About DKatalis

DKatalis is a financial technology company with multiple offices in the APAC region. In our quest to build a better financial world, one of our key goals is to create an ecosystem-linked financial services business.

DKatalis is built and backed by experienced and successful entrepreneurs, bankers, and investors in Singapore and Indonesia who have more than 30 years of financial domain experience and are from top-tier schools like Stanford, Cambridge London Business School, JNU with more than 30 years of building financial services/banking experience from Bank BTPN, Danamon, Citibank, McKinsey & Co, Northstar, Farallon Capital, and HSBC.

About the role

You will be part of a cross-functional agile engineering team (squad) responsible to build, deploy and run (support) one or more of our digital products, focusing on full-stack experience to build robust & resilient systems (front-end & back-end).

You will work closely with Engineers, Product, Design, and other stakeholders, collaboratively ensuring quality gets built in the product, get to see your impact in everyday lives of many people, and have great fun while doing it.

You will share your learnings within and beyond your team (squad) and mentor budding engineers for good engineering practices

What will you do

• Working with engineering+product owners to design, refine and develop the product, from concept to implementation.
• Main contributor in creating best in-class product & experience for our customers by designing, building, scaling, and evolving our platforms, services, and tools
• Communicate, collaborate and work effectively across cross functional teams in a multicultural environment
• Mentor a team of highly talented and motivated engineers
• Ensure the performance, security, and responsiveness of applications built
• Continuously improve code quality, product execution, automatization and customer delight

What you need to have

• You have at least 10+ years of professional experience in a similar role developing highly scalable applications
• Good written and spoken English
• Hands on expertise in Java / Javascript or its derivatives (Typescript, NodeJS, Scala, Kotlin, Springboot, etc)
• Have hands on experience on one of this front-end development (Flutter Preferred)
• Experience to Lean/XP practices (TDD, Pair Programming, Continuous Integration/Delivery for both Mobile & Back-end)
• Experience working in Agile Software development
• Communicate, collaborate, and work effectively across distributed teams in a multicultural environment.
• You’re excited about delivering end-to-end experiences and care about your software architecture across the front-end, back-end, and the APIs that glue them together
• A passion for quality and best practices but with a pragmatism that understands the
  balance between perfection and delivering value in a timely manner.
• Enjoys mentoring more junior engineers on good engineering practices & share knowledge

Responsibilities:

• Performs the set-up, calibration, testing and troubleshooting of circuits, components, instruments and mechanical assemblies
• Determines and may develop test specifications, methods and procedures from blueprints, drawings and diagrams.
• Tests and troubleshoots assemblies and/or final systems. May complete rework on assemblies and/or systems as a result of testing.
• Prepares technical reports summarizing findings and recommending solutions to technical problems.
• May assist in the selection and set-up of specialized test equipment.

Requirements:

• Diploma or Bachelor Degree in Engineering.
• Ability to read technical drawings/procedures and use a variety of precision testing and measuring instruments.
• Previous hands-on experience with semiconductor equipment
• Experience with optics alignment will be adventagous
• Strong troubleshooting and analytical skills to resolve technical problems, set up experiments, and perform data analysis.
• Excellent communication, teamwork, and people skills are required.
• Comfortable working in shifts and cleanroom environment

Summary:

• Salary up to $6000
• MNC company - stable revenue & perks
• Transport allowances
• Possess own vehicle
• Location: Pioneer
• 5 days work week
• Sales experience in precision engineering related products

Key Responsibilities:

• Develop new business opportunities & sales leads for revenue growth and customer retention
• Achieve sales targets and analyst current market trends and industry information
• Pitch, recommend and fulfil the requirement of customer in terms of products and services offered
• Work closely with the production, application and shipping team to ensure timely delivery and that all order requirements are met
• Attend problem and generate solution
• Other related ad hoc duties

Key Requirements:

• Min Diploma in Mechanical Engineering or equivalent
• Sales experience in precision engineering related products
• Strong technical knowledge in CNC machines
• Possess own vehicle is a must

Interested applicants, please submit your updated resume in MS Words format by using the APPLY NOW BUTTON.

By submitting your personal data and/or resume, you give consent to the collection, use, and disclosure of your personal data and/or resume by the company (or its agent) for the purpose of the processing and administration by the company relating to this job application.

Please be notified that only shortlisted candidates will be notified.

Your recruiter for this job: Stella

WhatsApp me @ 8772 4117 for a prompt response to your enquiry!

Stella Aw Yong See Hui | R24121552

Recruit Now Singapore Pte Ltd | EA No: 21C0845

Job Responsibilities:-

• Define, architect and document the Design-for-Testability (DFT) concept for SOC’s
• Develop, implement and verify DFT measures
• Work closely with cross-function teams (design/verification, physical, and operation) to ensure all test requirements are met and DFT function is correctly implemented for effective DFT solutions
• Achieve target structural test coverage for logic, memories, serdeses and other mixed signal IPs
• Test pattern generation/verification/post-silicon ATE support

Job Requirements:-

• Master's or Bachelor Degree in Electronics and Communications Engineering or equivalent
• Minimum 10 years of working experience in DFT field
• Good knowledge in Boundary Scan, ATPG Scan, Synopsys SMS and/or MBIST is a must
• Working experience in industry standard tools like Test Kompress, DFT advisor, DFT Compiler, Mentor’s SSN and OCC controller are desirable
• Knowledge of full VLSI RTL2GDSII design flow
• Knowledge in high level programming and script writing
• Knowledge in HDL, synthesis, static timing analysis and constraining will be an added advantage
• Some Experience in Test development and Product engineering

Location: Next to Bendemeer MRT

Interested candidates may submit detailed CV with the following info:-

• Current salary, including AWS or Variable Bonus
• Expected salary
• Availability

Service Desk Engineer

We are looking for experienced full-time Service Desk engineer to provide End User Computing or Service Desk support to APAC Region in Singapore.

Job Responsibilities:

• Provide level 1.5 End User Computing support and well verse in Windows OS.
• Change Management, including review new and implemented changes, chair CAB, review change schedule, maintain dashboard, prepare comms.
• Incident Management, including analysing trends, incident workarounds, monitoring aged incidents.
• Major Incident Management, including communication, being part of the Incident Repsonse Team, managing suppliers
• Problem Management, including chairing any problem meetings, managing active problems, highlighting new problems.
• Release Management – liaising with the testers, vendor, tracking features and defects
• Service Request Management – documenting processes, analysing trends, identifying service improvements, working with teams to design new processes
• Continual Service Improvement – being able to highlight areas of improvement for effectiveness and efficiency
• Service Reporting
• ServiceNow – to assist with the day-to-day management of the tool, including working on incidents and requests

Technical Skills & Qualifications Required:

• Good knowledge of ITIL
• Good knowledge of ServiceNow
• Good knowledge/experience of using the Microsoft suite, specifically including SharePoint , Visio and Excel
• Exposure to/familiarity with automation

Job Requirement:

• Diploma/Bachelor’s degree in computer science / information technology or relevant field.
• At least 3-5 years of relevant working experiences.
• A good team player.
• Excellent interpersonal skills.
• Excellent verbal and written communication skills, and ability to communicate with different audiences and write a range of document types – procedures, comms, training modules.
• Customer centric and focus on service excellence.
• Excellent problem-solving and multitasking skills.
• Sound problem solving and investigative skills.
• Desire to follow best practice and development standards as agreed within IT.
• Keen to learn new skills.
• Working location: Central, Singapore

It would be appreciated if you can share with me your interest on the same.

Have a friend or family member who may be interested in taking the next step in their career? Help them out by referring them to Ennovatez.

You can email your resume to us at [email protected]

Job Description

• Carry out routine maintenance and repair work (Machine and Facilities)
• Perform plumbing, painting, and minor repairs
• Provide technical support and training to staff
• Implement preventive maintenance schedules
• Ensure compliance with health and safety regulations

Job Requirements

• Electrical/Mechanical engineering knowledge is an advantage
• Machinery repair and maintenance is an advantage
• Able to work as a team and individually
• Must be willing to be hands on
• Able to do overtime and work on Saturday and Sunday if required

Roles & Responsibilities

M&E Engineer is responsible for :-

JOB DESCRIPTION:

· Monitor and report on the progress of work to project manager;

· Control the progress of shop drawings, technical submissions and equipment/material procurement/fabrication/delivery status for on-time completion.

· Coordinate with client’s representatives, consultants, and subcontractors on all technical matters, including submission of method statement, drawings, materials, samples and work progress;

· Control site progress & installation quality as per approved;

· Carry out inspection of M&E works prior to concreting or subsequent construction works;

· Assist in supervising and coordinating work closely with other departments;

· Assist for submission of evaluation of progress claim, variation work to M&E Manager

· Participate in all relevant project meetings;

· Responsible for carrying out M&E technical meetings and resolving technical issues with record;

· Responsible for M&E drawing coordination and production of CSD and individual service drawings quality;

· Responsible for conducting inspection to meet with construction schedule;

· Provide and maintain all site inspection records & T&C records up to date;

· Ensure quality of MEP workmanship and compliance with safety and environmental requirements;

· Provide and maintain all site inspection records & T&C records up to date;

· Allocate work and ensure jobs are correctly and properly achieved within standards and SOP.

REQUIREMENTS:

· Diploma / Degree in Mechanical or Electrical Engineering;

· Min of 2 years’ work experience related projects in Singapore building and construction industry;

· Strong Electrical/Mechanical knowledge with hands-on experiences;

· Sound knowledge in BIM, Revit, Autocad would be an advantage;

· Good communication skills with the ability to coordinate with site teams to execute work

Job Description

Reporting to the Project Manager/Engineering Manager, successful applicants will be involved in Power supply system and switching mode power supply development activities such as electrical circuit design, magnetic design, prototyping, evaluation and assisting manufacturing in BETA run of the new product.

Key Skills & Responsibilities

• Understand customer requirement to design or modify XP product to provide Added Value (AV) Solution based on XP design criteria and procedure
• Maintain an in-depth knowledge of all XP products to identify and select the most suitable product for Engineering Solution design.
• Design new products in timely manner to meet the product spec, modify existing designs, improve existing products for better performance and /or cost
• Proposed AV or modified solution based on sales/customer requirements.
• Perform product verification & validation test such as electrical performance, thermal, EMC and DVT to ensure product meet specification before delivered to customer.
• Electrical circuit and schematic design
• Embedded systems design both in hardware
• Firmware design knowledge will be an added advantage.
• Bill of materials (BOM) creation and documentation.
• Breadboard and prototype samples making and debugging
• Design new solution/product within XP standard design practice, safety guidelines, agreed timescales and costs.
• Performed product (AV and modified model) verification and validation, such as electrical performance, thermal, EMC and DVT evaluations,
• There will be some travelling required in conjunction with customer and manufacturing support as well as outside training

Qualifications

Knowledge/Qualifications/Attributes

• Minimum bachelor’s degree in electrical/electronic or higher degree in a related engineering field.
• More than 3 years electrical design experience of power supply/power system; those with more than 5 years’ experience will be considered for senior position.
• For Senior position, Identifies, and review projects main task, schedules, and technical challenges on project delivery timely is required.
• Good project management skill and capable of leading long-term structured problem-solving projects for senior position.
• Familiarity with PCB design using Altium/PADS will be an added advantage.
• Requires good communication, reasoning, problem solving and analytical skills.
• Hardworking, dynamic, strong responsibility and a good team play

As a Process Development Engineer, you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. Additional responsibilities include coordinating and carrying out process, equipment and material evaluation/optimization to implement changes at process step, leading and participating in yield improvement and cost reduction activities, handling new process baseline qualifications and managing, auditing and liaising with material suppliers to achieve quality, cost and risk management objectives.

• Excellent execution on assembly process for 1st New Product Introduction (NPI) success and smooth transfer process from NPI to HVM
• Excellent execution of the qualification of NPI products / packages build that proliferate from the pilot products and packages according to planned timeline
• Full responsible on support NPI business process with process TRA, POS, PFMEA/QCP, risk mitigation and documentations.
• Deliver BIC yield and cost on product NPI with integration of DFx BIC package solution, process guideline and design rules.
• Collaboration with cross functional team from NPI to LVM/HVM process transfer.
• On-time execution of NPI Customer samples and Engineering Samples build for new products and packages

SME Process Owner Responsible for Continuous Improvement on Process Yield, Defect Elimination and Process Characterization

• Process owner to perform on-time detection with data analysis for process yield improvement. Lead the defect elimination and continue improvement action, with problem solving methodology, statistical analysis and integration solution decision.
• Process owner to develop process recipe for BIC UPH, conducting process characterization to define process parameters and boundary.
• Continuous develop in depth assembly process technical knowledge, well understand process capability/tolerance//spec limit/CpK, and utilize key tools PFMEA/QCP/APC/FDC/Alarm on assembly processes Cz/Development/NPI.
• Global leader for cross team collaboration on network BKM, process recipe spec and recipe standardization/conversion.

Technology enablement and development – Process, Material, Equipment

• Participate and support Product Roadmap, to enable key process capability and technology development to ensure packaging solution is ready prior 1st Qual Silicon deliver.
• Frequent engagement with equipment and material supplier (at least interval of monthly or daily/weekly for process issues)
• Collaboration with Supplier and involvement Supplier Roadmap (Material/Equipment/OSAT), to understand market trends and competitor’s direction, ensure key process technology and capability enablement is in-line.
• Frequent review and participant Competitor Analysis, to understand market trends and competitor’s technology/capability boundary
• Engage and follow PDE business process (TGR, TORB, KEG interlock) for new technology qualification, alignment and safe launch

Teamwork and General expectation

• Trainer/Buddy/Mentor for new team members, build effective relationships within team and cross team (peers, counterpart)
• Regularly review data and direction with supervisor. Demonstrate sound data analysis and judgment. Present reports and findings with appropriate conclusions, recommendations and decision making.
• Develop, or coordinate development of, training materials for existing/new process
• Safety Identify and promptly report hazards, follow safety procedures and area work rules including proper PPE, lockout and chemical safety.

Requirements:-

• Masters or Bachelor's degree in Mechanical/ Materials Engineering
• Experience in backend engineering process or package development preferred
• Good technical knowledge in component test and/or module manufacturing process
• Excellent data analysis, statistical analysis, data interpretation skills
• Ability to make sound data-driven decisions. Prioritize and apply due-diligence in day to day task.
• Possess analytical and problem solving skills
• Keen interest in semiconductor engineering
• Showcase leadership experience and potential

About DKatalis

DKatalis is a financial technology company with multiple offices in the APAC region. In our quest to build a better financial world, one of our key goals is to create an ecosystem-linked financial services business.

DKatalis is built and backed by experienced and successful entrepreneurs, bankers, and investors in Singapore and Indonesia who have more than 30 years of financial domain experience and are from top-tier schools like Stanford, Cambridge London Business School, JNU with more than 30 years of building financial services/banking experience from Bank BTPN, Danamon, Citibank, McKinsey & Co, Northstar, Farallon Capital, and HSBC.

About the role

You will be part of a cross-functional agile engineering team (squad) responsible to build, deploy and run (support) one or more of our digital products, focusing on full-stack experience to build robust & resilient systems (front-end & back-end).

You will work closely with Engineers, Product, Design, and other stakeholders, collaboratively ensuring quality gets built in the product, get to see your impact in everyday lives of many people, and have great fun while doing it.

You will share your learnings within and beyond your team (squad) and mentor budding engineers for good engineering practices

What will you do

• Working with engineering+product owners to design, refine and develop the product, from concept to implementation.
• Main contributor in creating best in-class product & experience for our customers by designing, building, scaling, and evolving our platforms, services, and tools
• Communicate, collaborate and work effectively across cross functional teams in a multicultural environment
• Mentor a team of highly talented and motivated engineers
• Ensure the performance, security, and responsiveness of applications built
• Continuously improve code quality, product execution, automatization and customer delight

What you need to have

• You have at least 10+ years of professional experience in a similar role developing highly scalable applications
• Good written and spoken English
• Hands on expertise in Java / Javascript or its derivatives (Typescript, NodeJS, Scala, Kotlin, Springboot, etc)
• Have hands on experience on one of this front-end development (Flutter Preferred)
• Experience to Lean/XP practices (TDD, Pair Programming, Continuous Integration/Delivery for both Mobile & Back-end)
• Experience working in Agile Software development
• Communicate, collaborate, and work effectively across distributed teams in a multicultural environment.
• You’re excited about delivering end-to-end experiences and care about your software architecture across the front-end, back-end, and the APIs that glue them together
• A passion for quality and best practices but with a pragmatism that understands the
  balance between perfection and delivering value in a timely manner.
• Enjoys mentoring more junior engineers on good engineering practices & share knowledge

As a Non-Volatile Memory Quality & Reliability Assurance (NVMQRA) Engineer at Micron Technology, you will be responsible for performing formal Failure Analysis of customer reported failing devices via the Returned Material Authorization (RMA) process. You will be required to summarize lab analysis results at the electrical and physical level to identify root cause and establish an associated containment plan. In this role, you will have the opportunities to collaborate with various engineering and manufacturing stakeholders to evaluate and review Corrective Actions /Preventive Actions. You will provide documentation of the RMA findings and oversee the final customer report till closure. In addition, for the senior role, you will be asked to provide guidance and lead the team when solving complex unplanned deviations reported by our customers. Project management skills are necessary and the ability to make critical decisions that directly translate to quality and timely completion of the project is highly desirable. You will also be required to spearhead the sustaining efforts and keeping up to date on new product knowledge, as well as developing and mentoring new talents.

Responsibilities and Tasks

Perform Failure Analysis of Customer Returns

• Understand customer complaint of the memory component failure
• Initiate communication with Micron Customer-facing team for further details on customer complaint, requesting additional questions to provide best opportunity for successful analysis
• Perform bench level analysis including initial data image analyis/examination
• Perform Automated Test Equipment (ATE) analysis and interpret results
• Work with the appropriate engineering teams (e.g., PE, PYE) to perform detailed fault isolation when electrical failure has been confirmed
• Summarize findings and submit for physical failure analysis (PFA).

Provide FA Reports for Micron Customer Facing Team for Communication to External Customers

• Summarize analysis at electrical and physical level into customer friendly formats.
• Work with the appropriate manufacturing Global Quality teams through the appropriate request systems (example: GPSS) for Root Cause and/or Corrective Action and a containment plan
• Identify potential risk to external customers
• Communicate with respective BU (Business Unit) on potential impact to customers
• Communicate FA updates through interim reports or during scheduled meetings with the customers.
• Provide formal FA Report with findings

Sustain Knowledge of Device Capabilities and Characteristics

• Keep up to date with latest Fab/ASM process technology
• Understand datasheet specifications for each device and the differences from previous technode for NOR * NAND product family
• Comprehension of qualification data and potential impact to customer operation
• Stay up-to-date on common customer applications and usage model
• Partnering with customer support team to resolve ongoing customer issues

Qualifications and Experience

• Excellent verbal and written communication skills in English. The ability to communicate clearly and concisely both verbally and in writing is critical in this role.
• Good organization skills and ability to multitask and coordinate between multiple issue at any given time.
• Ability to work effectively in cross-functional teams and handle pressure situations in a professional manner
• Excellent problem-solving and analytical skills with strong attention to details.
• Familiarity with NexTest /Teradyne bench analytical tools, scripting in linux console will be an added advantage.

Candidates with 2-3 years of experience in the semiconductor industry as Product or QA engineer are preferred. Relevant experienced candidates will be considered for the Senior Role.

Education

A Bachelor or Masters Degree in Electrical Engineering or similar field of study.

We are looking for a Package-Silicon Integration Engineer in Micron's Package Development Engineering(PDE) Group, who will be responsible for driving advanced package development for next generation silicon and package technologies. You will collaborate with various functional teams such as silicon wafer design, package design, wafer fab to meet project requirements. You will drive the technology development through multiple phases of product maturity and contribute to Micron's strategic objectives of Technology leadership.

RESPONSIBILITIES include but are not limited to:

• Work with package design and development teams to complete chip package interaction risk assessment.
• Work with scribe designers and assembly engineers to find solutions for dicing problems and implement relevant design rules/FMEA.
• Work with die designers to enable design for manufacturing in area like die size, scribe width and pad size.
• Collaborate with R&D/manufacturing wafer fabs and packaging teams to solve relevant issues, and improve yield, quality and manufacturability.
• Contribute to development of new silicon and package technologies by engaging with Micron’s internal factories.
• Define test vehicles, plan DOEs, characterize enabling technologies, document best-known-process and hand-off to manufacturing.
• Identify technology, quality, business process gaps and develop solutions.

EDUCATION, EXPERIENCE & QUALIFICATION REQUIRED

• Masters or Bachelor’s degree in Engineering (Mechanical, Materials Science, Electrical, Chemical) or related field
• 5-7 years of semiconductor fab experience in Chip package interaction and integration
• Strong Project / Program management skills
• Possess sound methodology for organizing work, decision-making and setting priorities
• Strong analytical, problem solving, and organizational skills
• Proficiency in computer applications like Excel, Word, Power Point.
• Self-motivated and team-oriented.
• Strong interpersonal, oral and written communications-skills.

Keen on the role? Apply now!

Job Description

• Working with Process Engineer & Engineering team on QC requirement
• Documenting inspection criteria and quality plan
• Work with QA, Process and Product team on corrective action with quality issue
• Work with Process team on in-process audit and FQC audit

Job Requirements:

• Minimum Diploma in Manufacturing /Quality Engineering
• At least 1 year of relevant working experience in Electronics Product Manufacturing environment
• Control of Supplier Quality Assurance (SQA)
• Quality control of in-coming, in-process and out-going products
• Knowledge of ISO 9001, 14001, 13485 & 45001, FDA requirement
• Able to understand IPC requirement in PCB
• Assembly, quality requirement of plastic molding, die casting, extrusion, metal stamping and machining parts

*Please be notified that only shortlisted candidates will be notified*

By submtting your personal data and/or resume, you give consent to the collection, use, and disclosure of your personal data and/or resume by the company (or its agent) for the purpose of the processing and administration by the company relating to this job application.

EA Personnel Name: Chan Jun Wei

EA Personnel No: R1543992

EA License No: 21C0845

Working Location: Buona Vista

Working Time: 5 day work week, 8:45am - 5:30pm

Job Description

● Utilise 3D CAD design tools and perform high precision 3D printing (FDM

& DLP)

● Utilise basic microcontrollers boards such as Arduino, ESP32 or STM32

to build simple circuit boards for sensor control and data acquisition

● Testing and assembly of electronics and mechanical parts and debugging

of software using basic tools like python or C++

● Familiar with maintenance of laboratory inventory and laboratory

administrative tasks (Procurement, equipment preventive

maintenance/repairs and safety matters)

● Enthusiastic, highly motivated, able to multitask, with excellent

interpersonal and communication skills.

● Administrative works, such as ordering and payment with SAP system.

Job Requirements

● Basic experience in 3D CAD design software, like Solidworks and Fusion360.

● Basic experience with microcontroller boards like Arduino, Esp32, STM32.

● Basic experience in handling simple electronics and basic hands-on soldering skills

● Prior experience or have interest in handling administrative tasks like raising Purchase Orders, payment requests, arranging preventive maintenance of equipment and liaising with vendors.

● Diploma/Higher Nitec/ Nitec holders in Bioengineering, Biophysics, physics, mechatronics, electrical engineering, mechanical engineering, computer engineering, or any related fields.

If you do not possess the above experience, your application will still be considered on individual merits and you may be contacted for other opportunities.

By submitting your personal data and/or resume, you give consent to the collection, use, and disclosure of your personal data and/or resume by the company (or its agent) for the purpose of the processing and administration by the company relating to this job application.

Please be notified that only shortlisted candidates will be notified.

EA Personnel.: Chan Jun Wei
EA Registered no.: R1543992
Recruit Now Singapore Pte Ltd
EA License no.: 21C0845

As a XS Developer, you’ll be working closely with our development team to implement and optimize code for our project (mainly xs syscalls). We’re looking for someone with a solid understanding of Age of Empires 2 mechanics and XS scripting, who is also comfortable with general scripting tasks to support a variety of development processes. In return, you will be part of a creative and supportive team environment with the ability to have a direct impact on the development of top-tier games.

Are you up for the challenge?

Some of the cool stuff you'll be doing:

· Develop and maintain code in C/C++

· Working with automation tools and customized scripting languages (.xs) in a proprietary engine

· Utilize Age of Empires 2 knowledge, including mechanics and XS scripting, to enhance project outcomes

· Collaborate with the team to deliver optimized and high-quality code

Requirements

· 1+ year of experience in C/C++ with a passion for game dev

· Strong understanding of Age of Empires 2 game mechanics and avid fan

· Fluency in English

· Strong general scripting skills and automation knowledge

· You will be asked to partake in a technical test to prove your skills.

· Plus: Any modding experience with AOE2

Job Responsibilities:

• Assist Project Manager in all on-site technical/ engineering matters and authority submissions.
• Prepare submission of shop drawing / Materials / MOS/ Monthly Progress Claims and PM Reports.
• Assist in Coordination and execution relating to the construction project.
• Planning of micro scheduling with other trades/disciplines against Master program
• To update structural/architectural/M&E progress with scheduling tools.
• Assistants in monitoring projects are carried out in accordance with the company’s operating procedures, quality standards & contractual specifications.
• Ensuring supervisors & foremen meet clients’ regulatory work requirements.
• To check and ensure compliance with TOP checklist
• Responsible for all inspection activities being carried out.
• Other ad hoc projects assigned

Requirements:

• Degree in Civil or Structural Engineering recognized by PE Board/ BCA
• 1-2 years relevant experience (open to entry level)
• Proficient in MS Office, AutoCAD, and BIM
• A team player and with a positive working attitude

JOB SCOPE & JOB RESPONSIBILITIES

• Drive the creation and refinement of piping layouts, material take-offs (MTOs), and 3D model evaluations for intricate piping systems.
• Analyse stress and vibration data, offering technical expertise and recommendations.
• Collaborate closely with multidisciplinary teams to ensure cohesive project progress.
• Oversee technical specifications, support standards, and material selection to meet project requirement.
• Conduct regular progress assessments and provide strategic recommendations for project requirements.
• Offer technical guidance during contruction and installation phases to ensure successful project outcomes.
• Mentor and guide junior engineers, promoting a culture of quality and efficiency in design.
• Any other duties as assigned by superior.

JOB REQUIREMENT

• Bachelor Degree in Mechanical Engineering or a related field (or equivalent experience).
• At least 10 Years of experience in piping design, stress evaluation, and construction engineering support, including 5 Years in a supervisory capacity.
• Proficient in AutoCAD and 3D modelling tools (eg., Navisworks etc)
• Strong technical knowledge of piping stress/vibration analysia, material selection, and system design.

Must meet the following criteria:

1)Degree and qualifications in related field.

2)Must be able to speak and understand English so as to communicate with the team members.

3)Must be able to lead a groups of worker.

4)Must be a good leadership.

5)Must be able to coordinate workers and projects.

6)Must be able to work under tight deadlines.

Job Description:

• Responsible for product quality assurance.
• Completes all administrative activities associated with quality inspection.
• Performs process audits and assists manufacturing with the interpretation of the quality and workmanship standards.
• Downloads quality information from quality system to be used for Quality reports.
• Plans and directs activities concerned with the establishment and/or continuance of process related requirements and other quality programs.
• Prepares quality documentation or equivalent.
• Prepares Statistical Process Control Charts where required.
• Responsible for authorizing the released of final products to customer.
• Supervises inspectors or technicians on the inspection plan.
• Directs inspectors or technicians engaged in measuring, inspecting and/or testing products or parts and tabulating data.
• concerning materials, product or process quality and reliability.
• Contributes to the workplace safety and health improvement for the employees, as well as environmental protection, by adhering
• to the company’s Environmental, Health and Safety policies and procedures, and helping to achieve EHS objectives and targets
• through participation of EHS programs.
• Participate and adhere to Corporate Social and Environmental Responsibility (CSER) policy, programs and procedures.

Job Requirements :

• Diploma / ITC / NTC in Mechatronics/ Electrical & Electronics engineering or related discipline, preferably with 2 years in manufacturing environment.
• Proficiency in written and communication skills in English.
• Practical computer skills and knowledge with hands-on ability.
• Familiarity with inspection equipment, statistical tools, Geometric Dimension and Tolerance knowledge will be an advantage
• Able to use microscope for inspection and verification.

Job Responsibilities:-

• Utilize in-depth knowledge of Foundation IP to evaluate and qualify IP’s. Able to benchmark and optimize Std cells/IO’s/memory for optimum performance, area or power needs of a project
• Conduct Spice simulations to verify the performance and reliability of designs on RC extracted netlists
• Perform library characterization to ensure accurate timing, power, and area models. Stay up-to-date with industry trends and emerging technologies in library characterization and PPA analysis
• Help to develop and maintain EDA automation scripts to streamline CAD flow and design processes
• Modify and optimize IPQA scripts to improve efficiency and performance
• Analyze and understand both hard and soft IPs within SOC designs. Work with IP vendors to deliver custom specs needed for MXL project needs
• Review silicon reports and provide detailed analysis to identify and resolve issues
• Work closely with vendors and cross-functional teams to ensure successful project outcomes. Collaborate with design teams to ensure seamless integration of libraries and IP blocks
• Maintain comprehensive documentation of IP Vendor engagement. Troubleshoot and resolve issues related to IP, EDA tools and automation flows

Job Requirements:-

• Bachelor’s or Master’s Degree in Electrical Engineering, Computer Engineering, or a related field
• Minimum 10 years of experience in design engineering or a related field. Good understanding of the IC design flow, including front-end and back-end processes
• Proficiency in Foundation IP, Spice Simulation, Library Characterization, EDA automation scripts, and IP script modifications. Familiarity with library characterization tools such as Liberate, Cadence Genus, or Synopsys Library Compiler
• Strong ability to review and analyze silicon reports and provide detailed insights. Excellent analytical and problem-solving skills
• Excellent interpersonal and communication skills for effective collaboration with vendors and team members
• Experience with advanced node technologies (e.g., 8nm, 4nm, and below)
• Experience with SOC IP design and verification
• Knowledge of emerging technologies such as FinFET, FD-SOI, or III-V semiconductors
• Familiarity with industry-standard EDA tools and methodologies
• Experience with tools such as Synopsys PrimeTime, Cadence Genus, or Mentor Graphics Questa

Location: Next to Bendemeer MRT

Interested candidates may submit detailed CV with the following info:-

• Current salary, including AWS or Variable Bonus
• Expected salary
• Availability

Responsibilities:

- Assess Die Overkilling In Line and Optimization of criteria

• Define Sampling Criteria for Yield Enhancement (YE) Wafer – Initial is to align with RPM lot
• Define and Create YE In Line DL2 & MRDA Flow: Full scan with tighter criteria (higher magnification) with non-die-kill
• Create Deviation flow to Route to YE Flow
• Define and Create YE Probe Flow: Full data logging and Test-to-end to capture as much data as possible
• Data Analysis:
• Correlation of MRDA (Metro Real-time defect analysis) Defect to Probe to identify in line failure mode causing probe fail and failure analysis

- Manage Risk of deviation

- Provide organizational leadership to build functional strategies & processes, and collaborate with partners to deliver strategic solutions

• Establish organizational roadmaps and strategies. Apply extensive knowledge and tenacity to carry out strategies.
• Collaborate with peers to construct global solutions.
• Ensure conflict resolution and assist with identifying escalation paths.
• Align internal strategies and communicate line of sight to corporate strategic objectives.
• Establish and communicate department capabilities to ensure partner expectations are aligned.
• Manage conflict and build effective relationships with internal and external partners.
• Initiate and sustain effective communication with internal and external partners.
• Provide advice to senior and executive management on strategic decisions
• Establishes and manages budget/finances for the team

- Ensure a Safe, Compliant, and Ethical Work Environment

• Maintain knowledge of and apply company safety, labor, and ethics policies.
• Communicate requirements and expectations to leaders and external partners.
• Ensure execution of mandatory training for organization.
• Identify and resolve and / or report potential safety, security, and labor issues.

Requirements

• Bachelors, Masters or PhD in Electrical Engineering, Materials Science, Chemical Engineering, or related field
• At least 4 years of experience in Semiconductor Manufacturing and on a leadership capacity, with focus on Advance Packaging technologies and High Bandwidth Memory (HBM) integration, in yield enhancement
• Experience in PWF (Post Wafer Fabrication), Backend engineering process, assembly package technology development and technical knowledge with die and wafer level process technology with understanding of Micron’s silicon and how it interacts at a package level through CPI (Chip Package Interaction), in yield enhancement
• Strong leadership and vision and must be able to comfortably work across organizational boundaries and geographies.
• Demonstrated ability to influence executives, senior leaders and partners on strategic decisions across multiple functions and geographies.
• Ability to effectively collaborate with multi-functional organizations to understand needs and translate them into actionable plans, deliverables, and resource requirements.
• Demonstrated ability to drive and implement a wide range of global initiatives with global teams.
• Ability to be guided by business objectives and determine best methods for delivering results.
• Organized, meticulous, and strong focus on results.
• Demonstrated ability to inspire teamwork and to effectively lead others.
• Proven facilitation skills including the ability to influence others, build consensus, and resolve conflict.
• Demonstrated track record in baseline performance improvement, business process creation, process simulation techniques, data interpretation skills and proficiency in statistical analysis/method.
• Excellent analytical skills and organizational competency
• With good oral and written English communication skill

Keen on the role? Apply now!

As a Package Design Engineer within the Package Development and Engineering (PDE) organization in Micron Technology, you will provide package definition and designs for advanced semiconductor devices. You will be working with a multi-functional team across several geographies to create package design databases such as package stack-up, simulation, route-study, substrate/lead frame layout, wire bond diagrams, and other design documentation. You will be ensure the completion of design activities within the project schedule and ensure that design outputs are within Assembly and vendor capability.

Responsibilities will include, but are not limited to:

• Conduct feasibility studies for various package options and assess designs for manufacturability and reliability.
• Work closely with multi-functional team to address packaging design challenge in the area of layout, electrical, thermal, mechanical, assembly and reliability.
• Interact with PDE assembly team and external assembly subcontractor partners to recommend package solutions to meet customer and/or market requirements
• Generate and update assembly documents in database. Provide drafting and drawing support for package drawings, interposer drawings, and manufacturing drawings.
• Support package and DFMEA reviews with assembly engineering and subcon teams.
• Support package technology development, including material selection, process development, DOEs, and related activities
• Support package technology development, including material selection, process development, DOEs (Design of Experiments), and related activities.
• Track and drive program milestones to ensure timely development execution.
• Provide design support for thermal/mechanical/electrical simulation analysis.
• Support and contribute to the Global Design, Simulation and Substrate (GDSS) team on continuous improvement efforts such as:Global design alignment activities
  Continuous improvement efforts
  Package design rules
  Package roadmaps
  Competitive Analysis review

Requirements:

• Master (preferred) or Bachelor of Science degree in Electrical Engineering or Mechanical Engineering with a minimum of 5 years of experience in semiconductor packaging industry OR PhD graduates in Electrical Engineering
• Candidates must possess a strong design knowledge of high-density (Wirebond + Flip-Chip) packaging architectures, die stack-up, packaging layout optimization.
• Excellent communication skills, both oral and written in English.
• Excellent problem solving and analytic skills.
• Experience with Cadence SIP, APD and AutoCAD software tools is preferred.
• Good understanding of Silicon IP, floorplan and Signal/Power Integrity is a plus.
• Ability to work independently, prioritize and manage numerous projects with minimum supervision.
• A global perspective and the ability to work in a multicultural environment.

Performs semiconductor design engineering assignments including engineering and designing packaging stack-up, layout checking, documenting specifications, modifying and evaluating packaging risk in the areas of electrical, thermal, mechanical and reliability. Reviews package design requirements, define the package stack-up and conduct final design review. Typically responsible for projects, or portions of projects, to design, fabricate, modify, and evaluate semiconductor Packaging.

Service Desk Engineer

We are looking for experienced full-time Service Desk engineer to provide End User Computing or Service Desk support to APAC Region in Singapore.

Job Responsibilities:

• Provide level 1.5 End User Computing support and well verse in Windows OS
• Diagnosing end-user system failures and implement repair solutions.
• Diagnosing printer and other peripheral devise failures and implement repair solutions.
• Troubleshooting network devices in order to ensure connectivity from the PC to the Network.
• Providing installation and upgrading services of hardware and software.
• Configuration and troubleshooting of phones and other mobile devices, tablets, and PDAs.
• Setup and troubleshooting audio/video equipment such as projectors and video conference equipment

Job Requirement:

• Diploma/Bachelor’s degree in computer science / information technology or relevant field.
• At least 1-1.5 years of relevant working experiences.
• Knowledge of multiple manufacturers and operating systems.
• Excellent troubleshooting capability.
• Using established procedures and working under immediate supervision, performs assigned tasks.
• Work is routine and instructions are usually detailed.
• Resolves routine questions and problems and refers more complex issues to higher levels.
• A good team player.
• Excellent interpersonal skills.
• Customer centric and focus on service excellence.
• Excellent problem-solving and multitasking skills.
• Good verbal and written communication skills and ability to interact with other teams.
• Working location: Central, Singapore

It would be appreciated if you can share with me your interest on the same.

Have a friend or family member who may be interested in taking the next step in their career? Help them out by referring them to Ennovatez.

You can email your resume to us at [email protected]

Job Responsibilities:

• Assist Project Manager in all on-site technical/ engineering matters and authority submissions.
• Prepare submission of shop drawing / Materials / MOS/ Monthly Progress Claims and PM Reports.
• Lead in Site Coordination and execution relating to the construction project.
• Planning of micro scheduling with other trades/disciplines against Master program
• To update structural/architectural/M&E progress with scheduling tools.
• Supervise and monitor projects are carried out in accordance with the company’s operating procedures, quality standards & contractual specifications.
• Ensuring supervisors & foremen meet clients’ regulatory work requirements.
• To check and ensure compliance with TOP checklist
• Responsible for all inspection activities being carried out.
• Ensuring environmental, safety, and health practices are carried out at all times.

Requirements:

• Degree in Civil or Structural Engineering recognized by PE Board/ BCA
• 4-5 years experience in Building Engineering projects
• Experience with Precast/PPVC/MET projects will be a plus
• Proficient in MS Office, AutoCAD, and BIM
• Organized, meticulous with positive work attitude
• Able to work independently and a team player
• Good analytical, supervision, and communication skills
• Completed QM project and a registered Core-trade Foremen/ Supervisor would be an added advantage

Your main responsibilities include:

• Develop and maintain product datasheet testing and characterization test programs for NAND and NOR components
• Working with product reliability engineers to define test flows for individual products
• Provide support to operation team to ensure seamless execution for generated test flow on the tester with live product
• Perform electrical failure analysis for failure validation and characterization

You are encouraged to apply if you can demonstrate some of the qualities listed below:

• Master's or Bachelor's degree in Engineering field. Microelectronic/Electrical/Computer Engineering fields are preferred.
• Positive attitude and self-motivation towards learning and development.
• Good analytical mindset and structured personality.
• Good written and verbal communication skills.
• Hands on experience with C++/Python and Object-Oriented Programming is a plus
• Understanding Automated Test Equipment and flash memory is a plus.
• Fresh graduates are welcome to apply.

Working location:

• 990 Bendemeer Road, Singapore 339942