Your main responsibilities include:

• Develop and maintain product datasheet testing and characterization test programs for NAND and NOR components
• Working with product reliability engineers to define test flows for individual products
• Provide support to operation team to ensure seamless execution for generated test flow on the tester with live product
• Perform electrical failure analysis for failure validation and characterization

You are encouraged to apply if you can demonstrate some of the qualities listed below:

• Master's or Bachelor's degree in Engineering field. Microelectronic/Electrical/Computer Engineering fields are preferred.
• Positive attitude and self-motivation towards learning and development.
• Good analytical mindset and structured personality.
• Good written and verbal communication skills.
• Hands on experience with C++/Python and Object-Oriented Programming is a plus
• Understanding Automated Test Equipment and flash memory is a plus.
• Fresh graduates are welcome to apply.

Working location:

• 990 Bendemeer Road, Singapore 339942

About Us:

We develop comprehensive software products and solutions ranging from IT consultancy to infrastructure and hardware setup to optimise customers' experiences. To establish ourselves as a leading provider of applications and healthcare support services for the Asian market, and partner healthcare customers to build a safe medical environment for all.

We are driven by our group philosophy as defined below:

1. Provide the best to our customers through a service-oriented culture

2. Create new value through innovation

3. Realise greater possibilities through advanced technology

Roles and Responsibilities:

• Responsible for providing technical assistance and support related to computer systems, hardware or software testing
• Responds to queries, runs diagnostic programs, isolates problem, and determines and implements solution
• Provide technical assistance and support for incoming queries and issues related to computer, systems, software, and hardware
• Respond to queries either in person or over the phone
• Write training manuals
• Maintain daily performance of computer systems
• Respond to email messages for customers seeking help
• Ask questions to determine nature of problem
• Walk customer through problem-solving process
• Install, modify, and repair computer hardware and software
• Run diagnostic programs to resolve problems
• Are required to apply information security in accordance with the established policies and procedures of the organization.

Requirements:

• Diploma or Certificate in IT/Computer Engineering with 1-2 years of working experience in technical support
• Experience in basic networking support
• Experience in supporting OS platforms such as Windows 10 and MS Office applications
• Prefer candidates who are resourceful, good working attitude & takes initiative
• Good communication skills and administrative skills

Responsibilities:

- Assess Die Overkilling In Line and Optimization of criteria

• Define Sampling Criteria for Yield Enhancement (YE) Wafer – Initial is to align with RPM lot
• Define and Create YE In Line DL2 & MRDA Flow: Full scan with tighter criteria (higher magnification) with non-die-kill
• Create Deviation flow to Route to YE Flow
• Define and Create YE Probe Flow: Full data logging and Test-to-end to capture as much data as possible
• Data Analysis:
• Correlation of MRDA (Metro Real-time defect analysis) Defect to Probe to identify in line failure mode causing probe fail and failure analysis

- Manage Risk of deviation

- Provide organizational leadership to build functional strategies & processes, and collaborate with partners to deliver strategic solutions

• Establish organizational roadmaps and strategies. Apply extensive knowledge and tenacity to carry out strategies.
• Collaborate with peers to construct global solutions.
• Ensure conflict resolution and assist with identifying escalation paths.
• Align internal strategies and communicate line of sight to corporate strategic objectives.
• Establish and communicate department capabilities to ensure partner expectations are aligned.
• Manage conflict and build effective relationships with internal and external partners.
• Initiate and sustain effective communication with internal and external partners.
• Provide advice to senior and executive management on strategic decisions
• Establishes and manages budget/finances for the team

- Ensure a Safe, Compliant, and Ethical Work Environment

• Maintain knowledge of and apply company safety, labor, and ethics policies.
• Communicate requirements and expectations to leaders and external partners.
• Ensure execution of mandatory training for organization.
• Identify and resolve and / or report potential safety, security, and labor issues.

Requirements

• Bachelors, Masters or PhD in Electrical Engineering, Materials Science, Chemical Engineering, or related field
• At least 4 years of experience in Semiconductor Manufacturing and on a leadership capacity, with focus on Advance Packaging technologies and High Bandwidth Memory (HBM) integration, in yield enhancement
• Experience in PWF (Post Wafer Fabrication), Backend engineering process, assembly package technology development and technical knowledge with die and wafer level process technology with understanding of Micron’s silicon and how it interacts at a package level through CPI (Chip Package Interaction), in yield enhancement
• Strong leadership and vision and must be able to comfortably work across organizational boundaries and geographies.
• Demonstrated ability to influence executives, senior leaders and partners on strategic decisions across multiple functions and geographies.
• Ability to effectively collaborate with multi-functional organizations to understand needs and translate them into actionable plans, deliverables, and resource requirements.
• Demonstrated ability to drive and implement a wide range of global initiatives with global teams.
• Ability to be guided by business objectives and determine best methods for delivering results.
• Organized, meticulous, and strong focus on results.
• Demonstrated ability to inspire teamwork and to effectively lead others.
• Proven facilitation skills including the ability to influence others, build consensus, and resolve conflict.
• Demonstrated track record in baseline performance improvement, business process creation, process simulation techniques, data interpretation skills and proficiency in statistical analysis/method.
• Excellent analytical skills and organizational competency
• With good oral and written English communication skill

Keen on the role? Apply now!

Rapsodo is a Sports Technology company with offices in the USA, Singapore, Turkey & Japan. We develop sports analytics products that are data-driven, portable and easy-to-use to empower athletes at all skill levels to analyse and improve their performance. From Major League Baseball star pitchers to Golf tour players, athletes use Rapsodo technology to up their game across the world. Trusted by coaches and players from youths to professionals, Rapsodo provides real-time insights for all-time performance.
We are innovative, focused, and rapidly growing. We are continuously looking for team players who will stop at nothing to deliver state-of-the-art solutions as part of Team Rapsodo.
As a Full Stack Developer, you will design, develop, and deploy robust, secure, and user-centric applications while leveraging the power of cloud technologies. You will work across the entire tech stack, ensuring our applications are scalable, efficient, and aligned with business goals.

Location:

Singapore

Key Responsibilities:

• Develop Full-Stack Applications: Design, build, and maintain responsive front-end interfaces and secure, scalable back-end services.
• Cloud Integration: Leverage cloud platforms (AWS, Azure, Google Cloud) to develop and deploy cloud-native solutions, ensuring optimal scalability and performance.
• Collaborate Across Teams: Work closely with product managers, designers, and DevOps engineers to deliver seamless user experiences.
• Optimize Performance: Ensure applications perform reliably under high usage, implementing best practices for scalability and security.
• Innovate: Stay ahead of industry trends and bring new ideas to enhance our offerings.

• 8+ years in full-stack development with expertise in front-end frameworks (React, Angular, or Vue.js) and back-end technologies (Node.js, Python, Go, etc.).
• Hands-on experience with cloud platforms such as AWS, Azure, or Google Cloud.
• Strong understanding of CI/CD pipelines and DevOps tools.
• Proficiency in building RESTful APIs and microservices architecture.
• Familiarity with containerization (Docker, Kubernetes) and serverless computing.
• Experience with both SQL and NoSQL databases.
• Excellent problem-solving and analytical abilities.
• Strong communication skills to work effectively with cross-functional teams.
• Self-motivated, team-oriented, and driven to innovate.
• A natural curiosity for new technologies and trends in cloud computing and software development.

We are a global leader in sports vision technology, powered by a team that believes in failing fast, learning faster, and winning as a team. At Rapsodo, you'll thrive in a culture driven by customer focus, achieving more with less, and redefining what's possible. If you are eager to work independently while contributing to a dynamic, innovative, and passionate team, we encourage you to submit your application.

JOB SCOPES & JOB RESPONSIBILITIES

• Overseeing the construction activities and progress, planning, implementation and monitoring work schedules in accordance with the master and detailed work programme.
• Liaise with Professional Engineer on civil related works.
• Liaise with consultants for technical issues and coordinate the site activities with subcontractors.
• Handling of technical and engineering problems.
• Provide guidance to supervisors in relation to construction works, ensure progress according to schedule, quality standards are maintained site inspections are carried out and technical issues are resolved on time.
• Prepare report and method statement whenever necessary.
• Manage and control workers and monitor their work closely to keep site safer and neat.
• Supervise ongoing site activities closely.
• Other ad-hoc assigned by the Company.
• Good attitude and relevant working experience.

JOB REQUIREMENTS

• Recognised Certificate in Civil Engineering.
• Minimum 5 Years experience in the construction site.
• Independent with good communication skills.
• Good organizational and planning skills.
• Effective communication and coordination skills and teamwork.
• Able to work independently and in a team.

Responsibilities:

• Install, configure, troubleshoot and support servers or virtual machines (Hyper-V / VMware) running on Windows Server operating systems.
• Perform system maintenance, upgrade, patches and incident resolution outside of working hours when required.
• Monitoring and implementing backup solutions for critical systems and data regularly.
• Implement and maintain IT security measures and best practices for systems and address security incidents with latest security trends.
• Assist in the planning and implementation of IT projects, ranging from system upgrades to new system deployments.
• Create and update technical documentation pertaining to systems administration for on-premise systems, Azure and Microsoft 365.
• Any related ad-hoc duties as assigned.

Requirement:

• Minimum 3 years of experience as a System Engineer or Server Administrator.
• Experience with Active Directory, Group Policy, Virtualization, Patch Management, Microsoft Entra and Microsoft 365.
• Experience in cloud platforms such as Azure and AWS.
• Possess excellent communication, problem-solving and analytical skills.
• Ability to work independently.

Job Summary:

The Applications Support Engineer provides technical support and maintenance for software applications, ensuring their optimal performance and availability. This role involves troubleshooting issues, implementing solutions, and collaborating with other IT teams to enhance system functionality. The Applications Support Engineer is also responsible for documenting processes, managing application configurations, and assisting in the deployment of software updates and patches.

Key Responsibilities:

• Application Support: diagnose and troubleshoot application issues reported by end-users or detected through monitoring tools. Provide timely and effective resolution to application problems, escalating issues when necessary.
  
• Incident and Problem Management: manage and resolve application-related incidents and problems, ensuring root causes are identified and addressed. Maintain an incident log and provide regular updates to stakeholders on the status of issues.
  
• Application Maintenance and Updates: work with development teams to deploy new versions and patches of applications and implement changes. Test and validate updates before deployment to ensure minimal disruption to users.
  
• User Support and Training: assist end-users with application-related queries and provide technical support. Conduct training sessions for users on new features or changes to applications. Develop user guides and support documentation to assist end-users.
  
• Configuration Management: manage application configurations, including settings, permissions, and access controls. Ensure that application configurations are documented and maintained in line with organizational standards.
  
• Collaboration and Communication: work closely with developers, system administrators, and other IT teams to resolve application issues. Communicate effectively with stakeholders, providing regular updates on application status and issues. Participate in project meetings to provide input on application support requirements.
  
• Continuous Improvement: identify areas for improvement in application performance and user experience. Propose and implement solutions to enhance application efficiency and reliability.
  

Requirements:

• Degree in Computer Science, Information Technology, or related field.
• Preferably 2 to 5 years of experience in application support, software troubleshooting, or a related role.
• Beneficial to have experience in an Aircraft Engine Maintenance Repair and Overhaul shop.
• Good knowledge of MS Excel, databases, SQL, and scripting languages (e.g., Python, PowerShell).
• Strong problem-solving and analytical skills.
• Excellent communication and interpersonal skills.
• Ability to work independently and as part of a team.
• Strong customer service orientation.
• Training provided for candidate without prior experience.

Summary:

• Salary up to $6000
• MNC company - stable revenue & perks
• Transport allowances
• Possess own vehicle
• Location: Pioneer
• 5 days work week
• Sales experience in precision engineering related products

Key Responsibilities:

• Develop new business opportunities & sales leads for revenue growth and customer retention
• Achieve sales targets and analyst current market trends and industry information
• Pitch, recommend and fulfil the requirement of customer in terms of products and services offered
• Work closely with the production, application and shipping team to ensure timely delivery and that all order requirements are met
• Attend problem and generate solution
• Other related ad hoc duties

Key Requirements:

• Min Diploma in Mechanical Engineering or equivalent
• Sales experience in precision engineering related products
• Strong technical knowledge in CNC machines
• Possess own vehicle is a must

Interested applicants, please submit your updated resume in MS Words format by using the APPLY NOW BUTTON.

By submitting your personal data and/or resume, you give consent to the collection, use, and disclosure of your personal data and/or resume by the company (or its agent) for the purpose of the processing and administration by the company relating to this job application.

Please be notified that only shortlisted candidates will be notified.

Your recruiter for this job: Stella

WhatsApp me @ 8772 4117 for a prompt response to your enquiry!

Stella Aw Yong See Hui | R24121552

Recruit Now Singapore Pte Ltd | EA No: 21C0845

Job Responsibilities:-

• Utilize in-depth knowledge of Foundation IP to evaluate and qualify IP’s. Able to benchmark and optimize Std cells/IO’s/memory for optimum performance, area or power needs of a project
• Conduct Spice simulations to verify the performance and reliability of designs on RC extracted netlists
• Perform library characterization to ensure accurate timing, power, and area models. Stay up-to-date with industry trends and emerging technologies in library characterization and PPA analysis
• Help to develop and maintain EDA automation scripts to streamline CAD flow and design processes
• Modify and optimize IPQA scripts to improve efficiency and performance
• Analyze and understand both hard and soft IPs within SOC designs. Work with IP vendors to deliver custom specs needed for MXL project needs
• Review silicon reports and provide detailed analysis to identify and resolve issues
• Work closely with vendors and cross-functional teams to ensure successful project outcomes. Collaborate with design teams to ensure seamless integration of libraries and IP blocks
• Maintain comprehensive documentation of IP Vendor engagement. Troubleshoot and resolve issues related to IP, EDA tools and automation flows

Job Requirements:-

• Bachelor’s or Master’s Degree in Electrical Engineering, Computer Engineering, or a related field
• Minimum 10 years of experience in design engineering or a related field. Good understanding of the IC design flow, including front-end and back-end processes
• Proficiency in Foundation IP, Spice Simulation, Library Characterization, EDA automation scripts, and IP script modifications. Familiarity with library characterization tools such as Liberate, Cadence Genus, or Synopsys Library Compiler
• Strong ability to review and analyze silicon reports and provide detailed insights. Excellent analytical and problem-solving skills
• Excellent interpersonal and communication skills for effective collaboration with vendors and team members
• Experience with advanced node technologies (e.g., 8nm, 4nm, and below)
• Experience with SOC IP design and verification
• Knowledge of emerging technologies such as FinFET, FD-SOI, or III-V semiconductors
• Familiarity with industry-standard EDA tools and methodologies
• Experience with tools such as Synopsys PrimeTime, Cadence Genus, or Mentor Graphics Questa

Location: Next to Bendemeer MRT

Interested candidates may submit detailed CV with the following info:-

• Current salary, including AWS or Variable Bonus
• Expected salary
• Availability

Job Description

• Understanding of Project Specifications, construction drawings and to ensure that all site activities comply with the regulations and client’s requirements
• Monitor site works to ensure the method statements and work procedure are strictly followed.
• Competent in carrying out supervision of structural works by identifying any non-conformity of contractor’s work site
• Ensure the Builder (incl. technical supervisors) executes the work in accordance to Consultant’s instructions
• Check drawings for discrepancies and highlight to Consultant, suggesting possible solutions to prevent delays
• Conduct quality inspections and quality control of materials used for the project
• To ensure proper documentation of site inspection records, safety records and approved /as-built drawings
• Maintaining and updating site records on progress of work, housekeeping and preparing reports
• Verify the contractors’ progress payment, claim in terms of work done and materials/equipment delivered and stored on site
• Witness all the inspection, testing and commissioning sessions performed by the contractors to ensure compliance with designs and specifications
• Report to project QP / Project Consultants Team on quality and progress
• Supervision of demolition of basement/foundation, ERSS construction and all other design works
• To manage & coordinate with the site supervisors (incl. RTO) with respect to C&S engineering works, architectural and M&E engineering works
• Possesses a complete understanding of local requirements, especially to comply with BCA's criteria for build-ability and safety assurance system
• To carry out regular site checks on Builder and ensure compliance on health and work safety in accordance with MOM
• To attend site, progress, variation and coordination meetings.
• Period: 12 months
• Start from: January 2025

Requirements:

• min. Degree in Civil / Structural Engineering or equivalent
• At least 8 years of relevant experience in supervision of Hospital and Architecture work
• Resident Engineer Certificate accredited by IES / ACES is a must, candidate without RE certificate need not apply
• Conversant in statutory code and requirements
• Good team player with strong interpersonal and communications skills essential

Please indicate project involved, expected salary and notice period required in CV.

We regret that only short-listed candidates will be notified.

For more posting, please refer to https://www.facebook.com/profile.php?id=61566487478500&mibextid=LQQJ4d

As a Process Control System Engineer you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. Additional responsibilities include coordinating and carrying out process, equipment and material evaluation/optimization to implement changes at process step, leading and participating in yield improvement and cost reduction activities, handling new process baseline qualifications and managing, auditing and liaising with material suppliers to achieve quality, cost and risk management objectives.

As a PDE Network Engineering Process Control System (PCS) Engineer/Senior Engineer, we will be responsible to develop smart manufacturing solutions towards the Industry 4.0 standard. We will gain exposure and knowledge in many cutting-edge areas including Machine Learning, Advanced Control Solutions and Deep Learning. As a PDE PCS Engineer, we will have the opportunity to develop a complete solution that starts from requirements gathering, data analysis and modeling with big data platform, followed by system development and integration; and then network wide implementation. The work we do directly affects the bottom line of the entire company by providing scrap/excursion control, Statistical Process Control (SPC), Advanced Process Control (APC or Run-to-Run), Fault Detection and Classification (FDC), and overall enhanced process capability. We will meet regularly and team with Process areas to understand their tools, processes, and challenges and work with them to create process control models, strategies, and other methods for ensuring quality output.

Responsibilities

• We develop, implement and improve smart control solutions for optimum manufacturing performances.
• We provide technical oversight, guidance and support for process control implementation
• We conduct intensive data analysis and modeling to identify sources of variation in the process and translate it into control solutions.
• We support PDE KEG team in Classification, Characterization and Categorization and define Data Collection Requirements, Perform Integration and Setup Data Collection in E3 Environment.
• We define Analysis and setup Requirements and Setup Limits and OCAP and engage in periodic review with PCS team and network on BKM practices.
• We develop and deliver training on control systems and related topics.

Requirement

• PhD, Masters/Bachelor’s Degree in Electrical and Electronics Engineering/Computer Science/Statistics/ Mathematics/Physics
• At least 4 years of experience in semiconductor manufacturing advanced process control.
• Experience and knowledge in Programming and Data Analysis. Preferred experience in Python/R/SQL/Hadoop eco-system and/or in the development of web-based applications
• Familiar with Machine Learning.
• Good communication and interpersonal social skills.
• Excellent problem solving and analytical skills.
• Excellent verbal and written communications skills. Good interpersonal skill and a good teammate.
• Excellent Project management skills.
• Ambitious and ability to multi-task and balance dynamic priorities.
• Ability to participate in a multi-functional team environment.
• Willing and capable of international travel, as needed, to accomplish your objectives.

Keen on the role? Apply now!

Optics are critical at KLA and at the core of our tools that are finding defects on wafers and reticles that aren’t visible with the human eye. We do this by using different light sources and nanophotonics to capture images. As an optical engineer at KLA, you’re responsible for developing ultra-high precision optical systems and component designs for complex systems, conducting key optical simulations, modeling and analysis as well as identifying manufacturing issues and developing solutions for these.

Responsibilities:

• Facilitate the optical specifications, lens design, and supplier integration of new optics enabled products for the Optics Development Engineering group.
• Effective use of Code V or Zemax to design low residual aberration generating imaging lenses, relays, spatial/polarization beamsplitters and zoom lenses both from nominal design process to final Monte Carlo tolerance analysis and error budgeting.
• Construct complex system models using above components having all imaging paths with critical parameters needed to produce accurate and efficient raytracing simulations of Strehl/WFE performance, coherent and incoherent PSF size/shape, focal depth of field and pupil, multiple bounce ghost and non-sequential stray light analysis, and polarization ray tracing to quantify transmission, retardance, diattenuation.

Education or experience should include:

• Designing, modeling and analyzing optical systems
• Optical manufacturing processes
• Code V or Zemax Optical software advanced user
• Statistical lens tolerancing
• Ghost and stray light analysis
• Design for manufacturing based on capabilities of Optical metrology
• Specification of precision opto-mechanical assemblies; and
  Data analysis using Matlab or other programs. Any suitable combination of education, training, or experience is acceptable.

Minimum Qualifications

• Doctorate (Academic) Degree and 0 years related work experience; Master's Level Degree and related work experience of 3 years; Bachelor's Level Degree and related work experience of 5 years

We are looking for a Package-Silicon Integration Engineer in Micron's Package Development Engineering(PDE) Group, who will be responsible for driving advanced package development for next generation silicon and package technologies. You will collaborate with various functional teams such as silicon wafer design, package design, wafer fab to meet project requirements. You will drive the technology development through multiple phases of product maturity and contribute to Micron's strategic objectives of Technology leadership.

RESPONSIBILITIES include but are not limited to:

• Work with package design and development teams to complete chip package interaction risk assessment.
• Work with scribe designers and assembly engineers to find solutions for dicing problems and implement relevant design rules/FMEA.
• Work with die designers to enable design for manufacturing in area like die size, scribe width and pad size.
• Collaborate with R&D/manufacturing wafer fabs and packaging teams to solve relevant issues, and improve yield, quality and manufacturability.
• Contribute to development of new silicon and package technologies by engaging with Micron’s internal factories.
• Define test vehicles, plan DOEs, characterize enabling technologies, document best-known-process and hand-off to manufacturing.
• Identify technology, quality, business process gaps and develop solutions.

EDUCATION, EXPERIENCE & QUALIFICATION REQUIRED

• Masters or Bachelor’s degree in Engineering (Mechanical, Materials Science, Electrical, Chemical) or related field
• 5-7 years of semiconductor fab experience in Chip package interaction and integration
• Strong Project / Program management skills
• Possess sound methodology for organizing work, decision-making and setting priorities
• Strong analytical, problem solving, and organizational skills
• Proficiency in computer applications like Excel, Word, Power Point.
• Self-motivated and team-oriented.
• Strong interpersonal, oral and written communications-skills.

Keen on the role? Apply now!

Job Description

• Working with Process Engineer & Engineering team on QC requirement
• Documenting inspection criteria and quality plan
• Work with QA, Process and Product team on corrective action with quality issue
• Work with Process team on in-process audit and FQC audit

Job Requirements:

• Minimum Diploma in Manufacturing /Quality Engineering
• At least 1 year of relevant working experience in Electronics Product Manufacturing environment
• Control of Supplier Quality Assurance (SQA)
• Quality control of in-coming, in-process and out-going products
• Knowledge of ISO 9001, 14001, 13485 & 45001, FDA requirement
• Able to understand IPC requirement in PCB
• Assembly, quality requirement of plastic molding, die casting, extrusion, metal stamping and machining parts

*Please be notified that only shortlisted candidates will be notified*

By submtting your personal data and/or resume, you give consent to the collection, use, and disclosure of your personal data and/or resume by the company (or its agent) for the purpose of the processing and administration by the company relating to this job application.

EA Personnel Name: Chan Jun Wei

EA Personnel No: R1543992

EA License No: 21C0845

Working Location: Buona Vista

Working Time: 5 day work week, 8:45am - 5:30pm

Job Description

● Utilise 3D CAD design tools and perform high precision 3D printing (FDM

& DLP)

● Utilise basic microcontrollers boards such as Arduino, ESP32 or STM32

to build simple circuit boards for sensor control and data acquisition

● Testing and assembly of electronics and mechanical parts and debugging

of software using basic tools like python or C++

● Familiar with maintenance of laboratory inventory and laboratory

administrative tasks (Procurement, equipment preventive

maintenance/repairs and safety matters)

● Enthusiastic, highly motivated, able to multitask, with excellent

interpersonal and communication skills.

● Administrative works, such as ordering and payment with SAP system.

Job Requirements

● Basic experience in 3D CAD design software, like Solidworks and Fusion360.

● Basic experience with microcontroller boards like Arduino, Esp32, STM32.

● Basic experience in handling simple electronics and basic hands-on soldering skills

● Prior experience or have interest in handling administrative tasks like raising Purchase Orders, payment requests, arranging preventive maintenance of equipment and liaising with vendors.

● Diploma/Higher Nitec/ Nitec holders in Bioengineering, Biophysics, physics, mechatronics, electrical engineering, mechanical engineering, computer engineering, or any related fields.

If you do not possess the above experience, your application will still be considered on individual merits and you may be contacted for other opportunities.

By submitting your personal data and/or resume, you give consent to the collection, use, and disclosure of your personal data and/or resume by the company (or its agent) for the purpose of the processing and administration by the company relating to this job application.

Please be notified that only shortlisted candidates will be notified.

EA Personnel.: Chan Jun Wei
EA Registered no.: R1543992
Recruit Now Singapore Pte Ltd
EA License no.: 21C0845

As a Non-Volatile Memory Quality & Reliability Assurance (NVMQRA) Engineer at Micron Technology, you will be responsible for performing formal Failure Analysis of customer reported failing devices via the Returned Material Authorization (RMA) process. You will be required to summarize lab analysis results at the electrical and physical level to identify root cause and establish an associated containment plan. In this role, you will have the opportunities to collaborate with various engineering and manufacturing stakeholders to evaluate and review Corrective Actions /Preventive Actions. You will provide documentation of the RMA findings and oversee the final customer report till closure. In addition, for the senior role, you will be asked to provide guidance and lead the team when solving complex unplanned deviations reported by our customers. Project management skills are necessary and the ability to make critical decisions that directly translate to quality and timely completion of the project is highly desirable. You will also be required to spearhead the sustaining efforts and keeping up to date on new product knowledge, as well as developing and mentoring new talents.

Responsibilities and Tasks

Perform Failure Analysis of Customer Returns

• Understand customer complaint of the memory component failure
• Initiate communication with Micron Customer-facing team for further details on customer complaint, requesting additional questions to provide best opportunity for successful analysis
• Perform bench level analysis including initial data image analyis/examination
• Perform Automated Test Equipment (ATE) analysis and interpret results
• Work with the appropriate engineering teams (e.g., PE, PYE) to perform detailed fault isolation when electrical failure has been confirmed
• Summarize findings and submit for physical failure analysis (PFA).

Provide FA Reports for Micron Customer Facing Team for Communication to External Customers

• Summarize analysis at electrical and physical level into customer friendly formats.
• Work with the appropriate manufacturing Global Quality teams through the appropriate request systems (example: GPSS) for Root Cause and/or Corrective Action and a containment plan
• Identify potential risk to external customers
• Communicate with respective BU (Business Unit) on potential impact to customers
• Communicate FA updates through interim reports or during scheduled meetings with the customers.
• Provide formal FA Report with findings

Sustain Knowledge of Device Capabilities and Characteristics

• Keep up to date with latest Fab/ASM process technology
• Understand datasheet specifications for each device and the differences from previous technode for NOR * NAND product family
• Comprehension of qualification data and potential impact to customer operation
• Stay up-to-date on common customer applications and usage model
• Partnering with customer support team to resolve ongoing customer issues

Qualifications and Experience

• Excellent verbal and written communication skills in English. The ability to communicate clearly and concisely both verbally and in writing is critical in this role.
• Good organization skills and ability to multitask and coordinate between multiple issue at any given time.
• Ability to work effectively in cross-functional teams and handle pressure situations in a professional manner
• Excellent problem-solving and analytical skills with strong attention to details.
• Familiarity with NexTest /Teradyne bench analytical tools, scripting in linux console will be an added advantage.

Candidates with 2-3 years of experience in the semiconductor industry as Product or QA engineer are preferred. Relevant experienced candidates will be considered for the Senior Role.

Education

A Bachelor or Masters Degree in Electrical Engineering or similar field of study.

Job Responsibilities:

• Over-all project management, which includes planning and implementation of assigned projects

• Planning and monitoring of progress and timely completion of projects which includes preparation of detailed progress and status reports

• Coordination with clients & consultants to ensure smooth communication

• Directly reports to the Project Manager

• Preparation of samples according to the requirements of the project

• Ensuring smooth procurement process and timely deliveries, which includes preparation of status reports

• Coordination of deliveries on site

• Issuance delivery orders

• Attending site meetings for smooth coordination

Requirements:

• Minimum Diploma in Electrical/Electronic/Microelectronic/Mechatronic/Green Building & Sustainable or related engineering diploma.

• Minimum 1 year of experience in engineering field

• Computer knowledge in Auto CAD will be added advantage.

• Ability to plan & monitor project progress to ensure timely completion

• Ability to communicate with clients & consultants · Willingness to learn & improve personal skills through team work

• Knowledge in basic project management e.g. preparing monthly project reports, site planning, monitoring & control processes and project risk analyses.

• Good work ethics and team player

• Knowledge in lighting technology and lighting design or electrical engineering fields

• Able to start work immediately

Job Summary:

Drives the design chain value proposition by generating the greatest number of Xilinx design wins in technologies and registrations for customers engaged in Xilinx based product design resulting in growing business. Interface with the engineering departments of customers and suppliers. Performs a variety of product, technical and engineering functions including but not limited to: pre/post sales support, research, design and development.

Principal Responsibilities:

• Work with sales to explore new customer base which use Xilinx products.
• Deliver technical solutions / proposals and provide product presentations to customers.
• Provide technical support to customer which are using Xilinx products from start of development to design win closure.
• Provide technical training to customers
• conduct seminars and workshops
• Willing to travel
• Must be proactive and constantly striving to keep abreast of latest advances in Xilinx technology.

Job Level Specifications:

• Must be highly motivated and able to work independently
• Strong interpersonal and communication skills.
• Good team player
• Good analytic and problem-solving skills
• Integrity & Trust
• Excellent in time management.

Work Experience:

• Minimum 3+ years work experience in Programmable Logic based design / ASIC / Processors / GPU
• Proficient in VHDL/Verilog/C++ programming
• Experience working on AI solutions development using Caffe, Tensorflow, Keras, Pytorch frameworks is a strong plus.
• Experience working on systems in one or more of the following areas is a highly desired: Software Defined Radios, Wireless Communication Systems, Artificial Intelligence,.

Education and Certification(s):

• Bachelor's or Masters Degree in Engineering or equivalent.

About TSL:

TSL Media Group is Singapore’s leading data-driven and content-led media tech collective. The Group has a team of over 200 staff and is home to some of the most well-loved media brands in the region, such as TheSmartLocal, Must Share News and Eatbook. Driven by a mission to connect the world through a hyperlocal lens, TSL Media Group has an annual viewership of over 200 million pageviews and 200 million video views across all of its websites and social media platforms. For more information, visit https://tslmedia.sg/

TSL is built on an energetic and collaborative work culture. We operate on hybrid work arrangements in a bid to aid employees balance work life and personal life.

This is an exciting opportunity that is also open for current students and recent graduates who are passionate about video production, content creation, digital marketing, project management in the new media industry!

At TSL Media Group, you won’t just be joining a team – you’ll be joining a community of creatives who are committed to making a difference in the digital media landscape.

About the role:

We are seeking an Editorial intern who will primarily be gathering information and research before ideating and pitching them to our editors.

You will get to write different types of articles such as perspectives, listicles, reviews, and news posts.

You must be able to commit to a minimum of 24-weeks (6 months) internship.

What you will do:

• Ideate and pitch innovative, creative ideas - effectively communicating the potential impact and value they can bring
• Take charge of the organic content strategy for video publications under TSL media group, tailoring approaches for different platforms
• Constantly keep an eye on global trends and harness them to create organic content that resonates with diverse audiences

The successful candidate should have:

• Possess or currently studying for a Diploma/Degree in Communications/Media Studies or equivalent
• Basic proficiency in Adobe Premiere Pro & After Effects is a must
• Able to shoot and edit videos
• Basic production knowledge from storyboarding to filming and editing a coherent narrative
• Good understanding of the YouTube content scene
• Meticulous and good eye for content/trending topics
• Able to manage multiple activities and projects simultaneously under tight deadlines
• Able to commit for a minimum of 24-weeks (6 months) internship

What you will gain:

• Opportunity to set foot into the media industry through a leading, homegrown media company
• Practical experience in Video Production
• Gain hands-on experience in top funnel to bottom funnel marketing, providing a holistic understanding of the digital marketing ecosystem
• Potential for future employment opportunities based on performance

How to Apply?

Please submit your application with an attached CV and relevant portfolio via: https://careers.tslmedia.sg/jobs/apply/video-production-assistant-141

Kindly note that applicants with a portfolio (i.e. written work) will be prioritised.

Only shortlisted applicants will be notified.

Advance Packaging Integration – Senior Engineer (Package Development Engineering, Silicon Technology Package Integration) (PDE STPI)

We are looking for a Package Silicon Integrator in Package Development Engineering (PDE) Senior Engineer who will lead and drive Micron’s Packaging Technology Development Projects meeting Time to Market (TTM) business unit needs as well as meeting performance targets for Thermal, Electrical, Mechanical, Reliability and Cost. You will collaborate with Micron’s multi-functional team that include Product Development, Wafer level process, Assembly, Test, Manufacturing and Global Quality. Together, we will be responsible for the designing Test Vehicle Development Strategy, and execution to definition, development, and delivery of state-of-the-art product/packages that will shape the future of advanced computing, automotive and mobile products.

Responsibilities will include, but are not limited to:

• Drive package technology integration activities for the silicon test chip development projects and support NPIs to keep roadmap items on track to meet “go to market” timelines.
• Coordinate core team in Development and NPI space of advanced 2.5D/3D packages and standard packaging to drive material and BOM choices, body sizes, manufacturability, and package constructions to achieve acceptable Design for Manufacturing (DFM) and Design for Reliability (DFR) requirements.
• Evaluate wafer design inclusive of bondpad, scribe, pillars/bump and polyimide, and drive materials and BOM choices such as die thickness and mold compound to meet chip package interaction requirements.
• Drive materials characterization from both package and die components to understand chip package interaction mechanism using TMA, DMA, nanoindentation, and packaging mechanical and thermal stress stimulus.
• Drive novel solutions with silicon design and product teams to recommend the optimum package solutions to meet electrical, mechanical (1st, 2nd, and 3rd level interconnect), thermal, reliability, cost, and other system level requirements.
• Interface closely with multi-functional team that include Product Development, Wafer Level Process, Assembly, Test, Manufacturing and Global Quality and manage the product/package to mass production.

Requirements:

• Bachelor/Masters of Science in physics, materials, mechanical, chemical, or electrical engineering. MS or PhD preferred
• 5+ years of relevant experience in semiconductor manufacturing or a related field, with hands-on experience in semiconductor packaging or Frontend processes, specifically in technology on
• Appreciation for Structured Problem Solving
• Ability to interpret die-, package-, and system-level design and simulation (thermal/mechanical/electrical) methodologies and results
• Knowledge in Chip Package Interaction (CPI)
• Experience and working knowledge with 2.5D/3D heterogeneous integration technologies such as WLFO, SoIC, CoWoS, WoW, InFO, and other chiplet/SiP architectures is a plus
• Experience with wafer bumping, package assembly, substrate technology, BOM selection, testing and product development lifecycle
• Excellent communication skills with the ability to convey complex technical concepts to both technical and non-technical partners
• Demonstrated leadership experience in guiding multi-functional teams and driving technical excellence

Keen on the role? Apply now!

Remuneration: Basic Up to $7,000 + AWS

Job Description:

• Design, configure, deploy, and maintain Wintel and Linux server environments, including Windows Server (2019, 2022) and Linux distributions (RHEL, SUSE). Conduct server hardening
• Lead virtualization initiatives using industry-standard platforms such as VMware vSphere, Hyper-V, or KVM.
• Design and manage Storage Area Networks (SAN/NAS), ensuring data availability, integrity, and optimal performance.
• Ensure compliance with industry standards and regulations related to infrastructure and data storage.
• Implement and administer key management and encryption.
• Implement and administer Active Directory, including user accounts, group policies, security settings, and domain controllers.
• Implement and administer AD Public Key Infrastructure and Network
• Policy Server RADIUS services.
• Implement and administer monitoring solutions such as eG
• Innovations, PRTG, Splunk, or Kiwi Syslog server.
• Implement and administer backup solutions like Veeam or Acronis.
• Implement advanced system monitoring solutions to proactively identify and resolve performance and security issues.
• Investigate and resolve complex technical issues related to Windows Server systems, collaborating with teams and vendors.
• Coordinate with third-party vendors, IT providers, and external support for effective service delivery.

Job Requirements:

• Bachelor's degree in Computer Science, Information Systems, Information Technology, or a related field.
• Minimum of 5 years of experience in IT infrastructure engineering with a focus on Windows Server administration.
• Storage implementation experience with Dell EMC / NetApp
• Experience with Wintel servers (Dell), VMware, Microsoft server products, Symantec
• Proven experience in designing on-prem data centre architectures.
• Proficiency in configuring, managing, and troubleshooting Windows Server environments.
• In-depth knowledge of Active Directory, Group Policies, and security best practices.
• Familiarity with virtualization technologies such as VMware or Hyper-V.
• Experience with scripting and automation tools.
• Relevant certifications (e.g., MCSA, MCSE, VCP) are highly advantageous

Daniel Wilson | Reg No.: R24125247

Recruit Now Singapore Pte Ltd | EA Licence No.: 21C0845

Advance Packaging Integration – Senior Engineer (Package Development Engineering, Silicon Technology Package Integration) (PDE STPI)

We are looking for a Package Silicon Integrator in Package Development Engineering (PDE) Senior Engineer who will lead and drive Micron’s Packaging Technology Development Projects meeting Time to Market (TTM) business unit needs as well as meeting performance targets for Thermal, Electrical, Mechanical, Reliability and Cost. You will collaborate with Micron’s multi-functional team that include Product Development, Wafer level process, Assembly, Test, Manufacturing and Global Quality. Together, we will be responsible for the designing Test Vehicle Development Strategy, and execution to definition, development, and delivery of state-of-the-art product/packages that will shape the future of advanced computing, automotive and mobile products.

Responsibilities will include, but are not limited to:

• Drive package technology integration activities for the silicon test chip development projects and support NPIs to keep roadmap items on track to meet “go to market” timelines.
• Coordinate core team in Development and NPI space of advanced 2.5D/3D packages and standard packaging to drive material and BOM choices, body sizes, manufacturability, and package constructions to achieve acceptable Design for Manufacturing (DFM) and Design for Reliability (DFR) requirements.
• Evaluate wafer design inclusive of bondpad, scribe, pillars/bump and polyimide, and drive materials and BOM choices such as die thickness and mold compound to meet chip package interaction requirements.
• Drive materials characterization from both package and die components to understand chip package interaction mechanism using TMA, DMA, nanoindentation, and packaging mechanical and thermal stress stimulus.
• Drive novel solutions with silicon design and product teams to recommend the optimum package solutions to meet electrical, mechanical (1st, 2nd, and 3rd level interconnect), thermal, reliability, cost, and other system level requirements.
• Interface closely with multi-functional team that include Product Development, Wafer Level Process, Assembly, Test, Manufacturing and Global Quality and manage the product/package to mass production.

Requirements:

• Bachelor/Masters of Science in physics, materials, mechanical, chemical, or electrical engineering. MS or PhD preferred
• 5+ years of relevant experience in semiconductor manufacturing or a related field, with hands-on experience in semiconductor packaging or Frontend processes, specifically in technology on
• Appreciation for Structured Problem Solving
• Ability to interpret die-, package-, and system-level design and simulation (thermal/mechanical/electrical) methodologies and results
• Knowledge in Chip Package Interaction (CPI)
• Experience and working knowledge with 2.5D/3D heterogeneous integration technologies such as WLFO, SoIC, CoWoS, WoW, InFO, and other chiplet/SiP architectures is a plus
• Experience with wafer bumping, package assembly, substrate technology, BOM selection, testing and product development lifecycle
• Excellent communication skills with the ability to convey complex technical concepts to both technical and non-technical partners
• Demonstrated leadership experience in guiding multi-functional teams and driving technical excellence

Keen on the role? Apply now!

Summary:

• Basic up to $3800
• AWS + Variable bonus
• Location: Buona Vista
• 5 days work week @ 8.45am - 5.30pm
• Fresh grad is welcomed to apply

Key Responsibilities:

• Utilise 3D CAD design tools and perform high precision 3D printing (FDM & DLP)
• Utilise basic microcontrollers boards such as Arduino, ESP32 or STM32 to build simple circuit boards
• Testing and assembly of electronics and mechanical parts and debugging of software
• Familiar with maintenance of laboratory inventory and laboratory administrative tasks (Preventive maintenance / safety matters)
• Administrative works, such as ordering and payment with SAP system
• Other relevant ad-hoc duties

Key Requirements:

• Min Nitec in bioengineering, biophysics, physics, mechatronics, electrical / mechanical engineering, computer engineering and etc
• Basic experience in 3D CAD design

Interested applicants, please submit your updated resume in MS Words / PDF format by using the APPLY NOW BUTTON.

By submitting your personal data and/or resume, you give consent to the collection, use, and disclosure of your personal data and/or resume by the company (or its agent) for the purpose of the processing and administration by the company relating to this job application.

Please be informed that only shortlisted candidates will be notified.

Your recruiter for this job: Stella

WhatsApp me @ 8772 4117 for a prompt response to your enquiry!

Stella Aw Yong See Hui | R24121552

Recruit Now Singapore Pte Ltd | EA No: 21C0845

Summary:

• Basic up to $6000 (Senior), $5000 (Junior)
• Performance bonus
• Location: AMK / YCK / Central
• 5 days work week
• Familiar with ACMV
• Career advancement & stability

Key Responsibilities:

• Manage and lead the electrical team
• Perform engineering duties: design, engineering calculations, planning, tender and etc
• Perform testing and commissioning of ACMV electrical system
• QA/QC
• Resolve any technical issue during any stage of the project
• Liaise with clients, project manager, contractor and etc
• Ensure the team follows all electrical codes and standards
• Other relevant ad-hoc duties

Key Requirements:

• Min 5 years of relevant experience in Construction Electrical field, including testing and commission
• Familiar with ACMV

Interested applicants, please submit your updated resume in MS Words / PDF format by using the APPLY NOW BUTTON.

By submitting your personal data and/or resume, you give consent to the collection, use, and disclosure of your personal data and/or resume by the company (or its agent) for the purpose of the processing and administration by the company relating to this job application.

Please be informed that only shortlisted candidates will be notified.

Your recruiter for this job: Stella

WhatsApp me @ 8772 4117 for a prompt response to your enquiry!

Stella Aw Yong See Hui | R24121552

Recruit Now Singapore Pte Ltd | EA No: 21C0845

As a Non-Volatile Memory Quality & Reliability Assurance (NVM QRA) Engineer at Micron Technology, you will be responsible for performing formal Failure Analysis of customer reported failing devices via the Returned Material Authorization (RMA) process. You will be required to summarize lab analysis results at the electrical and physical level to identify root cause and establish an associated containment plan. In this role, you will have the opportunities to collaborate with various engineering and manufacturing stakeholders to evaluate and review Corrective Actions /Preventive Actions. You will provide documentation of the RMA findings and oversee the final customer report till closure. In addition, for the senior role, you will be asked to provide guidance and lead the team when solving complex unplanned deviations reported by our customers. Project management skills are necessary and the ability to make critical decisions that directly translate to quality and timely completion of the project is highly desirable. You will also be required to spearhead the sustaining efforts and keeping up to date on new product knowledge, as well as developing and mentoring new talents.

Responsibilities and Tasks

Perform Failure Analysis of Customer Returns

• Understand customer complaint of the memory component failure
• Initiate communication with Micron Customer-facing team for further details on customer complaint, requesting additional questions to provide best opportunity for successful analysis
• Perform bench level analysis including initial data image analysis/examination
• Perform Automated Test Equipment (ATE) analysis and interpret results
• Work with the appropriate engineering teams (e.g., Product Engineering, Product Yield Enhancement) to perform detailed fault isolation when electrical failure has been confirmed
• Summarize findings and submit for physical failure analysis (PFA).

Provide FA Reports for Micron Customer Facing Team for Communication to External Customers

• Summarize analysis at electrical and physical level into customer friendly formats.
• Work with the appropriate manufacturing Global Quality teams through the appropriate request systems for Root Cause and/or Corrective Action and a containment plan
• Identify potential risk to external customers
• Communicate with respective BU (Business Unit) on potential impact to customers
• Communicate FA updates through interim reports or during scheduled meetings with the customers.
• Provide formal FA Report with findings

Sustain Knowledge of Device Capabilities and Characteristics

• Keep up to date with latest Fab/ASM process technology
• Understand datasheet specifications for each device and the differences from previous technode.
• Comprehension of qualification data and potential impact to customer operation
• Stay up-to-date on common customer applications and usage model
• Partnering with customer support team to resolve ongoing customer issues

Qualifications and Experience

• Excellent verbal and written communication skills in English. The ability to communicate clearly and concisely both verbally and in writing is critical in this role.
• Good organization skills and ability to multitask and coordinate between multiple issue at any given time.
• Ability to work effectively in cross-functional teams and handle pressure situations in a professional manner
• Excellent problem-solving and analytical skills with strong attention to details.
• Familiarity with NexTest /Teradyne bench analytical tools, scripting in linux console will be an added advantage.

Candidates with 2-3 years of experience in the semiconductor industry as Product or QA engineer are preferred. Relevant experienced candidates will be considered for the Senior Role.

Education

A Bachelor or Masters Degree in Electrical Engineering or similar field of study.