Knowledge of APIs and experience of software integration
• Methodical and good writing skills for documentation purpose

As part of any recruitment process, we collect and processes personal data relating to job applicants. We are committed to being transparent about how we collect and use that data and to meeting our data protection obligations. By sending us your resume you agree to the collection, use and/or disclosure of your personal data in the manner as set out in our Data Protection Notice for Job Applicants.

Job description

• Experience in UVM verification methodology
• Experience in developing and deploying state-of-the-art verification methodologies in ever-increasing design complexities, from UVM, C/C++ co-simulation, system emulation to mixed-mode simulation & formal verification
• Disciplined, quality-minded, and highly driven for excellence,
• Excellent team player and good communication skills
• MSEE/BSEE in Electrical Engineering or Computer Engineering, with 3 years of relevant experience, but are open to fresh graduates with outstanding results
• Candidates with relevant experiences would be offered as Senior or Staff, taking on higher responsibilities

As a standard cell design engineer in the Physical Design Group, you will develop your skills working on some of the most sophisticated process nodes targeting the largest foundries. You will contribute to designing our physical IP standard cell offerings for our internal and external customers at leading edge nodes including 5nm and beyond. Work with partners inside the company, as well as our partners in the EDA and foundry space.

Responsibilities:

· Design standard cell circuits and verify them for functionality, performance, and power

· Generate and validate EDA model views of standard cells

Required Skills and Experience :

· 5+ years of relevant circuit design experience (for BSEE)

· 3+ years of relevant circuit design experience (for MSEE)

· Experience with transistor level circuit design using Cadence Virtuoso and circuit simulators such as SPICE, SPECTRE

· An understanding of transistor level device physics and standard cell layout

· Knowledge of power, performance, and area tradeoffs

· An ability to learn a wide variety of industry standard view and modeling formats such as Liberty, Verilog, LEF, NDM, APL, GDS

· Scripting skills in either Tcl, PERL or Python

· Dedication to quality, collaboration, curiosity and continual improvement

• Knowledge of submicron semiconductor technology
• Familiar with digital ASIC/SOC design flow from RTL to silicon characterization
• Familiar with Synopsys and Cadence EDA tools for Simulation, Synthesis, Timing (STA), Formal and Assertion based verification, etc.
• Familiar with design and programming languages: Verilog, System Verilog, Python, Perl, C, C++, etc.
• Familiar with code base management method including subversion, git, GitHub, etc.
• Ability to apply analytical and problem-solving skills
• Strong written and verbal communication skills, ability to negotiate design features and options
• Knowledge of embedded system design, verification, and product development lifecycle
• Deep knowledge and domain know-hows in one or more areas below is a big plus.

As an Accelerated Technology Package Development Engineering (ATPDE) Strategic Program Manager, you'll drive ATPDE's Engineering Strategy Programs in collaboration with Technical Experts and Senior Leaders within ATPDE, PDE, Global Assembly & Test, and Global Quality. This role demands strong project management, proficiency in MS suite, data analytics, dashboard/report creation, excellent English communication skills, people engagement, tenacity, resourcefulness and strategic vision to support Micron’s key initiatives.

Key Responsibilities

Lead strategic engineering initiatives by creating plans, setting achievements, and prioritizing tasks while maintaining consistent communication with partners. Predict risks and challenges, manage program prioritization and timelines, and balance business requirements against technical and operational limitations. Additionally, you must establish both quantitative and qualitative metrics to assess the effectiveness and efficiency of key programs, implement systems and processes, and oversee and drive programs to successful completion:

• Drive Accelerated Technology for PDE (ATPDE) Global network management to develop & implement strategic, process development, technode development and quality engineering programs that are aligned with PDE and Micron’s quality strategic objectives
• Structure and implement analysis to develop recommendations and drive execution / implementation in a fast-paced, data-driven environment.
• Identify continuous improvement opportunities in business process and cross-functional/regional quality functions
• Engage various partners from technical experts to senior leadership to facilitate and drive key strategic & quality engineering programs for ATPDE, PDE & global Assembly & Test network.
• Being able to apply project management skills to initiate, plan, implement, drive, and evaluate the project effectiveness
• Must have a strong data analytic skill, coding & script (phyton), dashboard (Power BI/ Tableau etc.) design and development skills
• Publish on-time weekly business reports.

Requirements

• Bachelors in any Engineering or Science (Data Analysis/Statistics) or related
• Experiences in Technology/IT project management
• Experiences in high technology or semiconductor industry
• Experiences working across time zones in multi-functional global teams
• Proficiency in data analysis, dashboard design and development (Power BI/Tableau, etc.), project management, and English communication
• Knowledge and experience in automation, product, or process engineering is advantageous.
• Strong project management skills
• Strong analytical skills and effective problem solvers, with ability to navigate ambiguity
• Excellent communicator, with the ability to manage and influence partners at all levels
• Strong sense of ownership and ability to work across different functions and Business Units
• High learning agility to quickly understand the value drivers in numerous and diverse types of strategic/ engineering programs/ projects
• Strategic partner engagement capabilities, including clear understanding of partners’ needs, problem statement, and value proposition discovery, various types of business/ engineering analysis (good-to-have)
• Someone who is excited about how their contribution, their value to the organization, can support to transform how the world uses information to enrich life for all with Micron’s memory and storage solutions
• Keen on semiconductor industry

Keen on the role? Apply now!

1. JOB DESCRIPTION

Job Title

Finance Manager

Occupation

FINANCE MANAGER

Job Description & Requirements

Responsibilities:

· Responsible for the company’s consolidation, reconciliation, budget & forecast, cost management, financial analysis and business activity reports

· Assist in preparation of materials and reports for Board, Audit and other Committee Meetings

· Assist in the financial year-end process which includes co-ordination with all company entities for reporting and the preparation of company financial statement

· Handle tax matters which would include the quarterly GST filing, corporate tax computation and transfer pricing compliance

· Monitor and report deviation of revenue and expenses including key value drivers

· Liaise with auditors, financial institutes, government agencies, company secretary, tax and accounting agents

· Any ad-hoc duties as assigned

Requirements:

· Bachelor’s Degree or professional qualification in Accounting

· At least 3-5 years of relevant working experience in audit/group consolidation of accounts

· Meticulous, Strong analytical skills and proficient in MS Office

· Good knowledge of Singapore Financial Reporting Standards

Responsibilities:

• Be the Hadoop Subject Matter Expert to engage with customers to provide technological solutions as well as operational improvement recommendations Hadoop infrastructure platforms & Hadoop eco-system incl. Linux & storage
• Lead the teams on technical directions for the different Hadoop platforms that run 24x7 and support customer critical production operations
• Major Incident support (service recovering & root cause troubleshooting) for Hadoop and Hadoop eco-system incl. Linux & storage related issues, including communications to senior management and customer.

· Required to get “hands-on” where needed and work along the technical team

· Support the Hadoop Platform with the tools OOZIE, Apache Ni Fi, Java & Unix must knowledge

· Well-versed knowledge on Network, Storage and API’s creation and debugging

· Knowledge on supporting the applications on Big data platform and Debugging knowledge of YARN

· Write/debug Python code for the designed frameworks

· Control the Hadoop clusters with proper access controls and apply the security with the tools Ranger, Kerberos

· Coordinate with product vendors to setup/configure infrastructure, network, nodes

· Write automation scripts for any alerts and monitoring dashboards from automation perspective with Python

· Maintaining and troubleshooting the Environment with Ambari

· Integrate Solution knowledge between Hadoop and Reporting tools like Tableau, MicroStrategy, SAS, HDF

· Solutioning different Disaster Recovery approaches for Bigdata

· Tuning and scaling up clusters with several proposals

· Migrating the HDP clusters to CDP cluster or to the Azure cloud

Skillset:

· Hadoop Hortonworks admin or support L3 Knowledge

· Cloudera data platform admin

· Hive /Hbase SQL Tuning for map reducer jobs

· Shell/ Python Scripting experience

· Certification CDP Administration

· Certification RedHat Linux Administration added advantage

· MySQL/postgreSQL knowledge

· VMware Virtualization knowledge preferred.

· Knowledge on Pure and Isilon storage, S3 file systems is added-advantage

· Must be able to engage with technical people but also with semi-technical senior stakeholders and customer’s application teams

Years of Experience:

7 to 12 years overall Experience and 5+ Years of Big data Engineering and Production support