Responsibilities:

• Prepare Product / Architectural / Mechanical drawings with AutoCAD / Solidworks.
• Work within stated procedures to ensure that design records/controls are maintained.
• Provide product technical support to customers / suppliers.
• Ensure Supplier’s Quality meet our Quality Standard.
• To Initiate / propose / participate in Quality Improvement.
• Take part in new product development.
• Other ad-hoc job assigned by the supervisor.

Requirements:

• Min Degree in Mechanical/Engineering or equivalent.
• Good understanding of Precision machining processes.
• Well versed with manufacturing process & good understanding of material specifications common to Ironmongery industry.
• Minimum 3 to 4 years experience in mechanical field or Ironmongery industry.
• Required language(s): English, Mandarin (to liaise with 90% Mandarin speaking customers - majority, and suppliers in regard to technical support).
• Well verse in Solidworks & AutoCAD Software.
• Responsible, mature, independent with a positive attitude and willingness to learn.

Additional Information

• Office Location: 141 Woodlands Industrial Park E 5, Woodland E-Terrace Singapore 757507.
• Working Hours: Mondays to Fridays (8:30am to 5:30pm), Alternative Saturdays (8:30am to 1:30pm)

For immediate consideration, please indicate the following information in your resume:

(a) Current and expected salary

(b) Earliest available date to commence work

Please note that qualified applicants who are immediately available will be given priority, and we regret that only shortlisted applicants will be notified.

Employing Carpenter for Carpentry workshop in Woodlands.

聘请木工投手，工厂在乌兰。

Carpenter（头手）

Monthly Salary（月薪）$2500-$3500

• Able to understand drawing (会看图）
• Able to fabricate Material and install （有经验，会开料和装橱）
• Able to work overtime, if required （愿意加班，如果需要）

Applicant with Class 3 license will be added bonus.

拥有3号执照更加分

As a Senior- level Device Engineer in Micron's Front End Central Process Integration Engineering (cPIE) team, you will co-work with the global Micron network on improving Device performance to meet product yield and quality requirements, through optimizing process steps, reducing device variability, optimizing design layout or test specs, and standardizing device engineering business process and working methodology. The primary focus could be either DRAM or NAND flash memory when needed.

Requirements:

• Bachelor's degree with a minimum 5 years of relevant working experience is required. Master's or Ph.D. degree in Physics or Engineering areas is preferred.
• Working experience in fab process or process integration or test engineering. Direct experience in CMOS or NAND/DRAM memory device engineering is preferable.
• Require proven knowledge in semiconductor physics and understanding of transistor operations, scaling limitations and reliability, basic knowledge of CMOS circuits and characterization methods. Experience in advance transistor architectures such as High-K metal gate or FinFET or GAA is preferred.
• Deep understanding of at least one semiconductor fabrication process area, including tool sets, process mechanism, tuning knobs, etc.
• Excellent data analysis skills using at least one software (JMP, SPOTFIRE, etc).
• Strong task ownership, self-motivated to work with other team members to make progress collaboratively.
• Open-minded attitude to learn new skills and could adapt to new working environment swiftly.
• Good communication skills. Proficient in English (speaking and written). Working-level communication capability in Mandarin Chinese OR Japanese is preferred.
• Good digital literacy with MS office. Programming capability such as Python is a plus.
• Occasional domestic and international business travel is required.

Job responsibility:

cPIE Device Engineer, responsible for product yield and quality improvement, by working collaboratively with Micron global network, to improve device performance, standardize business procedure and working methodology.

As a Senior Equipment Engineer/Equipment Engineer in the NTI, you will be expected to support R&D activities associated with rapid deployment of First-of-Kind equipment, the CIP hardware evaluations and managing on the timeline needed to deploy in current technode/next advance technode on time. Good team spirit and good collaborations working is needed with various stakeholders including (not limited to) facilities/fab support/Gas & Chemical/EHS/F4/F10/Central team etc with various equipment setup and improvement work necessitated thereof as well as to ensure extended engagement with F4 on the upcoming First-of-Kind equipment in upcoming technode. Expected to work independently with minimal direction and complete projects in a timely manner and achieve set objectives.

Responsibilities

• Leading the design, development and characterization of new tools and identifying and closing any hardware and procedural gaps.
• Innovate solutions that enable best in class performance
• Oversee installation and upgrades of tools ensuring quality of work, cost control and alignment to project schedule.
• Engage equipment vendors to improve current products and implement roadmap needs.
• Work with Process Engineers, Manufacturing, Procurement, and Vendor partners to develop a comprehensive package capable for our volume manufacturing sites.
• Generating and maintaining documents that outline equipment performance, operating procedures, maintenance specifications, and cost metrics.
• Support Internal And External Audits

Requirements:
• A minimum of 2-3 years of experience in the semiconductor industry in the area of equipment engineer roles.
• In-depth understanding of the equipment operation, working principles, troubleshooting and tool installation procedure is a must.
• Exposure to R&D equipment transfer and ability to develop/optimize equipment hardware design is preferred.
• Communications and collaboration with partners both locally and globally. Strict adherence to Micron Intellectual Property protection policy is a must.
• Self-motivated and adaptable to Micron’s fast paced, demanding and dynamic work environment; flexibility to work for extended hours, as required.
• Excellent oral and written communication skills with ability to convey the message clearly and sharply both locally and globally.
• Excellent ability to prioritize and manage multiple projects simultaneously; efficiently utilize available resources or seek peers’ and/or management help to get over the roadblocks to drive to solutions.
• Encourage and enforce safe, compliant behavior through periodic communications and the performance management process.

GJS for this position: E2 and above

Location: Fab10N

Closing Date: Until filled

Employing Assistant Carpenter for Carpentry workshop in Woodlands.

聘请木工中工，工厂在乌兰。

Carpenter（中手）

Monthly Salary（月薪）$2100-$3200

• With relevant carpentry experience （有木工经验）
• Willing to learn （愿意学习）
• Team work （团队精神）
• Able to work overtime, if required （愿意加班，如果需要）

Applicant with Class 3 license will be added bonus.

拥有3号执照更加分

About Us:

Micron is a global leader in memory solutions, groundbreaking transformative technology that shapes how the world uses information to enrich life for all. With a history spanning over 40 years, Micron has been instrumental in major technological advancements, providing efficient memory and storage systems for diverse applications. As the world transitions to an economy where data drive value creation, Micron plays a pivotal role, with data becoming the new business currency, and memory and storage are strategic differentiators that redefine how we extract value from data, enriching lives globally and redefining society. Micron is also committed to sustainable development, focusing on employee health and safety, environmental quality, and community support.

Main Responsibilities:

Reporting to the Senior Director, Supply Chain Optimization, you will play a pivotal role in optimizing end-to-end inventory and exceeding customer delivery performance expectations. This role is essential for uncovering rich and actionable inventory insights, ensuring working capital is accurately deployed, and delivering outstanding customer experience. You will lead global teams which are responsible for alignment of customer service level targets to demand segments, multi-echelon inventory optimization, cross functional facilitation to improve inventory health, disposition of impaired inventory, management of customer stated lead time policies, and inventory reserves management.

Other Responsibilities:

• Lead and develop the Inventory Optimization, Inventory Management, and Customer Service Level teams.
• Oversee multi-echelon inventory optimization and other supply chain policy management.
• Measure inventory health and implement proactive and reactive strategies for improvement.
• Define and manage structural Days Inventory Outstanding (DIO) targets.
• Facilitate multiple cross functional inventory and service level forums.
• Collaborate with Assembly & Test, Quality, Engineering, and New Product Operations teams to improve inventory processes.
• Be responsible for quarterly reserves and write-down processes for raw materials, in partnership with Finance.
• Monitor and improve customer service levels, balancing inventory levels to meet service expectations without compromising financial performance.

You Are:

• An outstanding leader with a consistent track record in leading supply chain, industrial engineering or relevant areas, with strong analytical and problem-solving skills, and the ability to drive critical initiatives in a highly organized and adaptable manner
• Possess a Bachelors’ Degree or above and at least 12 years of work experience across key business functional areas such as inventory management, supply chain, manufacturing or a related field.
• Strong understanding of semiconductor product and manufacturing processes.
• Excellent interpersonal skills with the ability to work & collaborate at all levels and influence partners without direct authority.
• Passionate about driving improvements and achieving operational excellence.
• The ability to form collaborative partnerships with internal and external partners.

Overview

Keysight is on the forefront of technology innovation, delivering breakthroughs and trusted insights in electronic design, simulation, prototyping, test, manufacturing, and optimization. Our ~15,000 employees create world-class solutions in communications, 5G, automotive, energy, quantum, aerospace, defense, and semiconductor markets for customers in over 100 countries. Learn more about what we do.

Our powerful, award-winning culture embraces a bold vision of where technology can take us and a passion for tackling challenging problems with industry-first solutions. Diversity, equity & inclusion are integral parts of our culture and drivers of innovation at Keysight. We believe that when people feel a sense of belonging, they can be more creative, innovative, and thrive at all points in their careers.

Keysight's customers encounter significant cybersecurity risks, which present both opportunities and challenges for our products and solutions. Our mission, "accelerating innovation to connect and secure the world," embodies our purpose and dedication to ensuring the security of our own products. To fulfill this mission, we must prioritize cybersecurity within Keysight and in the products and solutions we provide to our customers.

Job Description:

As a Product Security R&D Engineer at Keysight Technologies, your primary responsibility will involve close collaboration with the Product Security Applications team. Your task will be to integrate secure development methodologies into all our products and services. This includes working with embedded Windows and Linux platforms across various operating systems. The overarching goal of our Product Security Programs is to ensure that all Keysight products meet the necessary regulatory security standards and requirements before they are shipped out.

Team Overview: The Product Security Applications Team, established in Singapore in 2017, is an R&D team dedicated to enhancing the security standards of Keysight products. Their focus is on making sure our products are safe and secure for our end customers. As the sole R&D security team within Keysight, their primary objective is to continually elevate the security baseline of our products.

Responsibilities:

• Collaborate with product development teams throughout different stages of the development lifecycle to integrate product security requirements using Keysight’s Windows and Linux platforms.
• Provide technical support for product security assessments, utilizing tools such as composition analysis, vulnerability management, penetration testing, and fuzz testing. Additionally, assist development teams in devising strategies to address and mitigate identified vulnerabilities.
• Provide technical support for third party open-source license compliance.
• Support and/or recommend third-party tools to assess the security posture of our products in alignment with recognized industry standards.
• Understand and implement product security programs across all operating system (OS) platforms used by Keysight’s products.

Basic Qualifications:

• Bachelor’s degree in computer science/engineering or equivalent experience with security technologies.

Desired Qualifications:

• Experience in software development using C/C++, JavaScript, and Python programming languages.
• Good understanding of common application and network protocols, cryptographic technologies, and common security threats on OS designs (including Linux, Windows, and mobile platforms).
• Strong interest in software engineering, security application development, and security assessment.
• Ability to thrive in dynamic and highly technical organizations.
• 1-2 years of experience working with product development/engineering and security expertise.

Fresh graduates with security-related internship experiences and security knowledge may also be considered

As a Senior Equipment Engineer/Equipment Engineer in the NTI, you will be expected to support R&D activities associated with rapid deployment of First-of-Kind equipment, the CIP hardware evaluations and managing on the timeline needed to deploy in current technode/next advance technode on time. Good team spirit and good collaborations working is needed with various stakeholders including (not limited to) facilities/fab support/Gas & Chemical/EHS/F4/F10/Central team etc with various equipment setup and improvement work necessitated thereof as well as to ensure extended engagement with F4 on the upcoming First-of-Kind equipment in upcoming technode. Expected to work independently with minimal direction and complete projects in a timely manner and achieve set objectives.

Responsibilities
• Install equipment and/or CIP hardware for evaluation by the process development team to enable early introduction, maturity, and adoption for current and next node of 3D NAND technology.
• Work with the Fab layout and facility team to ensure smooth and on time installation and operation of the equipment.
• Work with process development team to quantify benefits of equipment/CIP hardware.
• Develop and optimize existing equipment hardware to meet the productivity requirements of advanced 3D NAND parts.
• Participate with Boise TD equipment development peers on technology choices for the upcoming nodes and able to translate future technology needs into clear equipment requirements.
• Identify disruptive equipment early, work with manufacturing and Boise TD to identify viable evaluation path forward in manufacturing.
• Design and implement advanced equipment monitoring and control methodologies.
• Lead team or sites or suppliers on complex projects in focused meetings with end goal of maturity an equipment technology in record times for technical advantage, cost and productivity.
• Serve as a technical expert within Micron, provide advice and recommendations to senior management on improvements from equipment development. Lead and initiate innovation projects through patents/technical papers.
• Identify and resolve safety hazards; follow safety procedures including lockout, chemical safety, lifting techniques and ergonomically correct methods.

Requirements:
• A minimum of 2-3 years of experience in the semiconductor industry in the area of equipment engineer roles.
• In-depth understanding of the equipment operation, working principles, troubleshooting and tool installation procedure is a must.
• Exposure to R&D equipment transfer and ability to develop/optimize equipment hardware design is preferred.
• Communications and collaboration with partners both locally and globally. Strict adherence to Micron Intellectual Property protection policy is a must.
• Self-motivated and adaptable to Micron’s fast paced, demanding and dynamic work environment; flexibility to work for extended hours, as required.
• Excellent oral and written communication skills with ability to convey the message clearly and sharply both locally and globally.
• Excellent ability to prioritize and manage multiple projects simultaneously; efficiently utilize available resources or seek peers’ and/or management help to get over the roadblocks to drive to solutions.
• Encourage and enforce safe, compliant behavior through periodic communications and the performance management process.

GJS for this position: E2 and above

Location: Fab10N

Closing Date: Until filled

Description

As a NAND CMOS Process Integration Engineer in the Singapore Technology Development department at Micron Technology Inc., you will be responsible for developing 3D NAND CMOS devices scaling and enhancing their performance, reliability and manufacturability.

Responsibilities:

• Develop and innovate critical CMOS modules. Drive multi-functional teams to optimize existing process flows and develop new innovative solutions to meet product requirements and manufacturability.
• Develop/re-define critical specifications criteria for optimum product performance and drive activities to get them to manufacturing process capability.
• Extract and analyze inline, probe, parametric, reliability, and other critical metrics and predict future behavior of the CMOS device performance of the product to enable early innovative solutions to meet product and device specifications.
• Early introduction, characterization and validation of new CMOS device models and test structures for developing future NAND products.
• 3 dimensions analysis with the use of K2 view to extract layout information and combine with the doping profiles of each implant step for product development and integration solutions.
• Interact and collaborate with TCAD, modeling, and layout teams to drive clearer definition of CMOS device and reliability improvements across multiple tech-nodes and designs.
• Coordinate activities at manufacturing site towards gating experiment funding, conversions, and effectively communicate decisions made to all R&D, manufacturing, and relevant partners.
• Take on leadership role at quarterly yield summits and monthly program reviews in summarizing complex problems, deriving and explaining actions taken to address them and getting R&D, manufacturing, and senior management teams on the same page.
• Assist in the transfer of a new technology from R&D to manufacturing and contribute towards ensuring successful ramp and qualification. Supporting the transfer, documentation and training of module fundamentals into manufacturing.

Requirements:

• MS or PhD in Electrical Engineering preferably specialized in Microelectronics and Semiconductor Device Physics. Prior technology development and tech transfer/manufacturing experiences are preferred.
• Fresh MS/PhD candidates with knowledge of semiconductor process Integration, device physics and CMOS engineering.
• Direct fab experience with nonvolatile memories manufacturing, knowledge of TCAD, K2 view layout, and NAND product are highly desirable.
• Ability to develop a strong, holistic, end-to-end understanding of CMOS device and its related module on NAND technologies, related structural and electrical fail mechanisms.
• Deep understanding of probe failure mechanism, ability to do electrical bench data collection.
• Self-motivated, self-governing with proven ability to work in a demanding and dynamic environment.
• Experienced in coordinating cross-functional teams to achieve a goal.
• Solid data analysis, communication and reporting abilities with demonstrated presentation abilities.
• Curiosity and natural tendency of learning new things independently.
• Ability to travel for extended periods of time to the US for collaborative R&D work.

Working Location: Fab10, 1 North Coast Drive, Singapore 757432

The Account Assistant will support the Family Office in managing financial records, processing transactions, and ensuring accurate reporting. This entry-level position is ideal for recent graduates or individuals looking to start their careers in finance, accounting and wealth management.

Key Responsibilities

1. Financial Record-Keeping

- Maintain and update accounting records for Family Office accounts.

- Record all transactions, including income, expenses, investments (i.e. shares, structured products, properties), and other financial activities.

- Assist with the preparation of monthly and annual financial reports.

2. Budgeting, Income and Expense Tracking

- Assist in tracking and ensuring rental income are promptly paid by tenants.

- Assist in preparing budgets for expenses / investment activities.

- Monitor spending to ensure adherence to budgetary limits.

3. Accounts Payable

- Process payments for properties bills, utilities, and other expenses.

- Ensure timely payment of invoices, loans, and other obligations.

4. Bank and Investment Account Reconciliations

- Reconcile bank accounts and investment statements to ensure accuracy.

- Track investment income, dividends, and interest.

5. Tax Preparation Support

- Organize and maintain records required for income tax and property tax filing.

- Assist with the preparation and submission of personal and property tax returns.

6. Administrative Support

- Manage filing systems for financial, agreement and legal documents.

- Maintain confidentiality and security of sensitive family and financial information.

- Coordinate with external professionals, such as accountants, lawyers, and investment advisors.

7. Communication and Coordination

- Liaise with family members, staff, vendors, and service providers to manage financial tasks.

- Support the Family Office team in day-to-day operations.

8. Assist with ad-hoc tasks as needed.

Skills and Qualifications

• Technical Skills:

- Familiarity with spreadsheet tools (e.g., Excel, Word).

• Analytical Skills:

- Attention to detail and ability to identify discrepancies.

• Knowledge of Accounting Principles:

- Understanding of basic accounting concepts like double-entry bookkeeping.

• Communication Skills:

- Ability to explain financial information to non-financial stakeholders.

Qualifications:

• Diploma in Accounting, Finance, or a related field (or equivalent experience).
• Basic understanding of accounting principles and practices.
• Proficiency in Microsoft Office, especially Excel.
• Strong attention to detail and organizational skills.
• Good communication and interpersonal abilities.
• Ability to work effectively in a team environment.

This role is often an entry-level position, ideal for individuals looking to start a career in accounting, finance or wealth management.

As a NAND CMOS Device Engineer, you will help set the direction for current and future CMOS technology for Micron’s NAND Memory Technology Roadmap!

You will work with the Design Team to set electrical targets and define transistor structures to meet these targets. You will guide the device technology development and be in close relation with Process Integration, Design Engineering, Design, Design Rules, Reliability, Transistor Modeling, TCAD (Technology Computer-Aided Design), and Parametric Test, to name a few! In addition, you will ensure that the developed technology is manufacturable and highly yielding and that these considerations are designed into the technology from the start.

Together with your peers, you craft and implement our NAND-CMOS roadmap and make sure to align to product roadmaps

• You give directions on how to improve our device portfolio, both in performance and cost effectiveness
• You define, execute, and analyze silicon experiments for future device generations
• Interface with Design Engineers to define transistor targets, deliver transistor models, and optimize critical layout constrained Design Rules
• Work with TCAD simulation group to develop strategies for transistor structures to meet targets
• You strive to ensure that transistor models are correctly targeted to anticipate final silicon
• Define electrical test structures for transistors, isolation, design rule verification, and process monitoring
• Highly motivated to ensure transistors are developed meeting the required reliability standards
• You take initiative to collaborate with Manufacturing to ensure transistors are performing as expected and to debug yield/reliability issues
• You foster and enable a collaborative working style and team spirit by mentoring less experienced colleagues

Minimum Qualifications:

• MS/PhD in Electrical Engineering or related field, PhD in Semiconductor Device Technology preferred
• 5 plus years industry experience in the field of CMOS device design, simulation, characterization
• Experience in developing advanced logic transistor technologies
• Experience in developing Analog FETs operating at higher Voltages
• Preferred: Experience in the field of High Voltage applications, reliability, characterization, device development
• Understanding of analog design concepts
• Good presentation skills
• Excellent team and mentoring skills

Develops new or modified process formulations, defines processing or handling equipment requirements and specifications, and reviews processing techniques and methods applied in the manufacture, fabrication, and evaluation of products. Involvement may begin at any step from pilot plant to full-scale manufacturing. Coordinates design requirement review with appropriate engineering/scientific personnel to ensure compatibility of processing methods. Compiles and evaluates test data to determine appropriate limits and variables for process or material specifications. May conceive and plan projects involving definition and selection of new concepts, equipment automation technology, and approaches in the processing or development of new or improved processes.

Job Scope:

• Support various work teams with administrative requests such as managing of invoices processing and tracking.
• Assist in purchasing and tracking of stock orders.
• Maintain stock of office supplies and order as needed.
• Responsible for answering & directing phone calls, greeting & coordinating appointments, scheduling & facilitating on- or off-site consultations and meetings.

Job Requirements

• Candidate must possess at least Primary/Secondary School/"O" Level, Professional Certificate/NiTEC in any field.
  
• Required language(s): English
• No work experience required.
• Required Skill(s): Microsoft Office
• Preferably Entry Level specialized in Clerical/Administrative Support or equivalent.

If you thrive in support functions and fit the role of an Administrative Executive, you would be the one that we are looking for. We will be happy to notify the shortlisted candidates.

Thank you for applying.

As a Senior Equipment Engineer/Equipment Engineer in the NTI, you will be expected to support R&D activities associated with rapid deployment of First-of-Kind equipment, the CIP hardware evaluations and managing on the timeline needed to deploy in current technode/next advance technode on time. Good team spirit and good collaborations working is needed with various stakeholders including (not limited to) facilities/fab support/Gas & Chemical/EHS/F4/F10/Central team etc with various equipment setup and improvement work necessitated thereof as well as to ensure extended engagement with F4 on the upcoming First-of-Kind equipment in upcoming technode. Expected to work independently with minimal direction and complete projects in a timely manner and achieve set objectives.

Responsibilities
• Install equipment and/or CIP hardware for evaluation by the process development team to enable early introduction, maturity, and adoption for current and next node of 3D NAND technology.
• Work with the Fab layout and facility team to ensure smooth and on time installation and operation of the equipment.
• Work with process development team to quantify benefits of equipment/CIP hardware.
• Develop and optimize existing equipment hardware to meet the productivity requirements of advanced 3D NAND parts.
• Participate with Boise TD equipment development peers on technology choices for the upcoming nodes and able to translate future technology needs into clear equipment requirements.
• Identify disruptive equipment early, work with manufacturing and Boise TD to identify viable evaluation path forward in manufacturing.
• Design and implement advanced equipment monitoring and control methodologies.
• Lead team or sites or suppliers on complex projects in focused meetings with end goal of maturity an equipment technology in record times for technical advantage, cost and productivity.
• Serve as a technical expert within Micron, provide advice and recommendations to senior management on improvements from equipment development. Lead and initiate innovation projects through patents/technical papers.
• Identify and resolve safety hazards; follow safety procedures including lockout, chemical safety, lifting techniques and ergonomically correct methods.

Requirements:
• A minimum of 2-3 years of experience in the semiconductor industry in the area of equipment engineer roles.
• In-depth understanding of the equipment operation, working principles, troubleshooting and tool installation procedure is a must.
• Exposure to R&D equipment transfer and ability to develop/optimize equipment hardware design is preferred.
• Communications and collaboration with partners both locally and globally. Strict adherence to Micron Intellectual Property protection policy is a must.
• Self-motivated and adaptable to Micron’s fast paced, demanding and dynamic work environment; flexibility to work for extended hours, as required.
• Excellent oral and written communication skills with ability to convey the message clearly and sharply both locally and globally.
• Excellent ability to prioritize and manage multiple projects simultaneously; efficiently utilize available resources or seek peers’ and/or management help to get over the roadblocks to drive to solutions.
• Encourage and enforce safe, compliant behavior through periodic communications and the performance management process.

GJS for this position: E2 and above
Location: Fab10N
Closing Date: Until filled

As NAND Sg Process Development (PD) Program Management Engineer, you will support the Program Manager, in his collaboration work with Technology Development (TD) peers, High Volume Manufacturing (HVM) Fabs, Operations Central Teams (OCT) and other stakeholders to drive best in class performances and all critical initiatives for NAND nodes to meet program milestones.

You will play a key role in establishing and managing cost programs to meet allocated capital expenditure budget, operational expenditure cost management; and deliver node-over-node cost per gigabit (CPGB) reduction targets meeting business requirements.

You will work in a fast-paced environment with the world’s Best NAND TD team in a role that is highly Collaborative and requires a great deal of Customer Focus; continuous improvement and an Innovative growth mindset are required to achieve desired results. You will work within a Process Development organization alongside leaders and engineers from Fab functional Process Areas.

Responsibilities:

• Regular interaction with PD/PI team for MOR Updates/Tracking in close collaboration with Industrial Engineering (IE) Modeling Team.
• Drive alignment and timely delivery of results on critical projects, manage execution of TD roadmaps/strategies to meet milestones.
• Drive continuous improvement of PMI/SPC from process areas, publish roadmaps, highlight risks and mitigate.
• Prequal Expense: Work with stakeholders to drive prequal expense reduction (materials, spares etc).
• TD-University Engagements: Engage with Talent Acquisition teams to initiate/support initiatives to build strong TD talent pipelines.
• EBD Grants: Collaborate with Finance Team to comply with regular submissions and meet yearly audits.
• Additional portfolio includes Micron Voice Engagements, managing Dept budget, compliance with NMI processes, related TD audits and new scopes along the way that contribute to NAND program successes.

Successful candidates for this position will have:

• Bachelor/Masters in related Engineering fields.
• Familiar with both TD and manufacturing environment and business processes
• Extremely strong organizational and communication skills.
• Strong interpersonal skills for smooth collaboration with cross-functional teams.
• Solid communication skills for cross department alignment and providing clarity to leadership and executive teams.
• Highly motivated and adaptable to our demanding, dynamic and rapidly changing work environment.

- Handle full set of accounts (AP,AR and GL) using MYOB accounting software

- Process payments, billings and bank reconciliation

- Ensure compliance with accounting standards

- Maintain fixed asset registration and deprecation

- Maintain excel listing of Prepayment, Accrued ,Deposit, Leasing and Fixed asset etc

- Handle Payroll

- Able to provide timely closing of month end account and provide management report

- Liaise with external parties, e.g. suppliers, auditors, tax agents, corporate secretarial agents, local tax and government authorities when required

- Any other duties as assigned by the management

- A team player and the ability to work independently under minimal supervision.

- Applicants able to start work immediately are preferred

- Able to multi-task in a fast-paced environment

As a NAND Process Development (PD) Program Manager, you will work with Technology Development (TD), Operations Central Teams (OCT), High Volume Manufacturing (HVM) Fabs, and other stakeholders to drive best in class Cost performance for NAND nodes within TD and enable our HVM site partners.

You will be in an Individual Contributor (IC) role with no direct reports; however, you will play a key role in establishing and managing cost programs to meet allocated capital expenditure budget, operational expenditure cost management; and deliver node-over-node cost per gigabit (CPGB) reduction targets meeting business requirements.

Additionally, you will drive Process Capability Improvement (PCI) of unit operation processes to achieve yield and device performance targets through the Process Maturity (PMI) and Constructional Specification (CSPEC) business processes.

You will work in a fast-paced environment with the world’s Best NAND TD team in a role that is highly Collaborative and requires a great deal of Customer Focus; continuous improvement and an Innovative growth mindset are required to achieve desired results. You will work within a Process Development organization alongside leaders and engineers from Fab functional Process Areas.7

Responsibilities:

• Sets clear objectives for your function:
• Alignment on critical projects in Process Development (PD), supporting overall Process R&D, TD, and corporate goals.
• Execution of these projects, timely delivery of results, allocating appropriate resources.
• Development and execution of roadmap in support of TD roadmap.
• Participation in execution of Process R&D and TD strategy.
• Enable areas to meet program objectives efficiently.
  
• Process Capability Improvement (PCI) Ownership:
• Leading PD team to achieve unit process capability requirements in accordance with technode schedule.
• Assess and report program status for PMI/CSPEC to TD and HVM Fab stakeholders.
• Drive process areas to be accountable for their PCI (PMI/SPC) status, highlight risks and how to mitigate.
• Drive continuous improvement of PCI through PMI steering committee and other forums.

• PD Model-of-Record (MOR) Ownership:
• Regular interaction with PD/PI team for MOR Updates from Program Kickoff (PK) through Engineering Full Flow Transfer (EFF) in close collaboration with TD Industrial Engineering (IE) Modeling Team.
• Lead node team using Contingency List (CL) and MOR Business Processes, manage MOR changes through Engineering Change Notice (ECN) cycles.
• Cost Summit Planning, Collaboration, and Execution.
• Semi-annual cost summits to establish Capex, Materials, Spares cost targets by node and execution to commits to achieve required $/GB.
  
• POR-MOR Gap tracking and closure:
• Support Transfer from TD to HVM with clear understanding of POR-MOR Gaps and ensure effective mitigations are in place for transfer and ramp while driving POR/Baseline process towards MOR compliance.
• Cost-of Transition (CoT) - project determination & prioritization.
• Planning of MOR and CapEx budget, what is needed to execute results, and ownership/accountability of budget performance.
• Representing PD in capital approval and MOR process.
• Actively support Risk-to-Commit (RTC) business process for CapEx savings optimization.
• Drive readiness for MFG pilot line via OCT/MFG engagement, workshops, and other reporting.
• Engage with other Program Managers for node-node MOR alignment.
• Making timely and effective decisions that deliver results.
• Staying involved in achievement of strategic and/or organizational objectives (Job Rotation Program, Headcount modeling and management, work force development, executive support, etc.).
• Communicate vision of the program to stakeholders by breaking down and clarifying goals that the team needs to perform.Ownership of Technode Key Performance Indicators (KPIs) for PD.
  Identify line-of-sight, tracking goals, and communication of goals and status.
• Ownership of Technode Key Performance Indicators (KPIs) for PD.
• Identify line-of-sight, tracking goals, and communication of goals and status.
  
• Collaboration:
• Process Integration (PI) collaboration – working with PI team as peer, providing ideas, meeting their needs, and staying engaged.
• Operations collaboration – working closely with Operations Development Engineering (ODE) & Industrial Engineering (IE) teams to achieve operational results (e.g. engagement in providing information about potential or likely disruptive POR changes in process flows, equipment, segregations, new materials, etc.).
• Manufacturing – working closely with HVM Fabs, OCT, TD IE Modeling to deliver technology and achieve cost deliverables.
• Peer level – with fellow process development area section managers and other leaders in TD.
  
• Continue to grow technical and management skills (soft and technical areas)
• Additional Responsibilities that may be shared between 1 or multiple PD Program Manager peers:
• Coordinate and drive Tech Acceleration through Vendor Scorecard business process.
• IP Protection as Classification Managers for their respective technologies.
• Program Management and Coordination for Job Shadow Program (JSP).
• Headcount Management and Modeling support.
• PD PM 1:1 alignment and benchmarking.
• Other potential opportunities.

Ex-Pat Assignment:

• This position will initially be for a 1-2 year Ex-Pat assignment in Boise, ID, USA and then transition back to Singapore to support the worldwide NAND development team.

Qualifications & Skills:

• Demonstrated ability to lead small and large teams of diverse stakeholders across different geographical regions.
• Ability to influence and coordinate actions for team members that do not report to you are critical to enable success.
• Strong organizational and communication skills.
• Experienced with Excel, SharePoint, PowerPoint.
• Flexible work schedule to enable collaboration with global partners.
• Ability and willingness to travel internationally.
• Ability to solve complex problems and manage multiple concurrent projects.
• Basic to Advanced understanding and knowledge of Fab Process Areas and Equipment.
  

Education and Experience:

• B.S. or above in science-related field with a minimum of 5 years of experience in semiconductor industry.
• Previous experience as people leader preferred.

Micron is a global leader in NAND technology, pushing the boundaries of semiconductor possibilities. As the Lead (SMTS/Sr. Mgr) of NAND CMOS Team, you will be responsible for the introduction and ramp of ALL NAND products in Singapore, and ensure that all CMOS Device aspects (time-0 and Reliability) are fulfilled with highest quality. You will ensure that all Device VDLs are monitored on a weekly basis, manage a Device Health dashboard (time0 and REL), and provide direction on device optimization/centering to ensure all downstream product requirements are fulfilled on-time.

Leader Responsibilities:

• Ensure that all CMOS VDLs meet Device Maturity Index (DMI) requirements.
• Be the Electrical-SPEC (ESPEC) gate-keeper across all NAND CMOS technologies (through process conversions), and ensure high confidence ESPEC compliance is maintained throughout.
• Manage & Maintain ESPEC spec-source and ensure that performance is compliant with PDK commit. If issues arise, work closely with Design for DTCO containment.
• Have in-depth understanding and ensure full compliance to all key business processes (ESPEC, DTCO, FMEA, DMI, etc..)
• Have in-depth understanding of circuit usage/fail modes (for every VDL), and be able to understand Live-Die vs. Param layout differences.
• Have in-depth understanding of NAND Voltage Spec (VSPEC) document, and ensure that you work with partner Produce & Quality organizations to guarantee 0 VSPEC violations through all end-2-end test methodologies (Probe, Qual flows).
• You will work closely with Device Reliability teams to enable fast reliability flows, towards establishment of continuous line monitor of REL health.
• You will engage seamlessly with the CMOS Process Integration and Device Technology Teams, and foster a One-Team culture always.
• For every Device issue, you will inculcate an FMEA-first and TCAD-first mindset, before deploying silicon solutions.
• Develop a culture of excellence, psychological safety, inclusion, and engagement.
• Continuously improve CMOS team technology approaches and business processes to meet customer needs and adapt to the changing landscape.
• Implement project management best known methods (BKMs) to coordinate activities and deliver projects on schedule.
• Drive effective multi-functional collaboration with internal customers (design, PE, etc.) and partners (integration, process, scribe, modeling, etc.).
• Negotiate and clarify roles and responsibilities with all partner organizations.
• Summarize complex problems and communicate solutions and execution plans to executive leadership.
• Maintain seamless communication between all departments and sites across organizational borders.

Qualifications:

• MS degree (required) or PhD (preferred) with 7-10+ years of DRAM and/or NAND research and development experience.
• Proven capability to deliver novel technology solutions and successfully resolve complex issues that span multiple groups.
• Proven ability to think and communicate clearly in urgent and stressful situations.
• Strong background in CMOS integration, scaling, and device physics.
• Deep knowledge of Design of Experiments (DOE) principles and analytical skills.
• Innovation track record with a proactive approach to exploring new ideas and adapting quickly to change.

• Work closely with the assigned project team and coordinate with Project Managers on all aspects of the project to complete the project in a timely manner;
• Plan and keep track of schedules at construction sites
• Troubleshooting of site and installation issues;
• Ensure all works are carried out within schedule and quality control of installations;
• Check drawings against site to raise any discrepancies and details issues;
• Planning of materials and delivery to site;
• Ensure that government, company and WSH safety policies are complied with at the factory and sites;
• Any other ad-hoc duties assigned

Requirement:

• Degree in Civil or Mechanical or Engineering field;
• Minimum of 3 years relevant working experience in a technical role or construction industry;
• Familiar with details and installation processes;
• Familiar with various design, installation and fabrication drawings

Micron is a global leader in NAND technology, pushing the boundaries of semiconductor possibilities. As the Lead (SMTS/Sr. Mgr) of NAND CMOS Team, you will be responsible for the introduction and ramp of ALL NAND products in Singapore, and ensure that all CMOS Device aspects (time-0 and Reliability) are fulfilled with highest quality. You will ensure that all Device VDLs are monitored on a weekly basis, manage a Device Health dashboard (time0 and REL), and provide direction on device optimization/centering to ensure all downstream product requirements are fulfilled on-time.

Leader Responsibilities:

• Ensure that all CMOS VDLs meet Device Maturity Index (DMI) requirements.
• Be the Electrical-SPEC (ESPEC) gate-keeper across all NAND CMOS technologies (through process conversions), and ensure high confidence ESPEC compliance is maintained throughout.
• Manage & Maintain ESPEC spec-source and ensure that performance is compliant with PDK commit. If issues arise, work closely with Design for DTCO containment.
• Have in-depth understanding and ensure full compliance to all key business processes (ESPEC, DTCO, FMEA, DMI, etc..)
• Have in-depth understanding of circuit usage/fail modes (for every VDL), and be able to understand Live-Die vs. Param layout differences.
• Have in-depth understanding of NAND Voltage Spec (VSPEC) document, and ensure that you work with partner Produce & Quality organizations to guarantee 0 VSPEC violations through all end-2-end test methodologies (Probe, Qual flows).
• You will work closely with Device Reliability teams to enable fast reliability flows, towards establishment of continuous line monitor of REL health.
• You will engage seamlessly with the CMOS Process Integration and Device Technology Teams, and foster a One-Team culture always.
• For every Device issue, you will inculcate an FMEA-first and TCAD-first mindset, before deploying silicon solutions.
• Develop a culture of excellence, psychological safety, inclusion, and engagement.
• Continuously improve CMOS team technology approaches and business processes to meet customer needs and adapt to the changing landscape.
• Implement project management best known methods (BKMs) to coordinate activities and deliver projects on schedule.
• Drive effective multi-functional collaboration with internal customers (design, PE, etc.) and partners (integration, process, scribe, modeling, etc.).
• Negotiate and clarify roles and responsibilities with all partner organizations.
• Summarize complex problems and communicate solutions and execution plans to executive leadership.
• Maintain seamless communication between all departments and sites across organizational borders.

Qualifications:

• MS degree (required) or PhD (preferred) with 7-10+ years of DRAM and/or NAND research and development experience.
• Proven capability to deliver novel technology solutions and successfully resolve complex issues that span multiple groups.
• Proven ability to think and communicate clearly in urgent and stressful situations.
• Strong background in CMOS integration, scaling, and device physics.
• Deep knowledge of Design of Experiments (DOE) principles and analytical skills.
• Innovation track record with a proactive approach to exploring new ideas and adapting quickly to change.

• Perform assembly, testing, and maintenance of mechanical, electronic, or automated equipment.
• Adhere to operational protocols to ensure quality control and proper functionality of equipment.
• Collaborate with engineers to diagnose malfunctions and enhance system performance.
• Assist in documenting testing procedures and results.
• Maintain a safe and organized work environment, complying with workplace safety standards.

Requirement:

• Degree in Electrical and Electronics Engineering field;
• Familiar with details and installation processes;
• Familiar with various design, installation and fabrication drawings

Job Description:

We are seeking a skilled and certified Licensed Plumber (PUB Plumber License) to join our team. The ideal candidate will be responsible for the installation, maintenance, and repair of plumbing systems, including water distribution and sanitation systems, in compliance with relevant safety standards, building codes, and PUB (Public Utilities Board) regulations.

Key Responsibilities:

• Install, maintain, and repair pipes, fixtures, and systems related to water distribution, sanitation, and drainage.
• Ensure all plumbing work is in compliance with safety standards and building codes.
• Inspect drainage systems, water pipes, and other plumbing fixtures to ensure compliance with local regulations and authorities' standards.
• Perform maintenance and inspection of water tanks in accordance with PUB requirements.
• Collaborate with contractors, construction teams, and electricians to ensure smooth and efficient completion of plumbing-related tasks.
• Prepare and submit necessary plumbing work submissions to the relevant authorities as required by regulations.
• Troubleshoot and resolve plumbing issues promptly and efficiently.
• Maintain accurate records of plumbing work completed, including inspections, repairs, and installations.

Job Requirements:

• Certification: Must possess a valid PUB Plumber License.
• Experience: 3 – 5 years of relevant experience in plumbing installation, maintenance, and repairs.
• Proven knowledge of Singapore's plumbing standards, codes, and regulations.
• Strong attention to detail and excellent problem-solving skills.
• Ability to work independently as well as part of a team.
• Good communication skills and ability to collaborate effectively with contractors and other professionals.
• Physically fit and able to handle the demands of the job.
• A proactive and responsible work ethic with a strong commitment to safety.

Your primary responsibilities will be:

• Risk assessment of NAND cell reliability, identification of the process/trim/test strategy to bridge the gaps for JEDEC and internal product qualification.
• Design experiments to identify and segment the limiting reliability mechanisms impacting NAND quality.
• Design high volume electrical experiments (both wafer level and component level) and perform statistical data analysis to validate process/trims solutions required to close reliability gaps.
• Update management and provide continuous feedback to process development and product engineers on the NAND reliability status and roadmap to bridge gaps.
• Contribute to develop forward looking technology path finding for next NAND generation, including reliability risk assessment and product capability projections, identify innovative design and product features required to meet quality specification.

Required skills:

• Proven experience with NAND device structures, operations and algorithms
• Knowledge and understanding of electrical properties of semiconductor and insulator materials, semiconductor device physics and solid-state physics
• In-depth understanding of physics-based modeling of non-volatile memory and semiconductor devices failure mechanisms, reliability analysis
• Knowledge and understanding of statistical analysis and numerical computing software (Matlab, Octave, JMP)
• Knowledge and ability of scripting languages (C, C++, Matlab, Perl)
• Familiar with Big Data and database queries
• Knowledge of JEDEC standards

Working location:

• 1, North Coast Drive, Singapore 757432

Develops new or modified process formulations, defines processing or handling equipment requirements and specifications, and reviews processing techniques and methods applied in the manufacture, fabrication, and evaluation of products. Involvement may begin at any step from pilot plant to full-scale manufacturing. Coordinates design requirement review with appropriate engineering/scientific personnel to ensure compatibility of processing methods. Compiles and evaluates test data to determine appropriate limits and variables for process or material specifications. May conceive and plan projects involving definition and selection of new concepts, equipment automation technology, and approaches in the processing or development of new or improved processes.

As a NAND CMOS Device Engineer, you will help set the direction for current and future CMOS technology for Micron’s NAND Memory Technology Roadmap!

You will work with the Design Team to set electrical targets and define transistor structures to meet these targets. You will guide the device technology development and be in close relation with Process Integration, Design Engineering, Design, Design Rules, Reliability, Transistor Modeling, TCAD (Technology Computer-Aided Design), and Parametric Test, to name a few! In addition, you will ensure that the developed technology is manufacturable and highly yielding and that these considerations are designed into the technology from the start.

Together with your peers, you craft and implement our NAND-CMOS roadmap and make sure to align to product roadmaps

• You give directions on how to improve our device portfolio, both in performance and cost effectiveness
• You define, execute, and analyze silicon experiments for future device generations
• Interface with Design Engineers to define transistor targets, deliver transistor models, and optimize critical layout constrained Design Rules
• Work with TCAD simulation group to develop strategies for transistor structures to meet targets
• You strive to ensure that transistor models are correctly targeted to anticipate final silicon
• Define electrical test structures for transistors, isolation, design rule verification, and process monitoring
• Highly motivated to ensure transistors are developed meeting the required reliability standards
• You take initiative to collaborate with Manufacturing to ensure transistors are performing as expected and to debug yield/reliability issues
• You foster and enable a collaborative working style and team spirit by mentoring less experienced colleagues

Minimum Qualifications:

• MS/PhD in Electrical Engineering or related field, PhD in Semiconductor Device Technology preferred
• 5 plus years industry experience in the field of CMOS device design, simulation, characterization
• Experience in developing advanced logic transistor technologies
• Experience in developing Analog FETs operating at higher Voltages
• Preferred: Experience in the field of High Voltage applications, reliability, characterization, device development
• Understanding of analog design concepts
• Good presentation skills
• Excellent team and mentoring skills

Develops new or modified process formulations, defines processing or handling equipment requirements and specifications, and reviews processing techniques and methods applied in the manufacture, fabrication, and evaluation of products. Involvement may begin at any step from pilot plant to full-scale manufacturing. Coordinates design requirement review with appropriate engineering/scientific personnel to ensure compatibility of processing methods. Compiles and evaluates test data to determine appropriate limits and variables for process or material specifications. May conceive and plan projects involving definition and selection of new concepts, equipment automation technology, and approaches in the processing or development of new or improved processes.

Job Highlights

• Yearly Increment + Allowance + Good Overtime Pay
• No Experience Required. Training Provided
• Learn New Skills through Training with Job Progression

Job Description

Positions (We are looking for):

• 3 x Product Installers
• 2 x Class 3 Driver cum Installers
• 2 x General Workers

Job Scope/Responsibilities (for Product Installer)

• Responsible for the installation and application works at renovation sites
• Manage physical activities
• Any other ad-hoc task assigned
• Training will be provided (Learn new skills)
• Experienced installer in relevant industry will be considered for higher pay scheme.

Job Scope/Responsibilities (for Driver & General Worker)

• Delivery/collection of goods to various areas of Singapore
• Assist with loading and unloading products from vehicle
• Provide assistance on-site
• Possess valid Class 3 driving license
• Any other ad-hoc task assigned

Requirement

• No experience is required. Training will be provided
• Keen to learn; Good learning attitude
• With valid Class 3 driving license & driving experience is preferred

More information

• Working Time: 5.5/6 days per week; 8.30am – 5.30pm
• Opportunities to earn additional OT hours
• With job progression & career advancement

We regret to inform that only shortlisted candidates will be notified. Thank you.

Additional Information

As a Senior Equipment Engineer/Equipment Engineer in the NTI, you will be expected to support R&D activities associated with rapid deployment of First-of-Kind equipment, the CIP hardware evaluations and managing on the timeline needed to deploy in current technode/next advance technode on time. Good team spirit and good collaborations working is needed with various stakeholders including (not limited to) facilities/fab support/Gas & Chemical/EHS/F4/F10/Central team etc with various equipment setup and improvement work necessitated thereof as well as to ensure extended engagement with F4 on the upcoming First-of-Kind equipment in upcoming technode. Expected to work independently with minimal direction and complete projects in a timely manner and achieve set objectives.

Responsibilities
• Install equipment and/or CIP hardware for evaluation by the process development team to enable early introduction, maturity, and adoption for current and next node of 3D NAND technology.
• Work with the Fab layout and facility team to ensure smooth and on time installation and operation of the equipment.
• Work with process development team to quantify benefits of equipment/CIP hardware.
• Develop and optimize existing equipment hardware to meet the productivity requirements of advanced 3D NAND parts.
• Participate with Boise TD equipment development peers on technology choices for the upcoming nodes and able to translate future technology needs into clear equipment requirements.
• Identify disruptive equipment early, work with manufacturing and Boise TD to identify viable evaluation path forward in manufacturing.
• Design and implement advanced equipment monitoring and control methodologies.
• Lead team or sites or suppliers on complex projects in focused meetings with end goal of maturity an equipment technology in record times for technical advantage, cost and productivity.
• Serve as a technical expert within Micron, provide advice and recommendations to senior management on improvements from equipment development. Lead and initiate innovation projects through patents/technical papers.
• Identify and resolve safety hazards; follow safety procedures including lockout, chemical safety, lifting techniques and ergonomically correct methods.

Requirements:
• A minimum of 2-3 years of experience in the semiconductor industry in the area of equipment engineer roles.
• In-depth understanding of the equipment operation, working principles, troubleshooting and tool installation procedure is a must.
• Exposure to R&D equipment transfer and ability to develop/optimize equipment hardware design is preferred.
• Communications and collaboration with partners both locally and globally. Strict adherence to Micron Intellectual Property protection policy is a must.
• Self-motivated and adaptable to Micron’s fast paced, demanding and dynamic work environment; flexibility to work for extended hours, as required.
• Excellent oral and written communication skills with ability to convey the message clearly and sharply both locally and globally.
• Excellent ability to prioritize and manage multiple projects simultaneously; efficiently utilize available resources or seek peers’ and/or management help to get over the roadblocks to drive to solutions.
• Encourage and enforce safe, compliant behavior through periodic communications and the performance management process.

GJS for this position: E2 and above
Location: Fab10N
Closing Date: Until filled