Advance Packaging Integration – Senior Engineer (Package Development Engineering, Silicon Technology Package Integration) (PDE STPI)

We are looking for a Package Silicon Integrator in Package Development Engineering (PDE) Senior Engineer who will lead and drive Micron’s Packaging Technology Development Projects meeting Time to Market (TTM) business unit needs as well as meeting performance targets for Thermal, Electrical, Mechanical, Reliability and Cost. You will collaborate with Micron’s multi-functional team that include Product Development, Wafer level process, Assembly, Test, Manufacturing and Global Quality. Together, we will be responsible for the designing Test Vehicle Development Strategy, and execution to definition, development, and delivery of state-of-the-art product/packages that will shape the future of advanced computing, automotive and mobile products.

Responsibilities will include, but are not limited to:

• Drive package technology integration activities for the silicon test chip development projects and support NPIs to keep roadmap items on track to meet “go to market” timelines.
• Coordinate core team in Development and NPI space of advanced 2.5D/3D packages and standard packaging to drive material and BOM choices, body sizes, manufacturability, and package constructions to achieve acceptable Design for Manufacturing (DFM) and Design for Reliability (DFR) requirements.
• Evaluate wafer design inclusive of bondpad, scribe, pillars/bump and polyimide, and drive materials and BOM choices such as die thickness and mold compound to meet chip package interaction requirements.
• Drive materials characterization from both package and die components to understand chip package interaction mechanism using TMA, DMA, nanoindentation, and packaging mechanical and thermal stress stimulus.
• Drive novel solutions with silicon design and product teams to recommend the optimum package solutions to meet electrical, mechanical (1st, 2nd, and 3rd level interconnect), thermal, reliability, cost, and other system level requirements.
• Interface closely with multi-functional team that include Product Development, Wafer Level Process, Assembly, Test, Manufacturing and Global Quality and manage the product/package to mass production.

Requirements:

• Bachelor/Masters of Science in physics, materials, mechanical, chemical, or electrical engineering. MS or PhD preferred
• 5+ years of relevant experience in semiconductor manufacturing or a related field, with hands-on experience in semiconductor packaging or Frontend processes, specifically in technology on
• Appreciation for Structured Problem Solving
• Ability to interpret die-, package-, and system-level design and simulation (thermal/mechanical/electrical) methodologies and results
• Knowledge in Chip Package Interaction (CPI)
• Experience and working knowledge with 2.5D/3D heterogeneous integration technologies such as WLFO, SoIC, CoWoS, WoW, InFO, and other chiplet/SiP architectures is a plus
• Experience with wafer bumping, package assembly, substrate technology, BOM selection, testing and product development lifecycle
• Excellent communication skills with the ability to convey complex technical concepts to both technical and non-technical partners
• Demonstrated leadership experience in guiding multi-functional teams and driving technical excellence

Keen on the role? Apply now!

Advance Packaging Integration – Senior Engineer (Package Development Engineering, Silicon Technology Package Integration) (PDE STPI)

We are looking for a Package Silicon Integrator in Package Development Engineering (PDE) Senior Engineer who will lead and drive Micron’s Packaging Technology Development Projects meeting Time to Market (TTM) business unit needs as well as meeting performance targets for Thermal, Electrical, Mechanical, Reliability and Cost. You will collaborate with Micron’s multi-functional team that include Product Development, Wafer level process, Assembly, Test, Manufacturing and Global Quality. Together, we will be responsible for the designing Test Vehicle Development Strategy, and execution to definition, development, and delivery of state-of-the-art product/packages that will shape the future of advanced computing, automotive and mobile products.

Responsibilities will include, but are not limited to:

• Drive package technology integration activities for the silicon test chip development projects and support NPIs to keep roadmap items on track to meet “go to market” timelines.
• Coordinate core team in Development and NPI space of advanced 2.5D/3D packages and standard packaging to drive material and BOM choices, body sizes, manufacturability, and package constructions to achieve acceptable Design for Manufacturing (DFM) and Design for Reliability (DFR) requirements.
• Evaluate wafer design inclusive of bondpad, scribe, pillars/bump and polyimide, and drive materials and BOM choices such as die thickness and mold compound to meet chip package interaction requirements.
• Drive materials characterization from both package and die components to understand chip package interaction mechanism using TMA, DMA, nanoindentation, and packaging mechanical and thermal stress stimulus.
• Drive novel solutions with silicon design and product teams to recommend the optimum package solutions to meet electrical, mechanical (1st, 2nd, and 3rd level interconnect), thermal, reliability, cost, and other system level requirements.
• Interface closely with multi-functional team that include Product Development, Wafer Level Process, Assembly, Test, Manufacturing and Global Quality and manage the product/package to mass production.

Requirements:

• Bachelor/Masters of Science in physics, materials, mechanical, chemical, or electrical engineering. MS or PhD preferred
• 5+ years of relevant experience in semiconductor manufacturing or a related field, with hands-on experience in semiconductor packaging or Frontend processes, specifically in technology on
• Appreciation for Structured Problem Solving
• Ability to interpret die-, package-, and system-level design and simulation (thermal/mechanical/electrical) methodologies and results
• Knowledge in Chip Package Interaction (CPI)
• Experience and working knowledge with 2.5D/3D heterogeneous integration technologies such as WLFO, SoIC, CoWoS, WoW, InFO, and other chiplet/SiP architectures is a plus
• Experience with wafer bumping, package assembly, substrate technology, BOM selection, testing and product development lifecycle
• Excellent communication skills with the ability to convey complex technical concepts to both technical and non-technical partners
• Demonstrated leadership experience in guiding multi-functional teams and driving technical excellence

Keen on the role? Apply now!

Remuneration: Basic Up to $7,000 + AWS

Job Description:

• Design, configure, deploy, and maintain Wintel and Linux server environments, including Windows Server (2019, 2022) and Linux distributions (RHEL, SUSE). Conduct server hardening
• Lead virtualization initiatives using industry-standard platforms such as VMware vSphere, Hyper-V, or KVM.
• Design and manage Storage Area Networks (SAN/NAS), ensuring data availability, integrity, and optimal performance.
• Ensure compliance with industry standards and regulations related to infrastructure and data storage.
• Implement and administer key management and encryption.
• Implement and administer Active Directory, including user accounts, group policies, security settings, and domain controllers.
• Implement and administer AD Public Key Infrastructure and Network
• Policy Server RADIUS services.
• Implement and administer monitoring solutions such as eG
• Innovations, PRTG, Splunk, or Kiwi Syslog server.
• Implement and administer backup solutions like Veeam or Acronis.
• Implement advanced system monitoring solutions to proactively identify and resolve performance and security issues.
• Investigate and resolve complex technical issues related to Windows Server systems, collaborating with teams and vendors.
• Coordinate with third-party vendors, IT providers, and external support for effective service delivery.

Job Requirements:

• Bachelor's degree in Computer Science, Information Systems, Information Technology, or a related field.
• Minimum of 5 years of experience in IT infrastructure engineering with a focus on Windows Server administration.
• Storage implementation experience with Dell EMC / NetApp
• Experience with Wintel servers (Dell), VMware, Microsoft server products, Symantec
• Proven experience in designing on-prem data centre architectures.
• Proficiency in configuring, managing, and troubleshooting Windows Server environments.
• In-depth knowledge of Active Directory, Group Policies, and security best practices.
• Familiarity with virtualization technologies such as VMware or Hyper-V.
• Experience with scripting and automation tools.
• Relevant certifications (e.g., MCSA, MCSE, VCP) are highly advantageous

Daniel Wilson | Reg No.: R24125247

Recruit Now Singapore Pte Ltd | EA Licence No.: 21C0845

Job Description

Reporting to the Project Manager/Engineering Manager, successful applicants will be involved in Power supply system and switching mode power supply development activities such as electrical circuit design, magnetic design, prototyping, evaluation and assisting manufacturing in BETA run of the new product.

Key Skills & Responsibilities

• Understand customer requirement to design or modify XP product to provide Added Value (AV) Solution based on XP design criteria and procedure
• Maintain an in-depth knowledge of all XP products to identify and select the most suitable product for Engineering Solution design.
• Design new products in timely manner to meet the product spec, modify existing designs, improve existing products for better performance and /or cost
• Proposed AV or modified solution based on sales/customer requirements.
• Perform product verification & validation test such as electrical performance, thermal, EMC and DVT to ensure product meet specification before delivered to customer.
• Electrical circuit and schematic design
• Embedded systems design both in hardware
• Firmware design knowledge will be an added advantage.
• Bill of materials (BOM) creation and documentation.
• Breadboard and prototype samples making and debugging
• Design new solution/product within XP standard design practice, safety guidelines, agreed timescales and costs.
• Performed product (AV and modified model) verification and validation, such as electrical performance, thermal, EMC and DVT evaluations,
• There will be some travelling required in conjunction with customer and manufacturing support as well as outside training

Qualifications

Knowledge/Qualifications/Attributes

• Minimum bachelor’s degree in electrical/electronic or higher degree in a related engineering field.
• More than 3 years electrical design experience of power supply/power system; those with more than 5 years’ experience will be considered for senior position.
• For Senior position, Identifies, and review projects main task, schedules, and technical challenges on project delivery timely is required.
• Good project management skill and capable of leading long-term structured problem-solving projects for senior position.
• Familiarity with PCB design using Altium/PADS will be an added advantage.
• Requires good communication, reasoning, problem solving and analytical skills.
• Hardworking, dynamic, strong responsibility and a good team play

About DKatalis

DKatalis is a financial technology company with multiple offices in the APAC region. In our quest to build a better financial world, one of our key goals is to create an ecosystem-linked financial services business.

DKatalis is built and backed by experienced and successful entrepreneurs, bankers, and investors in Singapore and Indonesia who have more than 30 years of financial domain experience and are from top-tier schools like Stanford, Cambridge London Business School, JNU with more than 30 years of building financial services/banking experience from Bank BTPN, Danamon, Citibank, McKinsey & Co, Northstar, Farallon Capital, and HSBC.

About the role

You will be part of a cross-functional agile engineering team (squad) responsible to build, deploy and run (support) one or more of our digital products, focusing on full-stack experience to build robust & resilient systems (front-end & back-end).

You will work closely with Engineers, Product, Design, and other stakeholders, collaboratively ensuring quality gets built in the product, get to see your impact in everyday lives of many people, and have great fun while doing it.

You will share your learnings within and beyond your team (squad) and mentor budding engineers for good engineering practices

What will you do

• Working with engineering+product owners to design, refine and develop the product, from concept to implementation.
• Main contributor in creating best in-class product & experience for our customers by designing, building, scaling, and evolving our platforms, services, and tools
• Communicate, collaborate and work effectively across cross functional teams in a multicultural environment
• Mentor a team of highly talented and motivated engineers
• Ensure the performance, security, and responsiveness of applications built
• Continuously improve code quality, product execution, automatization and customer delight

What you need to have

• You have at least 10+ years of professional experience in a similar role developing highly scalable applications
• Good written and spoken English
• Hands on expertise in Java / Javascript or its derivatives (Typescript, NodeJS, Scala, Kotlin, Springboot, etc)
• Have hands on experience on one of this front-end development (Flutter Preferred)
• Experience to Lean/XP practices (TDD, Pair Programming, Continuous Integration/Delivery for both Mobile & Back-end)
• Experience working in Agile Software development
• Communicate, collaborate, and work effectively across distributed teams in a multicultural environment.
• You’re excited about delivering end-to-end experiences and care about your software architecture across the front-end, back-end, and the APIs that glue them together
• A passion for quality and best practices but with a pragmatism that understands the
  balance between perfection and delivering value in a timely manner.
• Enjoys mentoring more junior engineers on good engineering practices & share knowledge

As a Process Development Engineer, you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. Additional responsibilities include coordinating and carrying out process, equipment and material evaluation/optimization to implement changes at process step, leading and participating in yield improvement and cost reduction activities, handling new process baseline qualifications and managing, auditing and liaising with material suppliers to achieve quality, cost and risk management objectives.

• Excellent execution on assembly process for 1st New Product Introduction (NPI) success and smooth transfer process from NPI to HVM
• Excellent execution of the qualification of NPI products / packages build that proliferate from the pilot products and packages according to planned timeline
• Full responsible on support NPI business process with process TRA, POS, PFMEA/QCP, risk mitigation and documentations.
• Deliver BIC yield and cost on product NPI with integration of DFx BIC package solution, process guideline and design rules.
• Collaboration with cross functional team from NPI to LVM/HVM process transfer.
• On-time execution of NPI Customer samples and Engineering Samples build for new products and packages

SME Process Owner Responsible for Continuous Improvement on Process Yield, Defect Elimination and Process Characterization

• Process owner to perform on-time detection with data analysis for process yield improvement. Lead the defect elimination and continue improvement action, with problem solving methodology, statistical analysis and integration solution decision.
• Process owner to develop process recipe for BIC UPH, conducting process characterization to define process parameters and boundary.
• Continuous develop in depth assembly process technical knowledge, well understand process capability/tolerance//spec limit/CpK, and utilize key tools PFMEA/QCP/APC/FDC/Alarm on assembly processes Cz/Development/NPI.
• Global leader for cross team collaboration on network BKM, process recipe spec and recipe standardization/conversion.

Technology enablement and development – Process, Material, Equipment

• Participate and support Product Roadmap, to enable key process capability and technology development to ensure packaging solution is ready prior 1st Qual Silicon deliver.
• Frequent engagement with equipment and material supplier (at least interval of monthly or daily/weekly for process issues)
• Collaboration with Supplier and involvement Supplier Roadmap (Material/Equipment/OSAT), to understand market trends and competitor’s direction, ensure key process technology and capability enablement is in-line.
• Frequent review and participant Competitor Analysis, to understand market trends and competitor’s technology/capability boundary
• Engage and follow PDE business process (TGR, TORB, KEG interlock) for new technology qualification, alignment and safe launch

Teamwork and General expectation

• Trainer/Buddy/Mentor for new team members, build effective relationships within team and cross team (peers, counterpart)
• Regularly review data and direction with supervisor. Demonstrate sound data analysis and judgment. Present reports and findings with appropriate conclusions, recommendations and decision making.
• Develop, or coordinate development of, training materials for existing/new process
• Safety Identify and promptly report hazards, follow safety procedures and area work rules including proper PPE, lockout and chemical safety.

Requirements:-

• Masters or Bachelor's degree in Mechanical/ Materials Engineering
• Experience in backend engineering process or package development preferred
• Good technical knowledge in component test and/or module manufacturing process
• Excellent data analysis, statistical analysis, data interpretation skills
• Ability to make sound data-driven decisions. Prioritize and apply due-diligence in day to day task.
• Possess analytical and problem solving skills
• Keen interest in semiconductor engineering
• Showcase leadership experience and potential

Roles & Responsibilities

M&E Engineer is responsible for :-

JOB DESCRIPTION:

· Monitor and report on the progress of work to project manager;

· Control the progress of shop drawings, technical submissions and equipment/material procurement/fabrication/delivery status for on-time completion.

· Coordinate with client’s representatives, consultants, and subcontractors on all technical matters, including submission of method statement, drawings, materials, samples and work progress;

· Control site progress & installation quality as per approved;

· Carry out inspection of M&E works prior to concreting or subsequent construction works;

· Assist in supervising and coordinating work closely with other departments;

· Assist for submission of evaluation of progress claim, variation work to M&E Manager

· Participate in all relevant project meetings;

· Responsible for carrying out M&E technical meetings and resolving technical issues with record;

· Responsible for M&E drawing coordination and production of CSD and individual service drawings quality;

· Responsible for conducting inspection to meet with construction schedule;

· Provide and maintain all site inspection records & T&C records up to date;

· Ensure quality of MEP workmanship and compliance with safety and environmental requirements;

· Provide and maintain all site inspection records & T&C records up to date;

· Allocate work and ensure jobs are correctly and properly achieved within standards and SOP.

REQUIREMENTS:

· Diploma / Degree in Mechanical or Electrical Engineering;

· Min of 2 years’ work experience related projects in Singapore building and construction industry;

· Strong Electrical/Mechanical knowledge with hands-on experiences;

· Sound knowledge in BIM, Revit, Autocad would be an advantage;

· Good communication skills with the ability to coordinate with site teams to execute work

Job Responsibilities:-

• Define, architect and document the Design-for-Testability (DFT) concept for SOC’s
• Develop, implement and verify DFT measures
• Work closely with cross-function teams (design/verification, physical, and operation) to ensure all test requirements are met and DFT function is correctly implemented for effective DFT solutions
• Achieve target structural test coverage for logic, memories, serdeses and other mixed signal IPs
• Test pattern generation/verification/post-silicon ATE support

Job Requirements:-

• Master's or Bachelor Degree in Electronics and Communications Engineering or equivalent
• Minimum 10 years of working experience in DFT field
• Good knowledge in Boundary Scan, ATPG Scan, Synopsys SMS and/or MBIST is a must
• Working experience in industry standard tools like Test Kompress, DFT advisor, DFT Compiler, Mentor’s SSN and OCC controller are desirable
• Knowledge of full VLSI RTL2GDSII design flow
• Knowledge in high level programming and script writing
• Knowledge in HDL, synthesis, static timing analysis and constraining will be an added advantage
• Some Experience in Test development and Product engineering

Location: Next to Bendemeer MRT

Interested candidates may submit detailed CV with the following info:-

• Current salary, including AWS or Variable Bonus
• Expected salary
• Availability

Service Desk Engineer

We are looking for experienced full-time Service Desk engineer to provide End User Computing or Service Desk support to APAC Region in Singapore.

Job Responsibilities:

• Provide level 1.5 End User Computing support and well verse in Windows OS.
• Change Management, including review new and implemented changes, chair CAB, review change schedule, maintain dashboard, prepare comms.
• Incident Management, including analysing trends, incident workarounds, monitoring aged incidents.
• Major Incident Management, including communication, being part of the Incident Repsonse Team, managing suppliers
• Problem Management, including chairing any problem meetings, managing active problems, highlighting new problems.
• Release Management – liaising with the testers, vendor, tracking features and defects
• Service Request Management – documenting processes, analysing trends, identifying service improvements, working with teams to design new processes
• Continual Service Improvement – being able to highlight areas of improvement for effectiveness and efficiency
• Service Reporting
• ServiceNow – to assist with the day-to-day management of the tool, including working on incidents and requests

Technical Skills & Qualifications Required:

• Good knowledge of ITIL
• Good knowledge of ServiceNow
• Good knowledge/experience of using the Microsoft suite, specifically including SharePoint , Visio and Excel
• Exposure to/familiarity with automation

Job Requirement:

• Diploma/Bachelor’s degree in computer science / information technology or relevant field.
• At least 3-5 years of relevant working experiences.
• A good team player.
• Excellent interpersonal skills.
• Excellent verbal and written communication skills, and ability to communicate with different audiences and write a range of document types – procedures, comms, training modules.
• Customer centric and focus on service excellence.
• Excellent problem-solving and multitasking skills.
• Sound problem solving and investigative skills.
• Desire to follow best practice and development standards as agreed within IT.
• Keen to learn new skills.
• Working location: Central, Singapore

It would be appreciated if you can share with me your interest on the same.

Have a friend or family member who may be interested in taking the next step in their career? Help them out by referring them to Ennovatez.

You can email your resume to us at [email protected]

Job Description

• Carry out routine maintenance and repair work (Machine and Facilities)
• Perform plumbing, painting, and minor repairs
• Provide technical support and training to staff
• Implement preventive maintenance schedules
• Ensure compliance with health and safety regulations

Job Requirements

• Electrical/Mechanical engineering knowledge is an advantage
• Machinery repair and maintenance is an advantage
• Able to work as a team and individually
• Must be willing to be hands on
• Able to do overtime and work on Saturday and Sunday if required

As an Engineer of MSB Lean Manufacturing, you will manage the implementation of Lean transformation methodologies and tools in Assembly, Test and SSD manufacturing at MSB. You will collaborate closely with site functional teams to identify, explore and implement lean methodologies and tools to drive improvements in throughput, labor productivity, yield, and cycle time performance.

Responsibilities:

• Lead the adoption and implementation of Lean methodologies and tools across Assembly, Test, and SSD manufacturing.
• Facilitate continuous improvement events across different functional teams (e.g., Kaizen, Value Stream Mapping (VSM), Projects, Workshops).
• Develop and sustain programs and systems to foster a Lean culture.
• Conduct labor productivity analyses (e.g., Touch-time, MMR, spaghetti charts) to enhance operator and technician efficiency and reduce operational errors.
• Oversee Utilization/ Overall Equipment Effectiveness (OEE) to identify key sources of losses and improvement opportunities.
• Collaborate with functional experts to identify areas for improvement through the application of Lean methodologies and tools.
• Propose Lean approaches and initiatives, including Kaizen and Continuous Improvement Projects.
• Act as the key integrator between central and site functional teams, developing, driving, and communicating progress on critical Lean improvement initiatives.
• Develop an overall view of critical initiatives and their impact on key performance indicators.
• Provide visibility on program status, including key achievements with clear ownership.
• Trigger interventions to ensure programs stay on track towards targets.
• Support regular reporting and meetings with senior leadership, including deep dives for weekly/monthly reports and ad-hoc senior management updates.

Requirements

• Bachelor’s /master’s in Industrial and system engineering, engineering management, Production & Operation Management, or related field.
• > 2 years of experience in Overall Equipment Effectiveness (OEE) and/or Lean manufacturing fundamentals in the semiconductor industry
• Strong project management, analytical skills and problem solving skills
• Possess good communication and interpersonal skills, with the ability to work effectively with multiple multi-functional teams.
• Knowledge of Semiconductor processes, engineering and/or manufacturing operations

Keen on the role? Apply now!

Summary:

• Basic up to $3800
• AWS + Variable bonus
• Location: Buona Vista
• 5 days work week @ 8.45am - 5.30pm
• Fresh grad is welcomed to apply

Key Responsibilities:

• Utilise 3D CAD design tools and perform high precision 3D printing (FDM & DLP)
• Utilise basic microcontrollers boards such as Arduino, ESP32 or STM32 to build simple circuit boards
• Testing and assembly of electronics and mechanical parts and debugging of software
• Familiar with maintenance of laboratory inventory and laboratory administrative tasks (Preventive maintenance / safety matters)
• Administrative works, such as ordering and payment with SAP system
• Other relevant ad-hoc duties

Key Requirements:

• Min Nitec in bioengineering, biophysics, physics, mechatronics, electrical / mechanical engineering, computer engineering and etc
• Basic experience in 3D CAD design

Interested applicants, please submit your updated resume in MS Words / PDF format by using the APPLY NOW BUTTON.

By submitting your personal data and/or resume, you give consent to the collection, use, and disclosure of your personal data and/or resume by the company (or its agent) for the purpose of the processing and administration by the company relating to this job application.

Please be informed that only shortlisted candidates will be notified.

Your recruiter for this job: Stella

WhatsApp me @ 8772 4117 for a prompt response to your enquiry!

Stella Aw Yong See Hui | R24121552

Recruit Now Singapore Pte Ltd | EA No: 21C0845

Summary:

• Salary up to $6000
• MNC company - stable revenue & perks
• Transport allowances
• Possess own vehicle
• Location: Pioneer
• 5 days work week
• Sales experience in precision engineering related products

Key Responsibilities:

• Develop new business opportunities & sales leads for revenue growth and customer retention
• Achieve sales targets and analyst current market trends and industry information
• Pitch, recommend and fulfil the requirement of customer in terms of products and services offered
• Work closely with the production, application and shipping team to ensure timely delivery and that all order requirements are met
• Attend problem and generate solution
• Other related ad hoc duties

Key Requirements:

• Min Diploma in Mechanical Engineering or equivalent
• Sales experience in precision engineering related products
• Strong technical knowledge in CNC machines
• Possess own vehicle is a must

Interested applicants, please submit your updated resume in MS Words format by using the APPLY NOW BUTTON.

By submitting your personal data and/or resume, you give consent to the collection, use, and disclosure of your personal data and/or resume by the company (or its agent) for the purpose of the processing and administration by the company relating to this job application.

Please be notified that only shortlisted candidates will be notified.

Your recruiter for this job: Stella

WhatsApp me @ 8772 4117 for a prompt response to your enquiry!

Stella Aw Yong See Hui | R24121552

Recruit Now Singapore Pte Ltd | EA No: 21C0845

Summary:

• Basic up to $6000 (Senior), $5000 (Junior)
• Performance bonus
• Location: AMK / YCK / Central
• 5 days work week
• Familiar with ACMV
• Career advancement & stability

Key Responsibilities:

• Manage and lead the electrical team
• Perform engineering duties: design, engineering calculations, planning, tender and etc
• Perform testing and commissioning of ACMV electrical system
• QA/QC
• Resolve any technical issue during any stage of the project
• Liaise with clients, project manager, contractor and etc
• Ensure the team follows all electrical codes and standards
• Other relevant ad-hoc duties

Key Requirements:

• Min 5 years of relevant experience in Construction Electrical field, including testing and commission
• Familiar with ACMV

Interested applicants, please submit your updated resume in MS Words / PDF format by using the APPLY NOW BUTTON.

By submitting your personal data and/or resume, you give consent to the collection, use, and disclosure of your personal data and/or resume by the company (or its agent) for the purpose of the processing and administration by the company relating to this job application.

Please be informed that only shortlisted candidates will be notified.

Your recruiter for this job: Stella

WhatsApp me @ 8772 4117 for a prompt response to your enquiry!

Stella Aw Yong See Hui | R24121552

Recruit Now Singapore Pte Ltd | EA No: 21C0845

Job Responsibilities:-

• Utilize in-depth knowledge of Foundation IP to evaluate and qualify IP’s. Able to benchmark and optimize Std cells/IO’s/memory for optimum performance, area or power needs of a project
• Conduct Spice simulations to verify the performance and reliability of designs on RC extracted netlists
• Perform library characterization to ensure accurate timing, power, and area models. Stay up-to-date with industry trends and emerging technologies in library characterization and PPA analysis
• Help to develop and maintain EDA automation scripts to streamline CAD flow and design processes
• Modify and optimize IPQA scripts to improve efficiency and performance
• Analyze and understand both hard and soft IPs within SOC designs. Work with IP vendors to deliver custom specs needed for MXL project needs
• Review silicon reports and provide detailed analysis to identify and resolve issues
• Work closely with vendors and cross-functional teams to ensure successful project outcomes. Collaborate with design teams to ensure seamless integration of libraries and IP blocks
• Maintain comprehensive documentation of IP Vendor engagement. Troubleshoot and resolve issues related to IP, EDA tools and automation flows

Job Requirements:-

• Bachelor’s or Master’s Degree in Electrical Engineering, Computer Engineering, or a related field
• Minimum 10 years of experience in design engineering or a related field. Good understanding of the IC design flow, including front-end and back-end processes
• Proficiency in Foundation IP, Spice Simulation, Library Characterization, EDA automation scripts, and IP script modifications. Familiarity with library characterization tools such as Liberate, Cadence Genus, or Synopsys Library Compiler
• Strong ability to review and analyze silicon reports and provide detailed insights. Excellent analytical and problem-solving skills
• Excellent interpersonal and communication skills for effective collaboration with vendors and team members
• Experience with advanced node technologies (e.g., 8nm, 4nm, and below)
• Experience with SOC IP design and verification
• Knowledge of emerging technologies such as FinFET, FD-SOI, or III-V semiconductors
• Familiarity with industry-standard EDA tools and methodologies
• Experience with tools such as Synopsys PrimeTime, Cadence Genus, or Mentor Graphics Questa

Location: Next to Bendemeer MRT

Interested candidates may submit detailed CV with the following info:-

• Current salary, including AWS or Variable Bonus
• Expected salary
• Availability

Responsibilities:

- Assess Die Overkilling In Line and Optimization of criteria

• Define Sampling Criteria for Yield Enhancement (YE) Wafer – Initial is to align with RPM lot
• Define and Create YE In Line DL2 & MRDA Flow: Full scan with tighter criteria (higher magnification) with non-die-kill
• Create Deviation flow to Route to YE Flow
• Define and Create YE Probe Flow: Full data logging and Test-to-end to capture as much data as possible
• Data Analysis:
• Correlation of MRDA (Metro Real-time defect analysis) Defect to Probe to identify in line failure mode causing probe fail and failure analysis

- Manage Risk of deviation

- Provide organizational leadership to build functional strategies & processes, and collaborate with partners to deliver strategic solutions

• Establish organizational roadmaps and strategies. Apply extensive knowledge and tenacity to carry out strategies.
• Collaborate with peers to construct global solutions.
• Ensure conflict resolution and assist with identifying escalation paths.
• Align internal strategies and communicate line of sight to corporate strategic objectives.
• Establish and communicate department capabilities to ensure partner expectations are aligned.
• Manage conflict and build effective relationships with internal and external partners.
• Initiate and sustain effective communication with internal and external partners.
• Provide advice to senior and executive management on strategic decisions
• Establishes and manages budget/finances for the team

- Ensure a Safe, Compliant, and Ethical Work Environment

• Maintain knowledge of and apply company safety, labor, and ethics policies.
• Communicate requirements and expectations to leaders and external partners.
• Ensure execution of mandatory training for organization.
• Identify and resolve and / or report potential safety, security, and labor issues.

Requirements

• Bachelors, Masters or PhD in Electrical Engineering, Materials Science, Chemical Engineering, or related field
• At least 4 years of experience in Semiconductor Manufacturing and on a leadership capacity, with focus on Advance Packaging technologies and High Bandwidth Memory (HBM) integration, in yield enhancement
• Experience in PWF (Post Wafer Fabrication), Backend engineering process, assembly package technology development and technical knowledge with die and wafer level process technology with understanding of Micron’s silicon and how it interacts at a package level through CPI (Chip Package Interaction), in yield enhancement
• Strong leadership and vision and must be able to comfortably work across organizational boundaries and geographies.
• Demonstrated ability to influence executives, senior leaders and partners on strategic decisions across multiple functions and geographies.
• Ability to effectively collaborate with multi-functional organizations to understand needs and translate them into actionable plans, deliverables, and resource requirements.
• Demonstrated ability to drive and implement a wide range of global initiatives with global teams.
• Ability to be guided by business objectives and determine best methods for delivering results.
• Organized, meticulous, and strong focus on results.
• Demonstrated ability to inspire teamwork and to effectively lead others.
• Proven facilitation skills including the ability to influence others, build consensus, and resolve conflict.
• Demonstrated track record in baseline performance improvement, business process creation, process simulation techniques, data interpretation skills and proficiency in statistical analysis/method.
• Excellent analytical skills and organizational competency
• With good oral and written English communication skill

Keen on the role? Apply now!

As a Package Design Engineer within the Package Development and Engineering (PDE) organization in Micron Technology, you will provide package definition and designs for advanced semiconductor devices. You will be working with a multi-functional team across several geographies to create package design databases such as package stack-up, simulation, route-study, substrate/lead frame layout, wire bond diagrams, and other design documentation. You will be ensure the completion of design activities within the project schedule and ensure that design outputs are within Assembly and vendor capability.

Responsibilities will include, but are not limited to:

• Conduct feasibility studies for various package options and assess designs for manufacturability and reliability.
• Work closely with multi-functional team to address packaging design challenge in the area of layout, electrical, thermal, mechanical, assembly and reliability.
• Interact with PDE assembly team and external assembly subcontractor partners to recommend package solutions to meet customer and/or market requirements
• Generate and update assembly documents in database. Provide drafting and drawing support for package drawings, interposer drawings, and manufacturing drawings.
• Support package and DFMEA reviews with assembly engineering and subcon teams.
• Support package technology development, including material selection, process development, DOEs, and related activities
• Support package technology development, including material selection, process development, DOEs (Design of Experiments), and related activities.
• Track and drive program milestones to ensure timely development execution.
• Provide design support for thermal/mechanical/electrical simulation analysis.
• Support and contribute to the Global Design, Simulation and Substrate (GDSS) team on continuous improvement efforts such as:Global design alignment activities
  Continuous improvement efforts
  Package design rules
  Package roadmaps
  Competitive Analysis review

Requirements:

• Master (preferred) or Bachelor of Science degree in Electrical Engineering or Mechanical Engineering with a minimum of 5 years of experience in semiconductor packaging industry OR PhD graduates in Electrical Engineering
• Candidates must possess a strong design knowledge of high-density (Wirebond + Flip-Chip) packaging architectures, die stack-up, packaging layout optimization.
• Excellent communication skills, both oral and written in English.
• Excellent problem solving and analytic skills.
• Experience with Cadence SIP, APD and AutoCAD software tools is preferred.
• Good understanding of Silicon IP, floorplan and Signal/Power Integrity is a plus.
• Ability to work independently, prioritize and manage numerous projects with minimum supervision.
• A global perspective and the ability to work in a multicultural environment.

Performs semiconductor design engineering assignments including engineering and designing packaging stack-up, layout checking, documenting specifications, modifying and evaluating packaging risk in the areas of electrical, thermal, mechanical and reliability. Reviews package design requirements, define the package stack-up and conduct final design review. Typically responsible for projects, or portions of projects, to design, fabricate, modify, and evaluate semiconductor Packaging.

Your main responsibilities include:

• Develop and maintain product datasheet testing and characterization test programs for NAND and NOR components
• Working with product reliability engineers to define test flows for individual products
• Provide support to operation team to ensure seamless execution for generated test flow on the tester with live product
• Perform electrical failure analysis for failure validation and characterization

You are encouraged to apply if you can demonstrate some of the qualities listed below:

• Master's or Bachelor's degree in Engineering field. Microelectronic/Electrical/Computer Engineering fields are preferred.
• Positive attitude and self-motivation towards learning and development.
• Good analytical mindset and structured personality.
• Good written and verbal communication skills.
• Hands on experience with C++/Python and Object-Oriented Programming is a plus
• Understanding Automated Test Equipment and flash memory is a plus.
• Fresh graduates are welcome to apply.

Working location:

• 990 Bendemeer Road, Singapore 339942

Service Desk Engineer

We are looking for experienced full-time Service Desk engineer to provide End User Computing or Service Desk support to APAC Region in Singapore.

Job Responsibilities:

• Provide level 1.5 End User Computing support and well verse in Windows OS
• Diagnosing end-user system failures and implement repair solutions.
• Diagnosing printer and other peripheral devise failures and implement repair solutions.
• Troubleshooting network devices in order to ensure connectivity from the PC to the Network.
• Providing installation and upgrading services of hardware and software.
• Configuration and troubleshooting of phones and other mobile devices, tablets, and PDAs.
• Setup and troubleshooting audio/video equipment such as projectors and video conference equipment

Job Requirement:

• Diploma/Bachelor’s degree in computer science / information technology or relevant field.
• At least 1-1.5 years of relevant working experiences.
• Knowledge of multiple manufacturers and operating systems.
• Excellent troubleshooting capability.
• Using established procedures and working under immediate supervision, performs assigned tasks.
• Work is routine and instructions are usually detailed.
• Resolves routine questions and problems and refers more complex issues to higher levels.
• A good team player.
• Excellent interpersonal skills.
• Customer centric and focus on service excellence.
• Excellent problem-solving and multitasking skills.
• Good verbal and written communication skills and ability to interact with other teams.
• Working location: Central, Singapore

It would be appreciated if you can share with me your interest on the same.

Have a friend or family member who may be interested in taking the next step in their career? Help them out by referring them to Ennovatez.

You can email your resume to us at [email protected]

Job Responsibilities:

• Assist Project Manager in all on-site technical/ engineering matters and authority submissions.
• Prepare submission of shop drawing / Materials / MOS/ Monthly Progress Claims and PM Reports.
• Lead in Site Coordination and execution relating to the construction project.
• Planning of micro scheduling with other trades/disciplines against Master program
• To update structural/architectural/M&E progress with scheduling tools.
• Supervise and monitor projects are carried out in accordance with the company’s operating procedures, quality standards & contractual specifications.
• Ensuring supervisors & foremen meet clients’ regulatory work requirements.
• To check and ensure compliance with TOP checklist
• Responsible for all inspection activities being carried out.
• Ensuring environmental, safety, and health practices are carried out at all times.

Requirements:

• Degree in Civil or Structural Engineering recognized by PE Board/ BCA
• 4-5 years experience in Building Engineering projects
• Experience with Precast/PPVC/MET projects will be a plus
• Proficient in MS Office, AutoCAD, and BIM
• Organized, meticulous with positive work attitude
• Able to work independently and a team player
• Good analytical, supervision, and communication skills
• Completed QM project and a registered Core-trade Foremen/ Supervisor would be an added advantage

About Us:

We develop comprehensive software products and solutions ranging from IT consultancy to infrastructure and hardware setup to optimise customers' experiences. To establish ourselves as a leading provider of applications and healthcare support services for the Asian market, and partner healthcare customers to build a safe medical environment for all.

We are driven by our group philosophy as defined below:

1. Provide the best to our customers through a service-oriented culture

2. Create new value through innovation

3. Realise greater possibilities through advanced technology

Roles and Responsibilities:

• Responsible for providing technical assistance and support related to computer systems, hardware or software testing
• Responds to queries, runs diagnostic programs, isolates problem, and determines and implements solution
• Provide technical assistance and support for incoming queries and issues related to computer, systems, software, and hardware
• Respond to queries either in person or over the phone
• Write training manuals
• Maintain daily performance of computer systems
• Respond to email messages for customers seeking help
• Ask questions to determine nature of problem
• Walk customer through problem-solving process
• Install, modify, and repair computer hardware and software
• Run diagnostic programs to resolve problems
• Are required to apply information security in accordance with the established policies and procedures of the organization.

Requirements:

• Diploma or Certificate in IT/Computer Engineering with 1-2 years of working experience in technical support
• Experience in basic networking support
• Experience in supporting OS platforms such as Windows 10 and MS Office applications
• Prefer candidates who are resourceful, good working attitude & takes initiative
• Good communication skills and administrative skills

Responsibilities:

- Assess Die Overkilling In Line and Optimization of criteria

• Define Sampling Criteria for Yield Enhancement (YE) Wafer – Initial is to align with RPM lot
• Define and Create YE In Line DL2 & MRDA Flow: Full scan with tighter criteria (higher magnification) with non-die-kill
• Create Deviation flow to Route to YE Flow
• Define and Create YE Probe Flow: Full data logging and Test-to-end to capture as much data as possible
• Data Analysis:
• Correlation of MRDA (Metro Real-time defect analysis) Defect to Probe to identify in line failure mode causing probe fail and failure analysis

- Manage Risk of deviation

- Provide organizational leadership to build functional strategies & processes, and collaborate with partners to deliver strategic solutions

• Establish organizational roadmaps and strategies. Apply extensive knowledge and tenacity to carry out strategies.
• Collaborate with peers to construct global solutions.
• Ensure conflict resolution and assist with identifying escalation paths.
• Align internal strategies and communicate line of sight to corporate strategic objectives.
• Establish and communicate department capabilities to ensure partner expectations are aligned.
• Manage conflict and build effective relationships with internal and external partners.
• Initiate and sustain effective communication with internal and external partners.
• Provide advice to senior and executive management on strategic decisions
• Establishes and manages budget/finances for the team

- Ensure a Safe, Compliant, and Ethical Work Environment

• Maintain knowledge of and apply company safety, labor, and ethics policies.
• Communicate requirements and expectations to leaders and external partners.
• Ensure execution of mandatory training for organization.
• Identify and resolve and / or report potential safety, security, and labor issues.

Requirements

• Bachelors, Masters or PhD in Electrical Engineering, Materials Science, Chemical Engineering, or related field
• At least 4 years of experience in Semiconductor Manufacturing and on a leadership capacity, with focus on Advance Packaging technologies and High Bandwidth Memory (HBM) integration, in yield enhancement
• Experience in PWF (Post Wafer Fabrication), Backend engineering process, assembly package technology development and technical knowledge with die and wafer level process technology with understanding of Micron’s silicon and how it interacts at a package level through CPI (Chip Package Interaction), in yield enhancement
• Strong leadership and vision and must be able to comfortably work across organizational boundaries and geographies.
• Demonstrated ability to influence executives, senior leaders and partners on strategic decisions across multiple functions and geographies.
• Ability to effectively collaborate with multi-functional organizations to understand needs and translate them into actionable plans, deliverables, and resource requirements.
• Demonstrated ability to drive and implement a wide range of global initiatives with global teams.
• Ability to be guided by business objectives and determine best methods for delivering results.
• Organized, meticulous, and strong focus on results.
• Demonstrated ability to inspire teamwork and to effectively lead others.
• Proven facilitation skills including the ability to influence others, build consensus, and resolve conflict.
• Demonstrated track record in baseline performance improvement, business process creation, process simulation techniques, data interpretation skills and proficiency in statistical analysis/method.
• Excellent analytical skills and organizational competency
• With good oral and written English communication skill

Keen on the role? Apply now!

JOB SCOPES & JOB RESPONSIBILITIES

• Overseeing the construction activities and progress, planning, implementation and monitoring work schedules in accordance with the master and detailed work programme.
• Liaise with Professional Engineer on civil related works.
• Liaise with consultants for technical issues and coordinate the site activities with subcontractors.
• Handling of technical and engineering problems.
• Provide guidance to supervisors in relation to construction works, ensure progress according to schedule, quality standards are maintained site inspections are carried out and technical issues are resolved on time.
• Prepare report and method statement whenever necessary.
• Manage and control workers and monitor their work closely to keep site safer and neat.
• Supervise ongoing site activities closely.
• Other ad-hoc assigned by the Company.
• Good attitude and relevant working experience.

JOB REQUIREMENTS

• Recognised Certificate in Civil Engineering.
• Minimum 5 Years experience in the construction site.
• Independent with good communication skills.
• Good organizational and planning skills.
• Effective communication and coordination skills and teamwork.
• Able to work independently and in a team.

Responsibilities:

• Install, configure, troubleshoot and support servers or virtual machines (Hyper-V / VMware) running on Windows Server operating systems.
• Perform system maintenance, upgrade, patches and incident resolution outside of working hours when required.
• Monitoring and implementing backup solutions for critical systems and data regularly.
• Implement and maintain IT security measures and best practices for systems and address security incidents with latest security trends.
• Assist in the planning and implementation of IT projects, ranging from system upgrades to new system deployments.
• Create and update technical documentation pertaining to systems administration for on-premise systems, Azure and Microsoft 365.
• Any related ad-hoc duties as assigned.

Requirement:

• Minimum 3 years of experience as a System Engineer or Server Administrator.
• Experience with Active Directory, Group Policy, Virtualization, Patch Management, Microsoft Entra and Microsoft 365.
• Experience in cloud platforms such as Azure and AWS.
• Possess excellent communication, problem-solving and analytical skills.
• Ability to work independently.

Job Summary:

The Applications Support Engineer provides technical support and maintenance for software applications, ensuring their optimal performance and availability. This role involves troubleshooting issues, implementing solutions, and collaborating with other IT teams to enhance system functionality. The Applications Support Engineer is also responsible for documenting processes, managing application configurations, and assisting in the deployment of software updates and patches.

Key Responsibilities:

• Application Support: diagnose and troubleshoot application issues reported by end-users or detected through monitoring tools. Provide timely and effective resolution to application problems, escalating issues when necessary.
  
• Incident and Problem Management: manage and resolve application-related incidents and problems, ensuring root causes are identified and addressed. Maintain an incident log and provide regular updates to stakeholders on the status of issues.
  
• Application Maintenance and Updates: work with development teams to deploy new versions and patches of applications and implement changes. Test and validate updates before deployment to ensure minimal disruption to users.
  
• User Support and Training: assist end-users with application-related queries and provide technical support. Conduct training sessions for users on new features or changes to applications. Develop user guides and support documentation to assist end-users.
  
• Configuration Management: manage application configurations, including settings, permissions, and access controls. Ensure that application configurations are documented and maintained in line with organizational standards.
  
• Collaboration and Communication: work closely with developers, system administrators, and other IT teams to resolve application issues. Communicate effectively with stakeholders, providing regular updates on application status and issues. Participate in project meetings to provide input on application support requirements.
  
• Continuous Improvement: identify areas for improvement in application performance and user experience. Propose and implement solutions to enhance application efficiency and reliability.
  

Requirements:

• Degree in Computer Science, Information Technology, or related field.
• Preferably 2 to 5 years of experience in application support, software troubleshooting, or a related role.
• Beneficial to have experience in an Aircraft Engine Maintenance Repair and Overhaul shop.
• Good knowledge of MS Excel, databases, SQL, and scripting languages (e.g., Python, PowerShell).
• Strong problem-solving and analytical skills.
• Excellent communication and interpersonal skills.
• Ability to work independently and as part of a team.
• Strong customer service orientation.
• Training provided for candidate without prior experience.