Key Responsibilities:

• Development of Analog/Mixed-Signal circuits from specifications to prototypes.
• System-level analysis and evaluation, full-chip architecture design, analysis, modeling, simulation, and integration.
• Schematic entry, corner simulation, layout consideration, and post-layout simulation.
• Work closely with the layout engineer to conduct the physical implementation (layout) and chip floor planning.
• Responsible for post-layout extraction and parasitic analysis.
• Able to work with other designers, Chip Architects, and layout engineers to achieve full-chip integration, place and route, top-level verification, and tape out.

Requirements:

• Ph.D./Master/Degree in Electrical Engineering or Microelectronics with excellent technical background in Analog /Mixed-Signal IC design
• Min. 3 years of experience in CMOS Analog IC design and simulation
• Good design experience in Analog IC design involving two or more of the following blocks: low noise pre-amplifier (low offset, high CMRR, high PSRR and bandwidth up to 600MHz), CMOS Gigahertz Oscillator, switched capacitor circuit, LDO, Differential Amplifier, comparator, Opamp, TIA, and Bandgap Reference and high-frequency full-wave rectifier, etc.
• Good design knowledge in ESD and Latch-Up.
• Experience in isolator devices (capacitive-coupler or optical-coupler) and photodetector-associated circuits will be an added advantage.
• Experience with sigma-delta modulators and IO drivers will be an added advantage.
• Good working knowledge of relevant analog IC design and simulation tools (Spice or its equivalent)
• Basic understanding and can develop simple design-related scripts with some common script languages, such as perl, Tcl, matlab or cadence skill etc.
• A team player with good communication skills.
• Able to work independently, flexibly, and creatively.
• Candidates with no prior working experience are welcome to apply.

Key Responsibilities:

• Development of Analog/Mixed-Signal circuits from specifications to prototypes.
• System-Level analysis and evaluation, full-chip architecture design, analysis, modeling, simulation, and integration.
• Schematic entry, corner simulation, layout consideration, and post-layout simulation.
• Work closely with the layout engineer to conduct the physical implementation (layout) and chip floor planning.
• Responsible for post-layout extraction and parasitic analysis.
• Able to work with other designers, Chip Architects, and layout engineers to achieve full-chip integration, place and route, top-level verification, and tape out.

Requirements:

• Ph.D/Master/Degree in Electrical Engineering or Microelectronics with excellent technical background in Analog /Mixed-Signal IC design.
• Min. 5 years of experience in CMOS Analog IC design and simulation.
• Good design experience in Analog IC design involving two or more of the following blocks: low noise pre-amplifier (low offset, high CMRR, high PSRR and bandwidth up to 600MHz), CMOS Gigahertz Oscillator, switched capacitor circuit, LDO, Differential Amplifier, comparator, Opamp, TIA, and Bandgap Reference and high-frequency full-wave rectifier, etc.
• Good design knowledge in ESD and Latch-Up.
• Experience in isolator devices (capacitive-coupler or optical-coupler) and photodetector-associated circuits will be an added advantage.
• Experience with sigma-delta modulators and IO drivers will be an added advantage.
• Good working knowledge of relevant analog IC design and simulation tools (Spice or its equivalent).
• Basic understanding and can develop simple design-related scripts with some common script languages, such as perl, Tcl, matlab or cadence skill etc.
• A team player with good communication skills.
• Able to work independently, flexibly, and creatively.

Key Responsibilities:

• Development of Analog/Mixed-Signal circuits from specifications to prototypes.
• System-level analysis and evaluation, full-chip architecture design, analysis, modeling, simulation, and integration.
• Schematic entry, corner simulation, layout consideration, and post-layout simulation.
• Work closely with the layout engineer to conduct the physical implementation (layout) and chip floor planning.
• Responsible for post-layout extraction and parasitic analysis.
• Able to work with other designers, Chip Architects, and layout engineers to achieve full-chip integration, place and route, top-level verification, and tape out.

Requirements:

• Ph.D/Master/Degree in Electrical Engineering or Microelectronics with excellent technical background in Analog /Mixed-Signal IC design
• Min. 8 years of experience in CMOS Analog IC design and simulation
• Good design experience in Analog IC design involving two or more of the following blocks: low noise pre-amplifier (low offset, high CMRR, high PSRR and bandwidth up to 600MHz), CMOS Gigahertz Oscillator, switched capacitor circuit, LDO, Differential Amplifier, comparator, Opamp, TIA, and Bandgap Reference and high-frequency full-wave rectifier, etc.
• Good design knowledge in ESD and Latch-Up.
• Experience in isolator devices (capacitive-coupler or optical-coupler) and photodetector-associated circuits will be an added advantage.
• Experience with sigma-delta modulators and IO drivers will be an added advantage.
• Good working knowledge of relevant analog IC design and simulation tools (Spice or its equivalent)
• Basic understanding and can develop simple design-related scripts with some common script languages, such as perl, Tcl, matlab or cadence skill etc.
• A team player with good communication skills.
• Able to work independently, flexibly, and creatively.

Responsibilities

Excellent execution on assembly process for 1st NPI success and smooth transfer process from NPI to HVM

• Excellent execution of the qualification of NPI products / packages build that proliferate from the pilot products and packages according to planned timeline
• Full responsible on support NPI business process with process TRA, POS, PFMEA/QCP, risk mitigation and documentations.
• Deliver BIC yield and cost on product NPI with integration of DFx BIC package solution, process guideline and design rules.
• Collaboration with multi-functional team from NPI to LVM/HVM process transfer. On-time execution of NPI Customer samples and Engineering Samples build for new products and packages

SME Process Owner Responsible for Continuous Improvement on Process Yield, Defect Elimination and Process Characterization

• Process owner to perform on-time detection with data analysis for process yield improvement. Lead the defect elimination and continue improvement action, with problem solving methodology, statistical analysis and integration solution decision.
• Process owner to develop process recipe for BIC UPH, conducting process characterization to define process parameters and boundary.
• Continuous develop in depth assembly process technical knowledge, well understand process capability/tolerance//spec limit/CpK, and apply key tools PFMEA/QCP/APC/FDC/Alarm on assembly processes Cz/Development/NPI.
• Global leader for cross team collaboration on network BKM, process recipe spec and recipe standardization/conversion.

Technology enablement and development – Process, Material, Equipment

• Participate and support Product Roadmap, to enable key process capability and technology development to ensure packaging solution is ready prior 1st Qual Silicon deliver.
• Frequent engagement with equipment and material supplier (at least interval of monthly or daily/weekly for process issues)
• Collaboration with Supplier and involvement Supplier Roadmap (Material/Equipment/OSAT), to understand market trends and competitor’s direction, ensure key process technology and capability enablement is in-line.
• Frequent review and participant Competitor Analysis, to understand market trends and competitor’s technology/capability boundary
• Engage and follow PDE business process (TGR, TORB, KEG interlock) for new technology qualification, alignment and safe launch

Teamwork and General expectation

• Trainer/Buddy/Mentor for new team members, build effective relationships within team and cross team (peers, counterpart)
• Regularly review data and direction with supervisor. Demonstrate sound data analysis and judgment. Present reports and findings with appropriate conclusions, recommendations and decision making.
• Develop, or coordinate development of, training materials for existing/new process
• Safety Identify and promptly report hazards, follow safety procedures and area work rules including proper PPE, lockout and chemical safety.

Qualification

• Bachelor or Masters in Electrical Engineering, Materials Science, Chemical Engineering, or related field. A PhD is a plus.
• 1-3 or more years of experience in Semiconductor Manufacturing, Process & Equipment Engineering and/or New Product Introduction.
• Demonstrated track record in baseline performance improvement, business process creation, process simulation techniques, data interpretation skills and proficiency in statistical analysis/method.
• Be able to comfortably work across organizational boundaries and geographies.
• Ability to effectively collaborate with multi-functional organizations to understand needs and translate them into actionable plans, deliverables, and resource requirements.
• Organized, meticulous, and strong focus on results.
• Excellent analytical skills
• Excellent communication and written skills

Advance Packaging Integration – Senior Engineer (Package Development Engineering, Silicon Technology Package Integration) (PDE STPI)

We are looking for a Package Silicon Integrator in Package Development Engineering (PDE) Senior Engineer who will lead and drive Micron’s Packaging Technology Development Projects meeting Time to Market (TTM) business unit needs as well as meeting performance targets for Thermal, Electrical, Mechanical, Reliability and Cost. You will collaborate with Micron’s multi-functional team that include Product Development, Wafer level process, Assembly, Test, Manufacturing and Global Quality. Together, we will be responsible for the designing Test Vehicle Development Strategy, and execution to definition, development, and delivery of state-of-the-art product/packages that will shape the future of advanced computing, automotive and mobile products.

Responsibilities will include, but are not limited to:

• Drive package technology integration activities for the silicon test chip development projects and support NPIs to keep roadmap items on track to meet “go to market” timelines.
• Coordinate core team in Development and NPI space of advanced 2.5D/3D packages and standard packaging to drive material and BOM choices, body sizes, manufacturability, and package constructions to achieve acceptable Design for Manufacturing (DFM) and Design for Reliability (DFR) requirements.
• Evaluate wafer design inclusive of bondpad, scribe, pillars/bump and polyimide, and drive materials and BOM choices such as die thickness and mold compound to meet chip package interaction requirements.
• Drive materials characterization from both package and die components to understand chip package interaction mechanism using TMA, DMA, nanoindentation, and packaging mechanical and thermal stress stimulus.
• Drive novel solutions with silicon design and product teams to recommend the optimum package solutions to meet electrical, mechanical (1st, 2nd, and 3rd level interconnect), thermal, reliability, cost, and other system level requirements.
• Interface closely with multi-functional team that include Product Development, Wafer Level Process, Assembly, Test, Manufacturing and Global Quality and manage the product/package to mass production.

Requirements:

• Bachelor/Masters of Science in physics, materials, mechanical, chemical, or electrical engineering. MS or PhD preferred
• 5+ years of relevant experience in semiconductor manufacturing or a related field, with hands-on experience in semiconductor packaging or Frontend processes, specifically in technology on
• Appreciation for Structured Problem Solving
• Ability to interpret die-, package-, and system-level design and simulation (thermal/mechanical/electrical) methodologies and results
• Knowledge in Chip Package Interaction (CPI)
• Experience and working knowledge with 2.5D/3D heterogeneous integration technologies such as WLFO, SoIC, CoWoS, WoW, InFO, and other chiplet/SiP architectures is a plus
• Experience with wafer bumping, package assembly, substrate technology, BOM selection, testing and product development lifecycle
• Excellent communication skills with the ability to convey complex technical concepts to both technical and non-technical partners
• Demonstrated leadership experience in guiding multi-functional teams and driving technical excellence

Keen on the role? Apply now!

Advance Packaging Integration – Senior Engineer (Package Development Engineering, Silicon Technology Package Integration) (PDE STPI)

We are looking for a Package Silicon Integrator in Package Development Engineering (PDE) Senior Engineer who will lead and drive Micron’s Packaging Technology Development Projects meeting Time to Market (TTM) business unit needs as well as meeting performance targets for Thermal, Electrical, Mechanical, Reliability and Cost. You will collaborate with Micron’s multi-functional team that include Product Development, Wafer level process, Assembly, Test, Manufacturing and Global Quality. Together, we will be responsible for the designing Test Vehicle Development Strategy, and execution to definition, development, and delivery of state-of-the-art product/packages that will shape the future of advanced computing, automotive and mobile products.

Responsibilities will include, but are not limited to:

• Drive package technology integration activities for the silicon test chip development projects and support NPIs to keep roadmap items on track to meet “go to market” timelines.
• Coordinate core team in Development and NPI space of advanced 2.5D/3D packages and standard packaging to drive material and BOM choices, body sizes, manufacturability, and package constructions to achieve acceptable Design for Manufacturing (DFM) and Design for Reliability (DFR) requirements.
• Evaluate wafer design inclusive of bondpad, scribe, pillars/bump and polyimide, and drive materials and BOM choices such as die thickness and mold compound to meet chip package interaction requirements.
• Drive materials characterization from both package and die components to understand chip package interaction mechanism using TMA, DMA, nanoindentation, and packaging mechanical and thermal stress stimulus.
• Drive novel solutions with silicon design and product teams to recommend the optimum package solutions to meet electrical, mechanical (1st, 2nd, and 3rd level interconnect), thermal, reliability, cost, and other system level requirements.
• Interface closely with multi-functional team that include Product Development, Wafer Level Process, Assembly, Test, Manufacturing and Global Quality and manage the product/package to mass production.

Requirements:

• Bachelor/Masters of Science in physics, materials, mechanical, chemical, or electrical engineering. MS or PhD preferred
• 5+ years of relevant experience in semiconductor manufacturing or a related field, with hands-on experience in semiconductor packaging or Frontend processes, specifically in technology on
• Appreciation for Structured Problem Solving
• Ability to interpret die-, package-, and system-level design and simulation (thermal/mechanical/electrical) methodologies and results
• Knowledge in Chip Package Interaction (CPI)
• Experience and working knowledge with 2.5D/3D heterogeneous integration technologies such as WLFO, SoIC, CoWoS, WoW, InFO, and other chiplet/SiP architectures is a plus
• Experience with wafer bumping, package assembly, substrate technology, BOM selection, testing and product development lifecycle
• Excellent communication skills with the ability to convey complex technical concepts to both technical and non-technical partners
• Demonstrated leadership experience in guiding multi-functional teams and driving technical excellence

Keen on the role? Apply now!

Summary:

• Basic salary up to $4500
• Commission + Variable bonus
• Transport allowances or reimbursement
• 5 days work week @ 8.30 - 5.30pm
• Location: Tai Seng (walkable from MRT station)
• Opportunity to travel overseas
• Sales or engineering experience / background

Key Responsibilities:

• Identify and approach potential clients via cold calling, proposal emails, networking and etc
• Establish and maintain relationships with clients to foster long-term business
• Prepare quotes and proposal tailored to client's needs
• Use knowledge of products and services to recommend solutions
• Coordinate with internal departments to resolve operational issues
• Address customer concerns related to products
• Other ad hoc duties

Key Requirements:

• Min Nitec in Electrical / Electronic engineering or equivalent
• 2 year of sales / engineering experience
• Willing to travel overseas

Interested applicants, please submit your updated resume in MS Words / PDF format by using the APPLY NOW BUTTON.

By submitting your personal data and/or resume, you give consent to the collection, use, and disclosure of your personal data and/or resume by the company (or its agent) for the purpose of the processing and administration by the company relating to this job application.

Please be informed that only shortlisted candidates will be notified.

Your recruiter for this job: Stella

WhatsApp me @ 8772 4117 for a prompt response to your enquiry!

Stella Aw Yong See Hui | R24121552

Recruit Now Singapore Pte Ltd | EA No: 21C0845

Service Desk Engineer

We are looking for experienced full-time Service Desk engineer to provide End User Computing, Deskside support and Service Desk support to APAC Region in Singapore.

Job Responsibilities:

• Provide level 2 End User Computing support and well verse in Windows OS.
• Good Hardware and software troubleshooting skills for PC.
• Break fix and IMAC support for end user deskside equipment.
• Basic troubleshooting skills for IOS and android devices.
• Handles asset and peripherals inventory management.
• Meeting room and AV equipment knowledge.
• Provide smart hands support for networks and servers
• Familiar with Service Desk ticketing systems and process.
• VIP support.
• Change Management, including review new and implemented changes, chair CAB, review change schedule, maintain dashboard, prepare comms.
• Incident Management, including analysing trends, incident workarounds, monitoring aged incidents.
• Major Incident Management, including communication, being part of the Incident Response Team, managing suppliers
• Problem Management, including chairing any problem meetings, managing active problems, highlighting new problems.
• Release Management – liaising with the testers, vendor, tracking features and defects
• Service Request Management – documenting processes, analysing trends, identifying service improvements, working with teams to design new processes
• Continual Service Improvement – being able to highlight areas of improvement for effectiveness and efficiency
• Service Reporting
• ServiceNow – to assist with the day-to-day management of the tool, including working on incidents and requests

Technical Skills & Qualifications Required:

• Good knowledge of ITIL
• Good knowledge of ServiceNow
• Good knowledge/experience of using the Microsoft suite, specifically including SharePoint , Visio and Excel
• Exposure to/familiarity with automation

Job Requirement:

• Diploma/Bachelor’s degree in computer science / information technology or relevant field.
• Proven work experience as a desktop support engineer or support technician.
• At least 3 years of IT deskside support experiences.
• A good team player.
• Excellent verbal and written communication skills, and ability to communicate with different audiences and write a range of document types – procedures, comms, training modules.
• Customer centric and focus on service excellence.
• Excellent problem-solving and multitasking skills.
• Working location: Central, Singapore

It would be appreciated if you can share with me your interest on the same.

Have a friend or family member who may be interested in taking the next step in their career? Help them out by referring them to Ennovatez.

You can email your resume to us at [email protected]

Salary : $5,000 - $7,000 + AWS

Location : Commonwealth

Job Description:

● Design, configure, deploy, and maintain Wintel and Linux server environments, including Windows Server (2019, 2022) and Linux distributions (RHEL, SUSE). Conduct server hardening

● Lead virtualization initiatives using industry-standard platforms such as VMware vSphere, Hyper-V, or KVM.

● Design and manage Storage Area Networks (SAN/NAS), ensuring data availability, integrity, and optimal performance.

● Ensure compliance with industry standards and regulations related to infrastructure and data storage.

● Implement and administer key management and encryption.

● Implement and administer Active Directory, including user accounts, group policies, security settings, and domain controllers.

● Implement and administer AD Public Key Infrastructure and Network Policy Server RADIUS services.

● Implement and administer monitoring solutions such as eG Innovations, PRTG, Splunk, or Kiwi Syslog server.

● Implement and administer backup solutions like Veeam or Acronis.

● Implement advanced system monitoring solutions to proactively identify and resolve performance and security issues.

● Investigate and resolve complex technical issues related to Windows Server systems, collaborating with teams and vendors.

● Coordinate with third-party vendors, IT providers, and external support for effective service delivery.

Job Requirements:

● Bachelor's degree in Computer Science, Information Systems, Information Technology, or a related field.

● Minimum of 5 years of experience in IT infrastructure engineering with a focus on Windows

Server administration.

● Storage implementation experience with Dell EMC / NetApp

● Experience with Wintel servers (Dell), VMware, Microsoft server products, Symantec

● Proven experience in designing on-prem data centre architectures.

● Proficiency in configuring, managing, and troubleshooting Windows Server environments.

● In-depth knowledge of Active Directory, Group Policies, and security best practices.

● Familiarity with virtualization technologies such as VMware or Hyper-V.

● Experience with scripting and automation tools.

● Relevant certifications (e.g., MCSA, MCSE, VCP) are a plus.

If you do not possess the above experience, your application will still be considered on individual merits and you may be contacted for other opportunities.

By submitting your personal data and/or resume, you give consent to the collection, use, and disclosure of your personal data and/or resume by the company (or its agent) for the purpose of the processing and administration by the company relating to this job application.

Please be notified that only shortlisted candidates will be notified.

EA Personnel.: Chan Jun Wei

EA Registered no.: R1543992

Recruit Now Singapore Pte Ltd

EA License no.: 21C0845

Responsibilities

1. Follow up and track all events/incidents until closure
2. Perform initial triage of cyber threat intelligence to assess relevance of technical indicators (IOC) to organizational assets.
3. Perform escalation of suspicious security incident after verification with a senior security analyst
4. Respond to on-call escalation after office hours
5. Validation of event against change or access request system(s)
6. Support all audit fieldwork require by appointed auditors when necessary.
7. Assist cybersecurity team on all related cyber security remediation activities.
8. Manage all use cases, reports and dashboards on SIEM platform.
9. Manage all playbooks, automation scripts, integrations, dashboards and reports on SOAR platform.
10. Perform review to detect and identify any suspicious activities.

Requirements

1. Degree/Diploma in IT, Cybersecurity or a related field of study.
2. 3-7 years of relevant experience in cybersecurity operations.
3. Knowledge in network, Linux and Windows infrastructure.
4. Knowledge in Cloud infrastructure.
5. Knowledge and experience in SIEM and SOAR platforms.
6. Experience working in SOC environment.
7. Experience in security, network and cyber threat analysis.

Preferred Skills / Qualities

1. Experience working in financial services sector would be advantageous.
2. Professional information technology/security certifications such as ITIL, CCNA and CEH will be preferred but related qualification (i.e. GCIH, GCIA, CISSP etc.) will be an advantage

Other Special Working Conditions

1. You may be required to work either at Ensign’s or a client’s work premise. As such, you may be required to adhere to any telecommuting working arrangements when required.
2. You may be required to perform 12-hour shift duties (2 days’ work with 2 off-days) if you are not seconded to a client. Shift working hours are from 0830H to 2030H, and 2030H to 0830H. Shift patterns and duration may vary from time to time

Job Description

• Understanding of Project Specifications, construction drawings and to ensure that all site activities comply with the regulations and client’s requirements
• Monitor site works to ensure the method statements and work procedure are strictly followed.
• Competent in carrying out supervision of structural works by identifying any non-conformity of contractor’s work site
• Ensure the Builder (incl. technical supervisors) executes the work in accordance to Consultant’s instructions
• Check drawings for discrepancies and highlight to Consultant, suggesting possible solutions to prevent delays
• Conduct quality inspections and quality control of materials used for the project
• To ensure proper documentation of site inspection records, safety records and approved /as-built drawings
• Maintaining and updating site records on progress of work, housekeeping and preparing reports
• Verify the contractors’ progress payment, claim in terms of work done and materials/equipment delivered and stored on site
• Witness all the inspection, testing and commissioning sessions performed by the contractors to ensure compliance with designs and specifications
• Report to project QP / Project Consultants Team on quality and progress
• Supervision of demolition of basement/foundation, ERSS construction and all other design works
• To manage & coordinate with the site supervisors (incl. RTO) with respect to C&S engineering works, architectural and M&E engineering works
• Possesses a complete understanding of local requirements, especially to comply with BCA's criteria for build-ability and safety assurance system
• To carry out regular site checks on Builder and ensure compliance on health and work safety in accordance with MOM
• To attend site, progress, variation and coordination meetings.
• Period: 12 months
• Start from: January 2025

Requirements:

• min. Degree in Civil / Structural Engineering or equivalent
• At least 8 years of relevant experience in supervision of Hospital and Architecture work
• Resident Engineer Certificate accredited by IES / ACES is a must, candidate without RE certificate need not apply
• Conversant in statutory code and requirements
• Good team player with strong interpersonal and communications skills essential

Please indicate project involved, expected salary and notice period required in CV.

We regret that only short-listed candidates will be notified.

For more posting, please refer to https://www.facebook.com/profile.php?id=61566487478500&mibextid=LQQJ4d

Monthly basic salary: $3200 - $4500

Working hours: 8.30am to 6pm, 5 days work week

Location: Serangoon

Job Description

● Working with Process Engineer & Engineering team on QC requirement

● Documenting inspection criteria and quality plan

● Work with QA, Process and Product team on corrective action with quality issue

● Work with Process team on in-process audit and FQC audit

Requirements:

● Minimum Diploma in Manufacturing /Quality Engineering

● At least 1 year of relevant working experience in Electronics Product Manufacturing environment

● Control of Supplier Quality Assurance (SQA)

● Quality control of in-coming, in-process and out-going products

● Knowledge of ISO 9001, 14001, 13485 & 45001, FDA requirement

● Able to understand IPC requirement in PCB Assembly, quality requirement of plastic molding, die casting, extrusion, metal stamping and machining parts

● Able to converse with the China suppliers

If you do not possess the above experience, your application will still be considered on individual merits and you may be contacted for other opportunities.

By submitting your personal data and/or resume, you give consent to the collection, use, and disclosure of your personal data and/or resume by the company (or its agent) for the purpose of the processing and administration by the company relating to this job application.

Please be notified that only shortlisted candidates will be notified.

EA Personnel.: Chan Jun Wei

EA Registered no.: R1543992

Recruit Now Singapore Pte Ltd

EA License no.: 21C0845

Office Location : Tai Seng

Working hours : Monday to Friday | 8am to 6pm | Saturday 8am to 12pm

Salary (commensurate with experience) : Up to $5,000 + Variable Bonus + Annual Leaves + Medical Benefits

Industry : Construction Sector - A&A / Building Works

Job Description

•Check and analysis drawings, authority requirements and tender specifications

•Check site installation whether it is in accordance to design and standards

•Oversee the projects, ensure compliance of contracts and the drawings with regulatory specifications.

•Able to coordinate with owners, architects, consultants, project managers, sub-contractors and suppliers.

•Attend meetings with architects and consultants

•Other ad-hoc duties as assigned

Job Requirements: Possess at least diploma in Electrical Engineering and Mechanical Engineering (M&E) or equivalent

•However, entry level are encouraged to apply, from recognized University by Singapore PE Board as training will be provided.

•Good operational planning for construction projects

•Good in communication and written abilities

•Required skill: Able to use Microsoft Project to present schedule to the client

•Knowledge in Construction and Renovation.

•Skills required: Autocad

Maxhunt Resource Pte Ltd | EA Licence: 22C1322
Loh Wing Sheng | Registration No: R22110239

Responsibilities:

• Attend the Toolbox Meeting to explain daily tasks and coordinate work for Shimizu workers and subcontractors.
• Create a comprehensive schedule for the construction area.
• Prepare Method Statements and obtain necessary approvals from consultants.
• Collaborate with RSS teams to arrange inspections and prepare relevant inspection forms.
• Participate in daily coordination meetings to align activities with subcontractors and other areas.
• Report daily progress to the Quantity Surveyor
• Oversee CBP (Concrete Block Paving) construction, including temporary works.
• Manage RC (Reinforced Concrete) & Steel construction, ensuring temporary works are in place.
• Supervise finishing and external work construction, incorporating temporary works as needed.

Requirements:

• Bachelor of Science in Civil Engineering or equivalent
• minimum of 10 years of experience in construction management is essential, demonstrating a solid understanding of project oversight.
• Proficiency in Microsoft Excel, Word, and Office Suite is necessary for documentation, reporting, and scheduling tasks.

Application Engineer

Responsibilities

• Responsible for software prototyping, system/module design, coding deployment and recommending solutions for various SCADA projects
• Constantly review and improve on existing codes
• Design, build and maintain efficient codes
• Communicate with all internal levels including customers and our contractors to clarify technical issues
• Co-ordinate with other disciplines and execute the project efficiency in order to meet schedule
• Perform Factory Acceptance Test (FAT) in accordance to the requirements set out in the Vendor's Tender Document
• Perform preventive maintenance of server equipment
• Perform troubleshooting and production support at customers' sites

Requirements:

• Diploma or Degree in Computer/Electrical/Electronic Science or Engineering
• At least 1-2 years hands on working experience in system maintenance
• Has knowledge in computer network, Windows and Unix environment and MS SQL database
• Experience in CCTV. Card Access, Fence Intrusion system andLabview implementation is an added advantage
• Able to work effectively in a multidisciplinary environment
• Self-starter and team player with good communication and interpersonal skills

SALARY:

Junior - ($4,200-$5,000)

Senior - ($5,000-$6,000)

LOCATION:

Ang Mo Kio / Yio Chu Kang / Central

Job Description

•Manage & Lead the electrical team.

•Perform engineering duties such as design, engineering calculations, planning, tender.

Preparation/evaluations as part of the engineering project team

•Team development

•QA/QC documentation review of engineering deliverables

•Liaison with clients, project managers, architects, contractors

•Resolve any technical problems faced during project design and/or construction stages

•Suggests ways to increase revenues and efficiency.

•Testing & Commissioning of the ACMV Electrical Systems.

•Ensure the team follows all electrical codes and standards.

Job Requirements

•Any qualification in a relevant engineering field with minimum 5 years of related working experience

in the Construction Electrical Field associated with ACMV / Electrical.

•Engineering design of commercial buildings, major infrastructure transportation projects and

mixed-use developments

•Possess design experience and good understanding of ACMV / Electrical technical systems and

procedures:

•Possess knowledge on all cabling, loading and sizing calculations and equipment selections such as

cable, generators, panels, etc.

•Develop, design through establishing, design briefs, design reports, calculations, schematics,

schedules, specifications, concept, Preliminary, Detailed and Construction Engineering Designs

•Productions of drawings and developing models

•Site Experience, Testing & Commissioning Experience

•Having experience working with Infrastructure Projects would be an added advantage.

If you do not possess the above experience, your application will still be considered on individual merits and you may be contacted for other opportunities.

By submitting your personal data and/or resume, you give consent to the collection, use, and disclosure of your personal data and/or resume by the company (or its agent) for the purpose of the processing and administration by the company relating to this job application.

Please be notified that only shortlisted candidates will be notified.

EA Personnel.: Chan Jun Wei

EA Registered no.: R1543992

Recruit Now Singapore Pte Ltd

EA License no.: 21C0845

Responsibilities:

• To lead and drive the requirements gathering process.
• To lead and manage a small team of developers to deliver the modules to develop web-based application systems.
• Participate in the design and development of web applications based on Ecquaria’s product (J2EE-based).
• Lead and manage the user acceptance testing process.
• Implement, customize, test, document and maintain software applications.
• Ensure that the modules delivered are according to the specifications and are of high quality.

Requirements:

• A Degree/Diploma in Computer Science with at least 3 years' software development experience in Internet technology in Win NT, UNIX or LINUX platform
• Those with leadership experience may be considered for the Project Lead position.
• Technical skills include proven object-oriented programming experience with Java and C++ together with extensive RDBMS through JDBC
• Experience in J2EE, Web Services and XML will be advantageous
• Experience in Elixir reporting solutions will be advantageous
• Very strong in SQL
• Data analysis skill will be an added advantage, although this is not compulsory to have.
• Good interpersonal skills

Toppan Ecquaria is an equal opportunity employer and values diversity within our company. We welcome all interested candidates to apply for this position, however, we regret to inform that only shortlisted candidates will be contacted by us for an interview.

Find us at www.topppanecquaria.com or www.linkedin.com/company/toppan-ecquaria

For more career opportunities, please visit our career site at:- https://toppanecquaria.com/careers/job-openings?utm_source=Jobstreet&utm_medium=Page&utm_campaign=2020

(Please copy & paste the above link onto your browser)

Department Overview:

Aristos Solutions BU focus on creating customised state-of-the-art automation solutions for all possible industries. By utilising Akribis Systems' direct drive linear and rotary system, we are able to achieve high speed and high precision assembly, inspection or testing solution for our customer.

Job Description

• Application support and setup of motion control system, machine vision system, signal and control devices, used in motion control products and automation equipment
• Design of electrical schematic diagram, single line diagram, cable harness and build, for motion controller systems, device and sensors, used in Industrial automation machine and equipment
• Perform DOE for risk mitigation and feasibility studies on design concept
• Creation of Bill of Material of cables assembly and electrical component used in project
• Review and guides the development of product manual and application notes for new products/applications
• Evaluate and recommend product / solutions for new applications according to customer’s specification
• Understand and help to resolve application issues encountered in projects and by customer
• Work with team to fomulate work instructions
• Machine commisioning in factory/customer Site
• Ensure design meets project required milestone and timeline
• Provide training to customer
• Overseas travel is required with short notice period

Qualifications

• Candidate must process at least Bachelor Degree in Mechanical / Electrical / Mechatronic Engineering or equivalent OR-Fresh graduates with relevant knowledge in their course of study are welcome to apply.
• Knowledge in programming and / or experience in automation field are added advantage
• Preferably with 1-2 Year(s) of working experience in Industrial Automation, Semiconductor or any other related field/industry is required for this position.

Other Information

Skillset(s) Requirement:

• Required Knowledge: Power sizing, power distribution, motion control (advantage)
• Required Skill(s): AutoCAD, Solidworks, Motion control software (advantage)

Attributes:

• Strong communication and analytical skills, energetic and willing to work hard
• Ability to prioritize and multi-task in a fast-paced environment
• Responsible, Positive Attitude and able to work well as a team
• Possess good initiative and good critical thinking skill to solve issue at root cause level