Job Description: Semiconductor Process Integration Engineer

Position Overview: We are seeking a highly-skilled Process Integration Engineer to join our team. The primary responsibility of this role is to develop and deliver advanced process modules with our partner foundry facilities for optoelectronic integrated circuits (ICs). The ideal candidate will have a strong background in semiconductor process technology and a proven track record of working effectively with external partners.

Key Responsibilities:

1. Process Development: You will join an existing team to design and develop semiconductor process flows to for a proprietary CMOS + III-V monolithic integration platform. You will integrate various process modules into a cohesive manufacturing process, optimizing for performance, yield, and reliability.

2. Collaboration with Fab Partners: You will be responsible for management of projects under your purview with one or more fab partners, including aspects such as budgeting, schedule and resource planning. You will work closely with fab partners to develop, optimize, and implement process modules for optoelectronic ICs, ensuring compatibility with fab partner manufacturing protocols. You will provide technical support and feedback to fab partners, troubleshooting process-related issues and implementing corrective actions. You may also be embedded within the fab partner’s team for specific durations during critical phases of the process development effort.

3. Data Analysis: You will analyze process data to identify trends, root causes of issues, and opportunities for process improvements. You will also design experiments and test plans to retire technical risks and resolve process issues. You will also be responsible for maintaining detailed documentation of process development activities, including process flows, specifications, and test results.

As a Process Control System Engineer you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. Additional responsibilities include coordinating and carrying out process, equipment and material evaluation/optimization to implement changes at process step, leading and participating in yield improvement and cost reduction activities, handling new process baseline qualifications and managing, auditing and liaising with material suppliers to achieve quality, cost and risk management objectives.

As a PDE Network Engineering Process Control System (PCS) Engineer/Senior Engineer, we will be responsible to develop smart manufacturing solutions towards the Industry 4.0 standard. We will gain exposure and knowledge in many cutting-edge areas including Machine Learning, Advanced Control Solutions and Deep Learning. As a PDE PCS Engineer, we will have the opportunity to develop a complete solution that starts from requirements gathering, data analysis and modeling with big data platform, followed by system development and integration; and then network wide implementation. The work we do directly affects the bottom line of the entire company by providing scrap/excursion control, Statistical Process Control (SPC), Advanced Process Control (APC or Run-to-Run), Fault Detection and Classification (FDC), and overall enhanced process capability. We will meet regularly and team with Process areas to understand their tools, processes, and challenges and work with them to create process control models, strategies, and other methods for ensuring quality output.

Responsibilities

• We develop, implement and improve smart control solutions for optimum manufacturing performances.
• We provide technical oversight, guidance and support for process control implementation
• We conduct intensive data analysis and modeling to identify sources of variation in the process and translate it into control solutions.
• We support PDE KEG team in Classification, Characterization and Categorization and define Data Collection Requirements, Perform Integration and Setup Data Collection in E3 Environment.
• We define Analysis and setup Requirements and Setup Limits and OCAP and engage in periodic review with PCS team and network on BKM practices.
• We develop and deliver training on control systems and related topics.

Requirement

• PhD, Masters/Bachelor’s Degree in Electrical and Electronics Engineering/Computer Science/Statistics/ Mathematics/Physics
• At least 4 years of experience in semiconductor manufacturing advanced process control.
• Experience and knowledge in Programming and Data Analysis. Preferred experience in Python/R/SQL/Hadoop eco-system and/or in the development of web-based applications
• Familiar with Machine Learning.
• Good communication and interpersonal social skills.
• Excellent problem solving and analytical skills.
• Excellent verbal and written communications skills. Good interpersonal skill and a good teammate.
• Excellent Project management skills.
• Ambitious and ability to multi-task and balance dynamic priorities.
• Ability to participate in a multi-functional team environment.
• Willing and capable of international travel, as needed, to accomplish your objectives.

Keen on the role? Apply now!

Job Description:

Be part of an exciting team working on cutting-edge advanced packaging process technologies. Participate in process development and integration solution to enable advanced packaging process technologies in the world of mobile, IoT, consumer and high-performance computing area. Partner and work with various teams from inside and outside of IME to help develop leading-edge packaging solutions for our customers, taking the solutions from concept to mass production. Responsibilities will include assisting in operations support in clean room to make sure projects are completed successfully and delivered on time.

This position is based in Singapore.

Responsibilities:

• Operate semiconductor equipment to perform processes, measurement, and inspection of wafers. (Include equipment setup, loading and unloading of wafers)
• Monitor basic equipment/process errors and perform recovery.
• Work with internal and external parties to align for tool time, execute process sequence and collect data to feedback to integration owner.
• Logistically transport wafer lots between equipment within cleanroom and between worksites.
• Identify and address potential areas for improvements such as cycle time, utilization, and cost.
• Perform chemical change/ top-up for equipment under supervision.
• Understand and follow all Environmental, Health and Safety (EHS) procedures and requirements.
• The candidate may be required to perform shift work (Mon-Fri).

Experience:

• NITEC/ Diploma in Electrical/Mechanical/Chemical Engineering
• Basic understanding on semiconductor process is preferred
• 1-3 years of experience in semiconductor processes (Litho, Etch, CVD, PVD, Plating, Metrology etc.) will be added advantages

Job Description:

Be part of an exciting team working on cutting-edge advanced packaging process technologies. Participate in process development and integration solution to enable advanced packaging process technologies in the world of mobile, IoT, consumer and high-performance computing area. Partner and work with various teams from inside and outside of IME to help develop leading-edge packaging solutions for our customers, taking the solutions from concept to mass production. Responsibilities will include assisting in operations support in clean room to make sure projects are completed successfully and delivered on time.

This position is based in Singapore.

Responsibilities:

• Operate semiconductor equipment to perform processes, measurement, and inspection of wafers. (Include equipment setup, loading and unloading of wafers)
• Monitor basic equipment/process errors and perform recovery.
• Work with internal and external parties to align for tool time, execute process sequence and collect data to feedback to integration owner.
• Logistically transport wafer lots between equipment within cleanroom and between worksites.
• Identify and address potential areas for improvements such as cycle time, utilization, and cost.
• Perform chemical change/ top-up for equipment under supervision.
• Understand and follow all Environmental, Health and Safety (EHS) procedures and requirements.
• The candidate may be required to perform shift work (Mon-Fri).

Experience:

• NITEC/ Diploma in Electrical/Mechanical/Chemical Engineering
• Basic understanding on semiconductor process is preferred
• 1-3 years of experience in semiconductor processes (Litho, Etch, CVD, PVD, Plating, Metrology etc.) will be added advantages

Job Description:

Be part of an exciting team working on cutting-edge advanced packaging process technologies. Participate in process development and integration solution to enable advanced packaging process technologies in the world of mobile, IoT, consumer and high-performance computing area. Partner and work with various teams from inside and outside of IME to help develop leading-edge packaging solutions for our customers, taking the solutions from concept to mass production. Responsibilities will include assisting in operations support in clean room to make sure projects are completed successfully and delivered on time.

This position is based in Singapore.

Responsibilities:

• Operate semiconductor equipment to perform processes, measurement, and inspection of wafers. (Include equipment setup, loading and unloading of wafers)
• Monitor basic equipment/process errors and perform recovery.
• Work with internal and external parties to align for tool time, execute process sequence and collect data to feedback to integration owner.
• Logistically transport wafer lots between equipment within cleanroom and between worksites.
• Identify and address potential areas for improvements such as cycle time, utilization, and cost.
• Perform chemical change/ top-up for equipment under supervision.
• Understand and follow all Environmental, Health and Safety (EHS) procedures and requirements.
• The candidate may be required to perform shift work (Mon-Fri).

Experience:

• NITEC/ Diploma in Electrical/Mechanical/Chemical Engineering
• Basic understanding on semiconductor process is preferred
• 1-3 years of experience in semiconductor processes (Litho, Etch, CVD, PVD, Plating, Metrology etc.) will be added advantages

Job Description:

Candidate will be part of Far-Backend Of Line (Far-BEOL) team of process module engineers, advancing specialty technologies at IME. His or her main roles and responsibilities include:

• Develop and support Chemical Mechanical Planarization (CMP) unit process capabilities for silicon photonics, flat optics, advanced packaging, MEMS, and wide bandgap semiconductor applications.
• Deliver innovations involving process methodologies, materials, or approach, and generate intellectual property related to various aspects of CMP.
• Participate as team member with process integration teams to actively support CMP process development, optimization and troubleshooting for various industry and grant projects.
• File patents/know-hows on new development activities.
• Publish research findings in prestigious journals and conferences.

Job Requirement:

• Masters with specialization in Electronics / Microelectronics / Materials Engineering / Chemical Engineering / Materials Science/ Chemistry / Physics or equivalent.
• Minimum 5 years of experience in CMP technologies, preferably in an industrial setting.
• Prior hands-on experience working on industry-scale 200 mm or 300 mm CMP equipment platforms (e.g., AMAT or Ebara platforms), with in-depth technical knowledge in process development, materials, and inline process control related to CMP.
• Knowledge of silicon photonics, advanced packaging, MEMS, or wide bandgap semiconductor technology platforms would be a plus, but not mandatory.
• Strong experimental design (DOE) and data analysis skills is preferred.
• Good interpersonal and strong demonstrated skills in collaborating with internal and external stakeholders.
• At least 2 years of demonstrated experience in managing projects of moderate complexity is preferred
• Good analytical skills and oral/written communication skills, with ability to deliver clear and concise messages to both internal and external stakeholders.
• Self-driven with strong interest in next-generation applications of CMP technologies and industry trends.

Job Description:

Candidate will be part of Far-Backend Of Line (Far-BEOL) team of process module engineers, advancing specialty technologies at IME. His or her main roles and responsibilities include:

• Develop and support Chemical Mechanical Planarization (CMP) unit process capabilities for silicon photonics, flat optics, advanced packaging, MEMS, and wide bandgap semiconductor applications.
• Deliver innovations involving process methodologies, materials, or approach, and generate intellectual property related to various aspects of CMP.
• Participate as team member with process integration teams to actively support CMP process development, optimization and troubleshooting for various industry and grant projects.
• File patents/know-hows on new development activities.
• Publish research findings in prestigious journals and conferences.

Job Requirement:

• Masters with specialization in Electronics / Microelectronics / Materials Engineering / Chemical Engineering / Materials Science/ Chemistry / Physics or equivalent.
• Minimum 5 years of experience in CMP technologies, preferably in an industrial setting.
• Prior hands-on experience working on industry-scale 200 mm or 300 mm CMP equipment platforms (e.g., AMAT or Ebara platforms), with in-depth technical knowledge in process development, materials, and inline process control related to CMP.
• Knowledge of silicon photonics, advanced packaging, MEMS, or wide bandgap semiconductor technology platforms would be a plus, but not mandatory.
• Strong experimental design (DOE) and data analysis skills is preferred.
• Good interpersonal and strong demonstrated skills in collaborating with internal and external stakeholders.
• At least 2 years of demonstrated experience in managing projects of moderate complexity is preferred
• Good analytical skills and oral/written communication skills, with ability to deliver clear and concise messages to both internal and external stakeholders.
• Self-driven with strong interest in next-generation applications of CMP technologies and industry trends.

Responsibilities:

• Be a member of the Process Engineering Team for top quality servers & storage products, maintain and update end to end production process & value stream mapping, cover end to end production process for better efficiencies thru process optimization, layout/work station enhancement as well as smart factory / automation projects
• Cooperate with the NPI PM team, Test Engineers, Quality, Production, Planning, Logistic and other departments to support production, including audit
• Support NPI ramp with propose new equipment, manage equipment readiness to support LVO, Engineering Change and customer requirement
• Ability to perform first level process issue triage and resolve issues locally where possible, analyze and identify process issue and deficiencies with follow up actions for resolution and improvement to meet goal for cost, quality and delivery.
• Escalate any process issue found to have major impact on quality, process and or cycle time if not able to resolve locally

Skills and Requirements:

• Bachelor’s Degree in Electrical / Electronics Engineering
• 3+ years of relevant work experience is preferred
• Strong IT background, experience with SAP is an advantage
• Technically know-how on Kaizen, 6 Sigma, PFMEA, DOE and/or 8D is a plus
• Experience with server & storage product is an advantage

OTHER INFO:-

• Work Location: 452 Alexandra Road, Singapore 119961 [Near Labrador Park MRT]
• Working Days / Hours: 8am to 5.30pm / 8.30am to 6pm (Mondays to Fridays)

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Celestica is an equal opportunity employer. All qualified applicants will receive consideration for employment and will not be discriminated against on any protected status (including race, religion, national origin, gender, sexual orientation, age, marital status, veteran or disability status or other characteristics protected by law).

At Celestica we are committed to fostering an inclusive, accessible environment, where all employees and customers feel valued, respected and supported. Special arrangements can be made for candidates who need it throughout the hiring process. Please indicate your needs and we will work with you to meet them.

COMPANY OVERVIEW:
Celestica (NYSE, TSX: CLS) enables the world’s best brands. Through our recognized customer-centric approach, we partner with leading companies in Aerospace and Defense, Communications, Enterprise, HealthTech, Industrial, Capital Equipment and Energy to deliver solutions for their most complex challenges. As a leader in design, manufacturing, hardware platform and supply chain solutions, Celestica brings global expertise and insight at every stage of product development – from drawing board to full-scale production and after-market services for products from advanced medical devices, to highly engineered aviation systems, to next-generation hardware platform solutions for the Cloud.

Headquartered in Toronto, with talented teams spanning 40+ locations in 13 countries across the Americas, Europe and Asia, we imagine, develop and deliver a better future with our customers.

Celestica would like to thank all applicants, however, only qualified applicants will be contacted.

Celestica does not accept unsolicited resumes from recruitment agencies or fee based recruitment services.

Duties and Responsibilities - Process Integration

• Plan the integration flow with device designers
• Draft the runsheet by translating the flow into process steps and capturing necessary shortloops
• Perform the DoE with process module teams
• Track the lot and report the progress
• Identify failure modes/root causes and address the problems by proposing changes
• Must be good at documentation and written communication

Job Requirements

• Bachelor's degree in Microelectronics, Electrical, Mechanical, or Chemical Engineering.
• A basic understanding of the semiconductor processes is preferred.
• 3-5 years of hands-on experience in semiconductor processes (Diffusion, Wet Clean, CMP, ECP, Litho, Etch, CVD, PVD, etc.) will add advantages.
• Must be a team worker with the project stakeholders (device design, process module, and equipment/facility).

Product area

The name Google came from "googol," a mathematical term for the number 1 followed by 100 zeros. And nobody at Google loves big numbers like the Finance team when providing in depth analysis on all manner of strategic decisions across Google products. From developing forward-thinking analysis to generating management reports to scaling our automated financial processes, the Finance organization is an important partner and advisor to the business.

Job description

The Finance Operations team manages Google's cash transactions on a global basis and ensures that Google's incoming and outgoing cash processes are controlled, effective and efficient. As a member of this team, you'll find innovative ways to manage our complex set of transactions. You'll make processes more efficient and scalable, work to ensure the highest level of quality of our operations, and proactively minimize operational risk. Externally, you collaborate with our extended workforce partners and internally, you will collaborate across the multiple areas of the Financial Operations team.

Additional job description

The Revenue to Cash Operations team manages Google's Revenue-to-Cash processes globally across all product areas, including Ads, Digital Goods, Cloud, and Hardware. We ensure Google’s revenues are transformed to cash in an efficient, controlled and compliant manner. Our team powers Google's ambitious growth agenda by creating innovative ways to manage our complex set of billing and payment transactions, making processes more efficient and scalable, minimizing operational risk, integrating Google acquisitions and new products, connecting with new payment and invoicing partners and so much more.

Qualifications

Job responsibilities

• Design the strategy for your area in line with the team's overall direction.
• Analyze complex datasets to understand ways to improve processes.
• Provide performance reporting and analysis to executive management and risk identification and mitigation.
• Collaborate with the Revenue to Cash Operations, Cash, and AR Management organization to ensure a high standard of execution for operational activities. This includes service level agreements, adherence to documented processes and quality of results.
• Articulate data and system requirements to supporting teams, this includes capacity planning and the appropriate allocation of resources.

Minimum qualifications

• Bachelor's degree or equivalent practical experience
• 7 years of experience in financial analysis, budgeting, operations, consulting, program management, process design, process improvement, or business process re-engineering
• 3 years of experience in data and analytics
• Experience using SQL or other scripting languages

Preferred qualifications

• MBA or Master's degree
• Experience in Order to Cash operations (Credit, Collections, Cash Operations)
• Experience with SAP
• Experience working in a cross-functional, fast-paced environment leading complex operational initiatives to successful outcomes
• Motivated, strong sense of end-to-end ownership, and a collaborative mindset

What you will do

1. DFT architecture exploration & evaluation for next-gen process node & package technology of MediaTek:

• Scan chain insertion & ATPG pattern generation
• Pattern validation through simulation & silicon analysis(pass/fail, shmoo, fail log, etc.)
• Diagnosis to help manufacture process improvement

2. Co-work with SoC architect, RTL designer, physical design engineer, and package engineer to define best architecture for 3D-IC:

• PPA(Performance/Power/Area) impact analysis & mitigation via DFT innovation
• Develop & integrate DFT-related RTL design modules to test chip

What you will bring

1. Master's Degree in EEE/ EE/ CE
2. Expertise in Synopsys and/or Mentor DFT tools, and HDL simulators like Synopsys VCS
3. Fluency in script language including but not limited to TCL/Perl/Python
4. Experience about MBIST with state-of-the-art SRAM structure & EDA tools is big plus
5. Skill for RTL design & integration, and physical failure analysis(PFA) will also be plus
6. Ability to think and work independently with different teams
7. Interest in understanding more details in entire design flow
8. Ability to use English for discussing technical details
9. More than 4-year industrial work experience is preferred

Role & Responsibilities:

• Responsibilities include diagnosing appropriate levels of metal/metal-alloy contaminations by oxygen and other contaminants; determining the root cause of contaminants, and establishing protocols for characterizations.
• Hands-on providing support for onsite metal PVD, including creating, running, and characterizing recipes to achieve the lowest resistances.
• Collaborates closely with equipment vendors and device engineers to optimize the metal-stack for device performances and robustness/reliability, from low to high temperatures.
• Lead data analysis related to implant-induced defects and cleaning issues on metal contacts with solutions development.
• Examines the work-functions of metal/metal-alloys suitable for Ohmic contact on SiC.
• Responsible for designing experiments for Ohmic contact on various SiC substrates with different doping types, determining their impact, and resolving issues to achieve the lowest specific contact resistances.
• Designing cleaning processes to obtain ideal Schottky diode using various metal/metal-alloys on SiC for high-performance applications.
• Work closely with cross-departmental and integration teams and in 3-5 years’ time develop a WBG backend process integration team of at least 4 persons.

Requirements:

• PhD Degree in Material Science, Physics, Electrical Engineering or related field.
• >8 years related industrial experience inclusing backend process module integration.
• Extensive hands-on experience in PVD (Physical Vapor Deposition) processing for metal depositions and interface tuning.
• Strong understanding of metal-semiconductor contact physics.
• Expertise in work-function tunings of metal and metal-alloy.
• Proficiency in modulating electron affinity through implantation or surface treatments of semiconductors.
• Familiarity with wide band-gap semiconductor materials and their interaction with metal/metal-alloys at various temperatures.
• Thorough fundamentals in Ohmic contact and Schottky diode physics, as well as the impact of defects and contaminations on electrical properties.
• Skilled at mentoring and transferring knowledge to junior staff members.
• Excellent communication skills to effectively address customers' needs, concerns, and solution requirements.

Role & Responsibilities:

• Responsibilities include diagnosing appropriate levels of metal/metal-alloy contaminations by oxygen and other contaminants; determining the root cause of contaminants, and establishing protocols for characterizations.
• Hands-on providing support for onsite metal PVD, including creating, running, and characterizing recipes to achieve the lowest resistances.
• Collaborates closely with equipment vendors and device engineers to optimize the metal-stack for device performances and robustness/reliability, from low to high temperatures.
• Lead data analysis related to implant-induced defects and cleaning issues on metal contacts with solutions development.
• Examines the work-functions of metal/metal-alloys suitable for Ohmic contact on SiC.
• Responsible for designing experiments for Ohmic contact on various SiC substrates with different doping types, determining their impact, and resolving issues to achieve the lowest specific contact resistances.
• Designing cleaning processes to obtain ideal Schottky diode using various metal/metal-alloys on SiC for high-performance applications.
• Work closely with cross-departmental and integration teams and in 3-5 years’ time develop a WBG backend process integration team of at least 4 persons.

Requirements:

• PhD Degree in Material Science, Physics, Electrical Engineering or related field.
• >8 years related industrial experience inclusing backend process module integration.
• Extensive hands-on experience in PVD (Physical Vapor Deposition) processing for metal depositions and interface tuning.
• Strong understanding of metal-semiconductor contact physics.
• Expertise in work-function tunings of metal and metal-alloy.
• Proficiency in modulating electron affinity through implantation or surface treatments of semiconductors.
• Familiarity with wide band-gap semiconductor materials and their interaction with metal/metal-alloys at various temperatures.
• Thorough fundamentals in Ohmic contact and Schottky diode physics, as well as the impact of defects and contaminations on electrical properties.
• Skilled at mentoring and transferring knowledge to junior staff members.
• Excellent communication skills to effectively address customers' needs, concerns, and solution requirements.

As a Senior Engineer in PDE (Package Development & Engineering) at Micron, you will be responsible for the Advance Packaging success within your scope (MRDA) and guided by functional objectives, in terms of process, equipment and materials definition, development and/or optimization. You will be managing and optimizing your area's performance to meet or beat defined metrics. You will apply extensive knowledge to carry out tactics and collaborate with internal and external partners to build and implement packaging technology roadmaps aligned to corporate strategic objectives. You will provide advice to senior management related to tactical decision for the function. You will interact with executives, major customers and/or site managers to provide consultation, influence decisions and identify and resolve critical issues.

Identify, select, and evaluate new process, equipment and/or technology to support current and future requirements for MRDA area

• Define, development and establish new process, equipment design and/or capability requirements aligned to Process and Packaging Roadmap
• Develop and engage creative solution for new process, equipment capabilities and/or solution to identified constraints or future technology requirements
• Work with equipment suppliers to develop new capability
• Actively participate in Package Development Engineering activities
• Conduct equipment benchmarking to establish the equipment suppliers and platforms for current and future need
• Create decision matrix for equipment and material selection
• Generates and set-up ADC, set-up/improve recipes
• Set-up PMON, Sampling Plans, BKM, CIP Strategies & performance indicators

Installation and qualification of new equipment platform and handover to production group

• Plan/submit capital request to acquire new Equipment
• Create purchasing specification (Doc2) document
• Establish the new equipment qualification criteria and activities roadmap with respective functional team
• Establish project handover requirements and procedures upon machine qualification
• Prepare documentation for handing over with respective site owner
• Conduct data gathering for low volume production
• Conduct training for Site representatives/personnel
• Establish the feedback loop for Continuous Improvement after mass volume production

Define, improve and/or maintain a matrix of key equipment platform capability and constraints (TOR - Tool of Records) on current and new equipment platform

• Maintain and regularly update the TOR, with inputs from local or other assembly site
• Maintain general knowledge of process and material characteristics and translate to equipment design requirement
• Search continually for new equipment or suppliers with improved or new capability that is aligned to Process/Packaging need

Collaborate with production group on upgrades of existing production equipment through continuous improvement projects

• Maintain knowledge of design constraints and weakness of existing platform
• Participate in the continuous improvement projects involving equipment improvement and upgrades

Job Requirements/ Qualifications:

• Bachelor or master’s in electrical engineering, Materials Science, Chemical Engineering, or related field. A PhD is a plus.
• 4 or more years of experience with proven track record of technical leadership in semiconductor manufacturing in Metro Real-Time Defect Analysis Process & Equipment Engineering. Experience in other Front-End areas, in Post Wafer Fabrication & High Bandwidth Memory technology
• Be able to comfortably work across organizational boundaries and geographies.
• Ability to effectively collaborate with multi-functional organizations to understand needs and translate them into actionable plans, deliverables, and resource requirements.
• Demonstrated ability to drive and implement a wide range of global initiatives with global teams.
• Organized, meticulous, and strong focus on results.
• Demonstrated ability to inspire teamwork and to effectively lead others.
• Demonstrated track record in baseline performance improvement, business process creation, process simulation techniques, data interpretation skills and proficiency in statistical analysis/method.
• Excellent analytical skills and organizational competency
• With good oral and written English communication skill
• Excellent communication skills

Keen on the role? Apply now!

As a PDE Central Process Integration Principal Engineer, you will lead the development and integration of assembly and packaging processes for cutting-edge semiconductor products, such as DRAM, NAND, controllers, graphics, 3D-stacked (3DS) technologies, and High Bandwidth Memory (HBM). The ideal candidate will drive innovation in packaging technology and ensure seamless process integration during new product introductions.

This position involves working closely with multi-functional teams to research, design, and implement new packaging solutions while optimizing production yields and ensuring the successful commercialization of next-generation semiconductor technologies.

JOB RESPONSIBILITIES

Promote worldwide synergy

• Improve benchmark performance and efficiency gains through global project management and execution
• Network BKM leveraging and enhancement, business process creation and re-engineering
• Maintain a strong and open relationship with peer group and managers in other functional areas within central team and outside in areas such as Sites, TD, Product Engineering, Global Quality
• Help drive and fix the issue where necessary

Drive FE-AT Integration initiatives

• Business process governance between Fab – Assembly (WSPEC, FE2BE forum, WPSWAT)
• Lead & drive FE-AT excursions
• Yield, DPM related issues that involves both Fab – Assembly

Cross sites benchmark & achieve BIC yield performance

• Lead PI programs, PI Loop taskforce and/or team in network to address yield and quality challenges, optimize process flow

Identify, Propose & Drive new initiatives programs

• Propose & lead strategic programs to shift left/ shorten cycle learning across TN phase (PD, NPI, HVM)
• Process flow simplifications & standardizations
• Cross technology streamline (Process, tools, etc)
• Sites expansions process & qualification requirements
• Drive roadmaps with multi-functional teams (FE, AT Procurement, APTD, APPDE)

JOB QUALIFICATIONS

• Bachelor's degree in Engineering (Electrical, Mechanical, Materials Science, or related field).
• 3+ years of experience in semiconductor packaging technology development, process integration, or new product introduction (NPI)
• Strong background in frontend fabrication processes (FAB)
• Proven experience in data analysis, statistical process control (SPC), and process optimization.
• Strong problem-solving skills, attention to detail, and a proactive approach to technology development.
• Excellent communication and teamwork skills, with the ability to work across departments and with external partners.
• Hands-on experience in the development and implementation of cutting-edge semiconductor packaging technologies.
• Experience leading multi-functional teams in process development, technology transfer, and ramp-up.
• In-depth knowledge of the latest industry standards and trends in semiconductor packaging and assembly.

As a PDE Central Process Integration (PI) Senior Engineer, you will lead the development and integration of assembly and packaging processes for cutting-edge semiconductor products, such as DRAM, NAND, controllers, graphics, 3D-stacked (3DS) technologies, and High Bandwidth Memory (HBM). The ideal candidate will drive innovation in packaging technology and ensure seamless process integration during new product introductions.

This position involves working closely with multi-functional teams to research, design, and implement new packaging solutions while optimizing production yields and ensuring the successful commercialization of next-generation semiconductor technologies.

JOB RESPONSIBILITIES

Promote worldwide alignment

• Improve benchmark performance and efficiency gains through global project management and execution
• Network BKM leveraging and enhancement, business process creation and re-engineering
• Maintain a strong and open relationship with peer group and managers in other functional areas within central team and outside in areas such as Sites, TD, Product Engineering, Global Quality
• Help drive and fix the issue where necessary

Drive FE-AT Integration initiatives

• Business process governance between Fab – Assembly (WSPEC, FE2BE forum, WPSWAT)
• Lead & drive FE-AT excursions
• Yield, DPM related issues that involves both Fab – Assembly

Cross sites benchmark & achieve BIC yield performance

• Lead PI programs, PI Loop taskforce and/or team in network to address yield and quality challenges, optimize process flow

Identify, Propose & Drive new initiatives programs

• Propose & lead strategic programs to shift left/ shorten cycle learning across TN phase (PD, NPI, HVM)
• Process flow simplifications & standardizations
• Cross technology streamline (Process, tools, etc)
• Sites expansions process & qualification requirements
• Drive roadmaps with multi-functional teams (FE, AT Procurement, APTD, APPDE)

Requirements

• Bachelor's degree in Engineering (Electrical, Mechanical, Materials Science, or related field).
• 3+ years of experience in semiconductor packaging technology development, process integration, or new product introduction (NPI)
• Strong background in frontend fabrication processes (FAB)
• Proven experience in data analysis, statistical process control (SPC), and process optimization.
• Strong problem-solving skills, attention to detail, and a proactive approach to technology development.
• Excellent communication and teamwork skills, with the ability to work across departments and with external partners.
• Hands-on experience in the development and implementation of cutting-edge semiconductor packaging technologies.
• Experience leading multi-functional teams in process development, technology transfer, and ramp-up.
• In-depth knowledge of the latest industry standards and trends in semiconductor packaging and assembly.

Keen on the role? Apply now!

Job Responsibilities :

• Communicate, coordinate, and integrate department resources to enhance efficiency and achieve departmental goals and objectives.

• Oversee team member assignments, manage project scheduling, and track project progress to ensure timely and successful completion.

• Implement cost control measures and optimize resource allocation to maximize department performance.

• Foster team development through targeted training and mentorship programs, ensuring the success and growth of team members.

Job Qualification

• Master’s degree in a related field, such as Chemistry, Chemical Engineering, or Material Science.

• Over 5 years of relevant work experience.

• Strong knowledge of 12-inch semiconductor diffusion processes, including furnace, ion implantation, and Wet Bench System.

• Proven ability to identify, assess and solve problems

• Analytical with good interpersonal skills

• Team leader with execellent communication/coordination skill.

Job Responsibilities:

•Lots handling, WAT analysis and process optimization

•Device development, Yield trouble shooting and reliability improvement

•Fab transfer & Customers handling

•Customized structure process integration development

• To be responsible for helping to drive leading edge process/device development and optimization of devices in order to meet scaling, performance, reliability, and manufacturability requirements.

• Identify and solve IC process and device problems

Job Qualification

•Bachelor degree or above in Materials Science, Electrical Engineering, Chemical Engineering, Mechanical Engineering, Physics, Chemistry or a related engineer discipline.

• 5+ Years Experienced Process Engineering

• Fab 12" knowledge is preferred

• Knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles

•Good communication skills, be able to work within cross-functional teams, including internal and external partners

The New Product Introduction (NPI) process engineer will provide Dermcut Medical Pte Ltd with technical support and operating knowledge for our medical device operation. This role will conduct critical engineering functions such as product validation, troubleshooting, identifying and implementing process improvements.

The engineer will work closely with project manager and is in charge of taking the prototype from pilot scale into full scale manufacturing in support of commercial efforts. This position will focus on developing various processes and implementing those to support mass production.

Primary Responsibilities

• Establish processes based on product specifications.
• Develop control plans, gage repeatability & reproducibility, test method verification & validation, and pFMEA.
• Identify areas of process improvement to reduce and minimize process related nonconformance incidents and to maximize efficiency of the process.
• Co-ordinate the generation of dossier including but not limited to design files, technical files and project files to include design outputs, shelf-life studies, biocompatibility, sterilisation, risk analysis, validation master plans, IQ's, OQ's, PQ's and test regimes.
• Responsible for screening and optimization of process parameters to achieve robust and stable processes and maximize yields, efficiencies and process capabilities.
• Perform other related duties and responsibilities as assigned.

Education / Experience Requirements

• Bachelor’s degree in process engineering or similar qualification.
• A minimum of 2 years’ experience in the medical device industry.
• A strong understanding of validation strategy (IQ/OQ/PQ), support protocols and reports.
• Experience in root cause analysis of technical discrepancies/abnormalities.
• Familiar with FDA documentation requirements, ISO 13485 quality management system, lean manufacturing, and good manufacturing practice.
• Experience with SolidWorks and Microsoft Project preferred.

We are looking for a senior technical leaders in the field of process engineering to join PDE, Advance Packaging Process Module Team.

As a Senior Member of Technical Staff (SMTS), you will play a pivotal role in driving innovation, leading technical projects, defining the technical roadmap, and mentoring fellow engineers. Your expertise will be instrumental in developing cutting-edge Advance Packaging process solutions to support yield ramp-up. Your contribution will leave a lasting impact on the Advance Packaging industry.

Responsibilities for Process Engineering SMTS include (but not limited to):

• Own critical taskforce, take ownership of critical initiatives, and leading multi-functional technical team to implement new tech node yield roadmap. Collaborate closely with process integration, technology development, and local yield teams to improve new technology.
• Guide and mentor team members, fostering a culture of continuous learning and career development.
• Cultivate an innovative attitude, finding opportunities for process improvements that align with state-of-the-art product requirement while optimizing costs.
• Develop a fundamental understanding of process engineering and its impact on overall process health.
• Provide engineering support to internal team members and senior leadership.

Requirements:

• Technical expertise: Detailed knowledge of at least one of the main semiconductor processes, including lithography, dry etch, wet etch, CMP, thin film, diffusion, implantation, and metrology, with at least 10 years of relevant experience in advanced memory or logic node. Strong understanding of process integration
• Project leadership: Proven skills in leading complex technical projects, ensuring timely delivery of high-quality results. Ability to drive multi-functional technical teams and successfully complete of complex projects.
• Communication skills: Outstanding written and verbal communication skills. Demonstrated interpersonal skills, including influencing and motivating. Ability to collaborate effectively with multi-functional, multi-cultural teams.
• Innovation: Track record of providing innovative solutions
• Education: An advanced degree in Engineering or Science is preferred.

Keen on the role? Apply now!

Responsibilities

• Undertake detailed design in Building Structures
• Execution of projects and liaison with the Client, Client’s Consultants, Contractors, and authorities to provide technical support for design
• Checker to obtain approval of design and drawings
• Prepare design report & attend meeting to resolve technical issue

Requirements

• Degree in Civil and Structural Engineering or its equivalent that is recognized by the Professional Engineers Board of Singapore
• Well versed with local authority codes and regulations
• Minimum 4 years of relevant building structure with civil experience
• Involve in large scale building (HDB/ Condominium/ Commercial) structural design project
• Good exposure in the analysis and design of PPVC, Precast and concrete structures, steel structures
• Good knowledge of the various engineering design software and analytical tools
• Applicant who has lesser experience will consider for Engineer role

ROLE:
A*STAR-IME is leading the way in establishing industry first 200mm open Silicon Carbide (SiC) R&D program. The program specific focus is on advancing 200mm SiC technologies in key areas such as epitaxy, gate stack, ion implantation, and dry etching, and integrating these modules to fabricate high-performance power devices. Our objective is to drive innovation in power device research, particularly in power MOSFETs rated above 1.2KV. Developing key innovative process is crucial for creating high-performance devices that will contribute to advancements in automotive technologies, vehicle electrification, safety measures, sustainable energy grids, data centers, and industrial & aerospace automation. This role involve growing leadership into ion implantation processes for p-body, channel, guard ring, source contact, and other components. We are currently seeking such individual with ~5 years of experience in ion implantation. The chosen candidate will be responsible for independently supervising ion implantation processes, conducting ion implant simulations, possessing knowledge of crystallography and ion interaction with atoms, having strong understanding of implanters and related thermal processing physics, beam optics, dosimetry systems, and vacuum technology. The ideal candidate should also be willing to collaborate with various departments, the technology development group, and customers. Furthermore, the candidate will contribute to the wide-bandgap team by sharing the ion implantation expertise on compound semiconductor materials and collaborate with other departments working with Si-based technology. The candidate will also be groomed to lead this diffusion process module group of ~6 headcounts into the future.

RESPONSIBILITIES:

• Diagnose malfunctions and using test equipment & software to test faulty tool; applying knowledge of the functional operation of the ion implant equipment

• Support on-site ion implanters in creating, running & characterizing recipes for recipe validation and develop process to achieve the desired dopant profile with excellent
damage recovery.

• Collaborate with vendors to optimize equipment performance and reduce tool downtime

• Analyze data related to implant-related defects formation with quantification and defects minimizations strategy

• Examine work-orders and communicates with equipment operators to resolve equipment problems & determine mechanical and human errors contributed to the issues

• Perform scheduled preventive maintenance tasks with tool operators, especially in checking, cleaning, repairing, detecting and preventing problems

• Responsible for designing experiments for ion implantation at various dose, energy, tilt, and twist levels

REQUIREMENTS:

• Ms/PhD Degree in Electrical Engineering or related field

• >3-5 years industrial experience for high power device design and modeling

• Extensive proficiency in medium to high energy/current ion implantation processes, including a comprehensive knowledge of implant equipment, equipment parts, and
troubleshooting techniques to minimize equipment downtime

• Good understanding of wide bandgap semiconductor materials and their corresponding dopant species

• Expertise in ion channeling, ion bombardment, and their impact on the implant species profile

• In-depth comprehension of defect formation and annihilation processes in the implanted region of semiconductors

• Familiarity with essential device properties resulting from ion implantation

• Adept at mentoring and transferring knowledge to junior staff members

ROLE:
A*STAR-IME is leading the way in establishing industry first 200mm open Silicon Carbide (SiC) R&D program. The program specific focus is on advancing 200mm SiC technologies in key areas such as epitaxy, gate stack, ion implantation, and dry etching, and integrating these modules to fabricate high-performance power devices. Our objective is to drive innovation in power device research, particularly in power MOSFETs rated above 1.2KV. Developing key innovative process is crucial for creating high-performance devices that will contribute to advancements in automotive technologies, vehicle electrification, safety measures, sustainable energy grids, data centers, and industrial & aerospace automation. This role involve growing leadership into ion implantation processes for p-body, channel, guard ring, source contact, and other components. We are currently seeking such individual with ~5 years of experience in ion implantation. The chosen candidate will be responsible for independently supervising ion implantation processes, conducting ion implant simulations, possessing knowledge of crystallography and ion interaction with atoms, having strong understanding of implanters and related thermal processing physics, beam optics, dosimetry systems, and vacuum technology. The ideal candidate should also be willing to collaborate with various departments, the technology development group, and customers. Furthermore, the candidate will contribute to the wide-bandgap team by sharing the ion implantation expertise on compound semiconductor materials and collaborate with other departments working with Si-based technology. The candidate will also be groomed to lead this diffusion process module group of ~6 headcounts into the future.

RESPONSIBILITIES:

• Diagnose malfunctions and using test equipment & software to test faulty tool; applying knowledge of the functional operation of the ion implant equipment

• Support on-site ion implanters in creating, running & characterizing recipes for recipe validation and develop process to achieve the desired dopant profile with excellent
damage recovery.

• Collaborate with vendors to optimize equipment performance and reduce tool downtime

• Analyze data related to implant-related defects formation with quantification and defects minimizations strategy

• Examine work-orders and communicates with equipment operators to resolve equipment problems & determine mechanical and human errors contributed to the issues

• Perform scheduled preventive maintenance tasks with tool operators, especially in checking, cleaning, repairing, detecting and preventing problems

• Responsible for designing experiments for ion implantation at various dose, energy, tilt, and twist levels

REQUIREMENTS:

• Ms/PhD Degree in Electrical Engineering or related field

• >3-5 years industrial experience for high power device design and modeling

• Extensive proficiency in medium to high energy/current ion implantation processes, including a comprehensive knowledge of implant equipment, equipment parts, and
troubleshooting techniques to minimize equipment downtime

• Good understanding of wide bandgap semiconductor materials and their corresponding dopant species

• Expertise in ion channeling, ion bombardment, and their impact on the implant species profile

• In-depth comprehension of defect formation and annihilation processes in the implanted region of semiconductors

• Familiarity with essential device properties resulting from ion implantation

• Adept at mentoring and transferring knowledge to junior staff members

Responsibilities:

• Work closely with business user and software/system architect.
• Gather and analyze requirement from stake holder, including business requirement document.
• Conduct technical feasibility study, analysis requirement specifications to design and architect solutions including developing proof of concepts.
• Translate business requirement into documented technical and data design specification.
• Perform code development, involve in code review, user acceptance testing and sign off.
• Perform implementation, provide post-implementation maintenance support and fine tuning.
• Collaborate with team members to deliver high quality and high-performance .net applications, web and mobile applications.

Requirements:

• Possess a Degree/Diploma in Computer Science / Information Technology (IT,Design) or equivalent.
• Proficient experience with programming language in VB,C# ASP.Net and/or Android, IOS.
• Good HTML5, CSS3, JavaScript, jQuery, Bootstrap responsive web and mobile design.
• Technically proficient with database programming language SQL.
• Demonstrated expertise with MS excel based programming using VBA.
• Experience in SharePoint, Power BI, Power Apps and PHP is an added advantage.
• Technically competent with EDI integration, including web services, Rest API.
• Ability to work under pressure and to tight deadlines.
• Ability to communicate complex concepts.
• Good interpersonal, analytical and problem-solving skills.
• Minimum 2 years of relevant working experience is required

As a XS Developer, you’ll be working closely with our development team to implement and optimize code for our project (mainly xs syscalls). We’re looking for someone with a solid understanding of Age of Empires 2 mechanics and XS scripting, who is also comfortable with general scripting tasks to support a variety of development processes. In return, you will be part of a creative and supportive team environment with the ability to have a direct impact on the development of top-tier games.

Are you up for the challenge?

Some of the cool stuff you'll be doing:

· Develop and maintain code in C/C++

· Working with automation tools and customized scripting languages (.xs) in a proprietary engine

· Utilize Age of Empires 2 knowledge, including mechanics and XS scripting, to enhance project outcomes

· Collaborate with the team to deliver optimized and high-quality code

Requirements

· 1+ year of experience in C/C++ with a passion for game dev

· Strong understanding of Age of Empires 2 game mechanics and avid fan

· Fluency in English

· Strong general scripting skills and automation knowledge

· You will be asked to partake in a technical test to prove your skills.

· Plus: Any modding experience with AOE2