As Facilities Utilities Engineer of Global Construction team, you will be an integral member of the Global Facilities Line Planning Group responsible for overseeing and managing the analytical duties related to facility utilities planning program, assisting in the planning and design of facilities construction and expansion projects. You will be responsible for managing Micron Facility utilities consumption assessment process, analyzing facility future needs and resource utilization analysis.

In this role, you manage utilities related projects, programs and will help to plan and prioritize resources needed to achieve results and assure accurate tracking of projects and programs to predict results and outcomes critical to success.

Responsibilities

• Collect, classify, evaluate utilities data and information used in supporting the facilities utilities consumption management and capital program.
• Create reports, charts, graphs and eventual monitoring system for Facilities Services.
• Define, manage and improve on Micron Tools Utility Matrix (TUM) Business Process.
• Drive network alignment among Micron sites in tools utility matrix (TUM) database.
• Drive network alignment across sites in Tools’ process independent utilities database and eventually moving towards alignment for Tools’ process dependent utilities database.
• Work closely with Teams from Global and Site Facilities, Global Planning, Facilities Transfer Team, CPEE & IEs to coordinate and drive facility utilities estimates for new layout, technode scenarios.
• report program status, wins, issues, and actions to program sponsor for broadcasting to global leadership team and stakeholders
• Ensure Roles, Responsibilities and Accountabilities are fully understood by the participated teams

Skills / Qualifications

Minimum Qualifications:

• The candidate should possess a BSc or Beng in Engineering from a recognized institute of higher learning.
• Experience in wafer fab facilities systems is highly valued.
• Candidates with experience in facilities operation & construction.
• Minimum 3 years of Facility or Equipment tool Management experience in Semiconductor manufacturing environment
• Demonstrable experience in the Facility or Equipment tool utilities Management and/or other relevant industries is strongly preferred.

JOB RESPONSIBILITIES:

• Assist the Project Manager in developing and managing project schedules.
• Coordinate with architects and contractors to ensure project success.
• Review project plans and electrical design, specifications, and contracts.
• Ensure compliance with building codes, safety regulations, and environmental requirements.
• Monitor project progress and make adjustment as necessary
• Communicate project status to Project Manager
• Manage project risks and identify opportunities for improvement
• Provide technical support to project team members
• Ensure quality control and quality assurance for all project deliverables
• Attend project meetings and facilitate communication among team members.
• Any other ad-hoc projects assigned from time to time

QUALIFICATION:

• Diploma or Degree in Electrical Engineering

WORKING EXPERIENCE:

• For Diploma holder, more than 3 years’ experience in handling project management.
• For Degree holder, 1-2 years similar experience
• Computer literacy in Microsoft Office
• Strong knowledge of construction materials, methods, and regulations
• Experience in managing and supervising construction teams
• Strong problem-solving and decision-making skills

Responsibilities :

Equipment Performance

• Come up with methodologies to improve %UD/SD performance globally.
• Design Tier 2/3 matrices to improve %UD/SD.
• Develop suitable global reports for sites to benchmark against each other on %UD/SD
• Design and implement a process to improve workstations MOR %UTIL through %MA & Lost time improvement.
• Study the wafer path taken in critical workstations.
• Identify key data that needs to be extracted from the tool EDA system to map the time taken to complete wafer processing.
• Collaborate with SMAI to build a system to compare the wafer processing time between tools within a workstation.
• Quantify capex avoidance/savings that arise from improving Equipment Performance.

Address Tool to Tool mismatches in Process Areas

• Build a database of inputs for all process areas to address tool to tool mismatch proactively.
• Database of inputs should cover the cross matching of software, hardware & process related inputs.
• Collaborate with SMAI to build a system using these inputs to identify & fix tool to tool mismatches in a workstation.
• Appropriate measures, processes, and metrics should be devised to handle and maintain tool to tool mismatches effectively.

Standardization of practices & BKMs in Process Areas

• Setup global area alignment teams to address chronic issues, drive improvements & eliminate wastes.
• Channel improvements and lessons learnt established from various forums, eg. TPM Forum, Excursion Review, etc.  into global area forums to decide on the standards for deployment, implementation and audit.
• Design suitable matrices for each process area so that improvements impact the 4 pillars.
• Create a library of area level BKMs for Equipment & Process Engineers to search for standards involving the setup of Equipment & associated processes.
• This library must also serve the purpose to feed-forward area level BKMs to TD for process development & HVM for improvement work that will impact the 4 pillars.
• Sit in transfer reviews to ensure N-1 standards are fed-forward to N technode for sustenance

Demonstrate Leadership

• Adopt benchmarking and deliver strategies to close the gaps.
• Challenge complacency and do not let strong market conditions give a false sense of reality.
• Gain insights into the competitor's culture, approach, and capabilities.
• Understand that the only way to guarantee our future is to be the best.
• Understand the challenges your team faces.
• Don’t underestimate the effort it takes to be number one.
• Ignite the passion in people to achieve the impossible.
• Dare to set high targets, expect innovation and breakthroughs.
• Give honest, tough, but productive feedback to the team, and be willing to receive it yourself.
• Challenge others and be willing to stand for something.
• Have the courage to turn a crisis into an opportunity.
• Lead from the front and lead by example.
• Become the team that will out-innovate and out-execute the competition. Don’t accept anything less.
• Be unrelenting and “unreasonable”.
• Cultivate a habit of winning. Winning breed’s confidence.
• Find top talent willing to take risk and support them in doing the exceptional.
• Face unsolvable problems head-on and turn them into opportunities.
• Develop teams and team members to enable them to reach their full potential and reward them accordingly.
• Support team members with coaches and mentors who push TM outside their comfort zone.
• Lead the team to success.
• Leave a legacy behind that we are proud of.
• Believe in your team.

Requirements :

• Bachelors Degree in Electrical / Electronics / Semiconductor Engineering
• 10 years of experience and/or demonstrated ability in any of the following Field (Equipment or/& Process)
• Preferably experienced in Photo & PCVD area.
• Applicants must have a consistent record to collaborate globally and influence by indirect leadership in order to drive resourcing to critical projects across Micron.
• Applicants must have a shown capability in dealing with complexity and an ability to apply resources effectively to bring clarity to required actions.
• Applicants must hold a record of performance excellence for current area of responsibility; and are recognized as having demonstrated successful leadership characteristics both in present and past jobs.
• Applicants are viewed by current reports as an excellent mentor, team builder and motivator.
• Applicants must have demonstrated the ability to solve problems across multi-functional groups, both within and outside their department/Site.
• Applicants must have experience handling large, multi-layer groups that encompass a variety of fields.
• Applicants must have proficiency in handling through systems, informing, organizational agility, dealing with ambiguity, and listening. They must demonstrate a strong alignment with Micron Behaviors and the skills they'll use every day.

As a NAND CMOS Device Engineer, you will help set the direction for current and future CMOS technology for Micron’s NAND Memory Technology Roadmap!

You will work with the Design Team to set electrical targets and define transistor structures to meet these targets. You will guide the device technology development and be in close relation with Process Integration, Design Engineering, Design, Design Rules, Reliability, Transistor Modeling, TCAD (Technology Computer-Aided Design), and Parametric Test, to name a few! In addition, you will ensure that the developed technology is manufacturable and highly yielding and that these considerations are designed into the technology from the start.

Together with your peers, you craft and implement our NAND-CMOS roadmap and make sure to align to product roadmaps

• You give directions on how to improve our device portfolio, both in performance and cost effectiveness
• You define, execute, and analyze silicon experiments for future device generations
• Interface with Design Engineers to define transistor targets, deliver transistor models, and optimize critical layout constrained Design Rules
• Work with TCAD simulation group to develop strategies for transistor structures to meet targets
• You strive to ensure that transistor models are correctly targeted to anticipate final silicon
• Define electrical test structures for transistors, isolation, design rule verification, and process monitoring
• Highly motivated to ensure transistors are developed meeting the required reliability standards
• You take initiative to collaborate with Manufacturing to ensure transistors are performing as expected and to debug yield/reliability issues
• You foster and enable a collaborative working style and team spirit by mentoring less experienced colleagues

Minimum Qualifications:

• MS/PhD in Electrical Engineering or related field, PhD in Semiconductor Device Technology preferred
• 5 plus years industry experience in the field of CMOS device design, simulation, characterization
• Experience in developing advanced logic transistor technologies
• Experience in developing Analog FETs operating at higher Voltages
• Preferred: Experience in the field of High Voltage applications, reliability, characterization, device development
• Understanding of analog design concepts
• Good presentation skills
• Excellent team and mentoring skills

Develops new or modified process formulations, defines processing or handling equipment requirements and specifications, and reviews processing techniques and methods applied in the manufacture, fabrication, and evaluation of products. Involvement may begin at any step from pilot plant to full-scale manufacturing. Coordinates design requirement review with appropriate engineering/scientific personnel to ensure compatibility of processing methods. Compiles and evaluates test data to determine appropriate limits and variables for process or material specifications. May conceive and plan projects involving definition and selection of new concepts, equipment automation technology, and approaches in the processing or development of new or improved processes.

• Application for Building Management System / Energy Management in Singapore/ PLC Programming
• Lead technical discussion and clarification with the customer acting as key contact person for all technical related topics. Under Project Manager leadership monitor engineering deliverables and progress through continuous communication with team members and perform regular technical status reports. Take active part in meetings with the customer.
• Perform and get customer approval on basic and detailed design of integrated solutions in line with the contract (technical, time & performance requirements) and leveraging of products and systems, maximize project profitability and manage technical risk.
• Produce engineering outputs such as System architecture, sub-systems interfacing points, detailed point schedules, control panel drawings, equipment and control valve schedules, description of operations, database generation, graphics development, system hardware and software configuration and programming, etc. Proposal of HVAC and EMS controls strategies in various application.
• Master all technical aspects of the Project: design, integration, testing, FAT, installation,
  commissioning, warranty. Validate technical choices in compliance with the design (based on Technical
  Design Process). Manage stakeholders involved in the execution.
• Proficiency in Programmable Logic Controller, SCADA and DDC Controllers (preferably in Schneider
  brand) development and implementation for redundant system architectures on HVAC applications
  including chiller systems.
• Perform documentation relating to the project properly and promptly dealt with in the correct
  contractual manner. Production and control of RFI's, production of related design, engineering and
  commissioning documentation and operating and maintenance manuals in line with project
  requirements.
• Work in close collaboration with the customer’s project teams, consultants, main contractor, 3rd party
  vendors, Schneider Electric PM & technical leaders for sub-parts to understand the project milestones
  & deliverables and contribute to the overall profitability of projects and to achieve high level of
  customer satisfaction.
• Constantly strive to improve efficiency of the Engineering Solutions through use of standards, tools,
  best practice and lessons learned associated to Controls Strategy, Programming, Graphics, Database
  generation, testing and Engineering Documentation to final Operation & Maintenance Manual.
• Insure good project execution within allocated budget. Identify and anticipate potential risks vs. agree
  budget. Identify and implement technical optimization to save time and cost. Contribute to overall
  Project risk analysis, assess technical risks and propose all necessary actions to avoid, mitigate or
  reduce its impacts. Pro-active in developing and implementing risk response strategies to minimize or
  remove risks
• Identify any potential changes on the job versus the contract or agreed design. Work closely with the Project Manager to specify the change and its implications including the quotation until getting the variation order which will contribute to Project Margin Improvement.
• Master from technical perspective all technical parts of the delivery sub-contracted to external vendors in strong coordination with purchasing team. Implement clear and meaningful scoping of subpart of project scope to insure effective progress and completion monitoring
• Alert on a possible non-technical feasibility as soon as identified. Provide necessary reporting to the PM and management

Responsibilities :

• Establish Detection to have 100% Inline visibility and Inline control

• Improve Detection strategy, system, and methods to continuously strengthen detection performance.

• Enhance Detection capability and strategy to enable Yield improvement, improve Cycle of Learning and strengthen Defense Line.

• Establish and improve BKM (Best Known Method) related to RAM Detection performance, RAM detection cost and RAM supplier engagement

• Ensure BKM sharing spans across all sites regardless of technology and/or site mission differences.

• Set up process parameters for Inspection and Measurement equipment.

• Plan and Evaluate through supplier demo, tool evaluation or H2H (head to head) and Promote new equipment/ material through TOR (Tool of Record) process.

• Implement abnormal analysis and improvement.

• Facilitate and drive global peer groups (HVM and TD) to ensure alignment on strategy and roadmap to achieve area objectives

• Prioritize resources (internally across network and/or externally with Suppliers) to close any gaps.

• Lead Copy Smart Team (CST) and hold the teams accountable to deliver to timelines/commitments. Support cross sites alignment activities through CST and provide strategic direction for the team.

• Set Business Process to handle your area(s) of responsibility to meet the expectations of programs and business processes and adhere to the standards required by those programs and processes.

• Actively provide recommendations to improve and optimize programs and processes to the respective program and/or process owners.

• Be part of the team to handle global business for RAM area, including Tool of Records (TOR), Model of Records (MOR), Manufacturing Tool Evaluation Program (MTEP), DOC2, Executive Review Meeting (ERM), Supplier Change Notice (SCM) documentation etc.

• Keep Acceptance Documentation and Configuration Specs (ADCS) updated to current TOR configuration in your area(s) of responsibility.

• Handle projects with proper Project Management process with metric to track project success.

• Initiate, develop, drive and support strategies that not only benefit one site, but Micron network as a whole.

• Identify and share Best Known Method (BKM) across sites and track compliance to agreed upon alignment to BKMs.

• Track Fab performance metrics for benchmarking purposes. Identify gaps and area of improvements for Fabs.

• Partner with Technology Development and Global Procurement to drive suppliers' competitiveness in RDA and Metrology area to reduce CapEx and OpEx.

• Provide tactical support and coordination for the Fabs as required for issues of People, Safety, Time to Mature cummulative Yield, Quality, Cost, and Cycle Time.

• Engage and drive suppliers on Tool roadmap (MRM), Technology sharing, and other projects

Requirements :

• Masters/Bachelors in Engineering

• Relevant working experiences in RDA and/or Metrology

• Willing and capable of international travel, including Extended International Business Travel (EIBT) assignment to 6 months as needed, to accomplish the goals. Work with suppliers to address issues of spares delivery, quality, performance and change management.

• Good communication skill, maintain a strong and open relationship with peer group and appropriate team members in other functional areas such as Process Integration Engineering, Quality Systems, Production Operations Management, and Purchasing.

• Promote worldwide sharing and transfer of area-specific domain knowledge

Working Location : 1, North Coast Drive, Singapore 757432

Key Responsibilities:

• Assist in evaluating manufacturing processes by supporting research programs, applying knowledge of product design and materials, and collaborating with operators and vendors.
• Help design and develop manufacturing processes for new products and enhancements, including related tooling and fixtures.
• Support process troubleshooting and refinements to improve product throughput and assembly techniques.
• Contribute to improving manufacturing efficiency by analyzing workflow, space requirements, and equipment layout.
• Participate in process qualifications and validations, including equipment qualifications and material specifications.
• Assist in ensuring product and process quality by supporting the design of testing methods and confirming manufacturing processes.
• Provide manufacturing decision-making information by assisting in calculations of production, labor, and material costs, and reviewing production schedules.
• Help prepare product and process reports by collecting, analyzing, and summarizing information and trends.
• Assist in keeping equipment operational by coordinating maintenance and repair services, following manufacturer’s instructions and procedures.
• Support Health & Safety initiatives in assigned areas, including accident investigation and corrective actions.
• Research state-of-the-art process technologies and evaluate their potential benefits.
• Participate in Validation Activities as directed.
• Assist in maintaining compliance with ISO 13485, GMP, and FDA regulations.

Education/Experience and Qualifications:

• Bachelor’s degree in Engineering or a similar technical field.
• Up to 2 years of experience in a high-volume production environment; experience in medical device manufacturing, particularly catheter production, is a plus.
• Strong interpersonal skills with the ability to communicate effectively at all levels within the company.
• Basic understanding of DOE and statistical techniques.
• Familiarity with process capabilities and control charting is preferred.
• Exposure to writing protocols for validations and qualifications, including FMEA and IQ/OQ documentation.
• Awareness of GMPs, ISO 9001, ISO 13485, and Medical Device Directives.
• Self-motivated and eager to drive change and innovation. Must be comfortable working in a fast-paced environment with minimal supervision.

Product Integration Engineering team strives to deliver pioneering process capability, best-in-class bits per wafer (Yield) with highest quality and fastest speed through innovation and collaboration with multi-functional team. With the diversity of technology in DRAM/NAND and geography (TD development sites – Boise/Japan, 5 manufacturing sites – US (F6), Taiwan (F11/F16), Japan (F15) and Singapore (F10)), Frontend Central PIE team will be responsible to identify best-known-method holistically, align best-known-method timely and implement improvement systematically across the network. As FE Central PIE Standardization & Metrics Senior Engineer you will be responsible to lead the the team on:

• Drive for alignment and standardization across various fabs on Best-Know-Methods (BKMs)
• Develop Metrics to measure the standardization, sustainability, scalability and synchronization of the BKMs.
• Identify gaps in current programs and use SMART metrics to drive effectiveness and efficiency on program deliverables.
• Transform yield SEAL and SWATs to achieve cPIE missions, improving network resource/talent leverage.
• Constantly drive productivity and eliminate inefficiency / ineffectiveness through metrics and reports automation, drive data to be accurate, accessible and comprehensive.
• Collaborate with various multi-functional teams on yield reports, develop business process to optimize current system with clear roles and responsibility.
• Promotes cPIE teams alignment and collaboration with crtical metrics /metrics definition.
• Collaborate with WFD to standardize network PIE training curriculum, connect with cPIE and network PIE to build training courses.
• Develop human resource strategies to attract, retain and reward talent and effectively deploy them to enhance every individual’s potential
• Engage team members and drive accountability, performance driven culture through clear communication, formal and informal feedback, goals and critical metric
• Drive diversity, equality, and inclusive working environment and foster teamwork and trust in the organization
• Effectively manage team’s internal and worldwide meeting structure. Ensure meetings are efficient, effective and targeted to achieve required outcomes.
• Maintain knowledge of equipment and materials safety concerns. Take a proactive approach to safety, and apply corporate and site safety resources for partner concern issues as appropriate.
• Maintain a strong and open relationship with peer group and managers in other functional areas within CPIE and outside organizations such as Fab, FE PMO/SIC/OCT and Global Quality.
• Travel to Micron sites as necessary for face to face collaboration.

Requirements:

• Bachelor’s Degree in Engineering and related field of study
• 2 years experience in engineering field
• Applicants must have a proven ability to collaborate globally and influence by indirect leadership to drive resourcing to critical projects across Micron
• Applicants must have a proven capability in dealing with complexity and an ability to use resources effectively to bring clarity to required actions
• Applicants must hold a record of performance excellence for current area of responsibility; and are recognized as having demonstrated successful leadership characteristics both in present and past jobs
• Applicants must have demonstrated the ability to solve problems across multi-functional groups, both within and outside their department/Site

Description

As a NAND CMOS Process Integration Engineer in the Singapore Technology Development department at Micron Technology Inc., you will be responsible for developing 3D NAND CMOS devices scaling and enhancing their performance, reliability and manufacturability.

Responsibilities:

• Develop and innovate critical CMOS modules. Drive multi-functional teams to optimize existing process flows and develop new innovative solutions to meet product requirements and manufacturability.
• Develop/re-define critical specifications criteria for optimum product performance and drive activities to get them to manufacturing process capability.
• Extract and analyze inline, probe, parametric, reliability, and other critical metrics and predict future behavior of the CMOS device performance of the product to enable early innovative solutions to meet product and device specifications.
• Early introduction, characterization and validation of new CMOS device models and test structures for developing future NAND products.
• 3 dimensions analysis with the use of K2 view to extract layout information and combine with the doping profiles of each implant step for product development and integration solutions.
• Interact and collaborate with TCAD, modeling, and layout teams to drive clearer definition of CMOS device and reliability improvements across multiple tech-nodes and designs.
• Coordinate activities at manufacturing site towards gating experiment funding, conversions, and effectively communicate decisions made to all R&D, manufacturing, and relevant partners.
• Take on leadership role at quarterly yield summits and monthly program reviews in summarizing complex problems, deriving and explaining actions taken to address them and getting R&D, manufacturing, and senior management teams on the same page.
• Assist in the transfer of a new technology from R&D to manufacturing and contribute towards ensuring successful ramp and qualification. Supporting the transfer, documentation and training of module fundamentals into manufacturing.

Requirements:

• MS or PhD in Electrical Engineering preferably specialized in Microelectronics and Semiconductor Device Physics. Prior technology development and tech transfer/manufacturing experiences are preferred.
• Fresh MS/PhD candidates with knowledge of semiconductor process Integration, device physics and CMOS engineering.
• Direct fab experience with nonvolatile memories manufacturing, knowledge of TCAD, K2 view layout, and NAND product are highly desirable.
• Ability to develop a strong, holistic, end-to-end understanding of CMOS device and its related module on NAND technologies, related structural and electrical fail mechanisms.
• Deep understanding of probe failure mechanism, ability to do electrical bench data collection.
• Self-motivated, self-governing with proven ability to work in a demanding and dynamic environment.
• Experienced in coordinating cross-functional teams to achieve a goal.
• Solid data analysis, communication and reporting abilities with demonstrated presentation abilities.
• Curiosity and natural tendency of learning new things independently.
• Ability to travel for extended periods of time to the US for collaborative R&D work.

Working Location: Fab10, 1 North Coast Drive, Singapore 757432

We are looking for energetic and passionate design engineers to join our Central Engineering Group and be part of an elite team responsible for the development of foundation IP for AI products including memory compilers, logic cells and custom macros of all types on the bleeding edge of process technology. We have multiple positions at all experience levels.

Available Job Responsibilities

• Design and build memory or circuit blocks at the gate or transistor level
• Simulate and analyze the circuit design using transistor level simulators
• Extract the layout and perform post-layout simulations and verification
• Floorplan physical implementation and layout integration of design components
• Integrate characterization flow to extract timing and power information
• Develop scripts to automate characterization flow, simulations, and verification
• Specify and verify various behavioral and physical memory models
• Document the design specifications, behavioral description, and timing diagrams
• Help specify silicon test plan and correlate silicon to simulation data

Preferred Skills

• Good understanding of transistor level circuit behavior and device physics
• Good understanding of signal integrity analysis, EM/IR analysis, and reliability analysis
• Proficiency in running simulators, writing automation scripts, and are tools savvy
• Understanding of memory behavioral and physical models is a plus
• Expertise in memory circuit design is a plus
• Understanding of DFT schemes and chip level integration is a plus
• Good communication, interpersonal, and leadership skills
• Motivated, self-driven and good at multi-tasking
• Passion for solving complex problems and willingness to learn

Qualifications

Requires a BS in Electrical or Computer Engineering and > 5 years of related experience

Job Description

• Diagnose and resolve problems that occur in daily production lines/machines to minimise downtime and quality loss costs.
• Liaise with other departments to develop improvement plans to reduce quality loss costs and other cost savings activities.
• Develop process documentation and operating instructions for new/revised processes and/or products.
• Conduct the planned maintenance work for production machines & equipment to maintain optimum operating conditions.
• Manage Process Change control documents when implementing process and/or location changes on the assigned production process

Requirements

• Diploma or Degree in Mechanical / Mechatronic Engineering
• Min. 2 years experience in electronics connectors manufacturing environment
• Hands-on, enjoy solving problems
• A collaborative teammate
• A strong communicator and an active listener
• Strong analytical skill

Responsibilities:

• Performs all SQS work assignments in accordance with the standard work procedures, practices and specifications
• Review of Vendor Documents for Compliance to project requirements/ spectification and international standards
• Implements and adminsters the Quality Assurance Plan manifested by QA Supervisor for field and participates on a day to day basis in quality assurance activities.
• Review and approval of quality related specification, painting procedures, SAT and FAT procedures, NDT procedures, EIT related documents, pre com and commissioning documents
• Prepares and issue QAQC reports
• Organizes and perform audits and surveillance at a supplier's (or their sub suppliers) facility to verify compliance with qualification requirements
• Performs any other assigned duties and responsibilities

Job Requirements

• Bachelor's Degree in Naval Architecture / Marine and Offshore / Engineering or related engineering disciplines
• API 570. CWSIP 3.1 Certified Welding Inspector
• At least 3 years of relevant Quality Assurance working experience, preferably in the offshore and marine industry
• Good analytical and problem-solving skills
• Able to multi-task and able to work in a fast-paced environment
• Well conversant with codes & standards like ASME, API, ANSI, AWS, IACS, ABS, NR etc

Our Addresses and Working Hours:

(Admiralty Yard)

60 Admiralty Road West, Singapore 759947

(Transport provided from Sembawang MRT)

Mon - Fri: 8am - 5:30pm

Interested candidates are invited to send us an updated resume with your current and expected salary and earliest availability.

We regret that only shortlisted candidates will be notified.

Please note that your personal data disclosed to Seatrium (SG) Pte. Ltd. and our group of companies, shall be used for the purposes of evaluation, and processing in accordance with our recruitment processes and policies. By providing your personal data, you have consented to the aforesaid purpose under the provisions of the Personal Data Protection Act 2012.

Job Description: We are a well-established no-code app development platform, seeking a highly skilled and adaptable Senior AI Integration Specialist to enhance our platform's capabilities through seamless integration of AI technologies. As a key member of our experienced team, you will be responsible for designing and implementing the integration of various AI functionalities to cater to our users' specific needs.

Responsibilities:

• Lead the integration of AI technologies into our no-code app development platform.
• Collaborate closely with the development team to identify integration requirements and implement efficient solutions.
• Customize AI functionalities to align with our platform's objectives and user interaction flows.
• Design and implement robust backend infrastructure to support AI functionalities' seamless performance within our platform.
• Conduct extensive testing to ensure the reliability and accuracy of integrated AI features.
• Continuously monitor and optimize AI performance to enhance the overall user experience.
• Stay updated with the latest advancements in AI technologies and apply relevant innovations to our platform.

Requirements:

• Bachelor's or Master's degree in Computer Science, Engineering, or a related field.
• Proven experience in integrating AI technologies into web-based or mobile platforms.
• Proficiency in programming languages like Python, Java, or JavaScript.
• Familiarity with cloud-based infrastructure and services.
• Strong problem-solving skills and adaptability to meet dynamic project requirements.
• Excellent communication and collaboration skills to work effectively within a team.

Nice-to-Have Skills:

• Experience with integrating language models like ChatGPT or other AI chatbots.
• Knowledge of dialogue systems, natural language generation, and user experience design.

If you are an experienced AI Integration Specialist with a track record of successfully integrating AI technologies into established platforms, we invite you to apply. Join our team and contribute to expanding our no-code app development platform with the power of AI, delivering even more value to our users.

Responsibilities:

• Design cooling and heating systems and follow through the deployment
• Drive thermal designs with numerical approaches, model based analysis
• Conduct experiments to validate designs
• Develop and optimize automation scripts for numerical analysis tools
• Support thermal management for electronics
• Involve in precision and mechatronics design work occasionally

Requirements:

• Min. Degree or higher in Mechanical Engineering / Physics or relevant disciplines
• Good understanding of thermal technologies including computational modeling and calculation
• Min. 1-2 years of working or research experience in thermal system design is preferred
• Knowledge in precision machine design, CFD or thermal modeling tools is a plus

As a Senior Equipment Engineer/Equipment Engineer in the NTI, you will be expected to support R&D activities associated with rapid deployment of First-of-Kind equipment, the CIP hardware evaluations and managing on the timeline needed to deploy in current technode/next advance technode on time. Good team spirit and good collaborations working is needed with various stakeholders including (not limited to) facilities/fab support/Gas & Chemical/EHS/F4/F10/Central team etc with various equipment setup and improvement work necessitated thereof as well as to ensure extended engagement with F4 on the upcoming First-of-Kind equipment in upcoming technode. Expected to work independently with minimal direction and complete projects in a timely manner and achieve set objectives.

Responsibilities
• Install equipment and/or CIP hardware for evaluation by the process development team to enable early introduction, maturity, and adoption for current and next node of 3D NAND technology.
• Work with the Fab layout and facility team to ensure smooth and on time installation and operation of the equipment.
• Work with process development team to quantify benefits of equipment/CIP hardware.
• Develop and optimize existing equipment hardware to meet the productivity requirements of advanced 3D NAND parts.
• Participate with Boise TD equipment development peers on technology choices for the upcoming nodes and able to translate future technology needs into clear equipment requirements.
• Identify disruptive equipment early, work with manufacturing and Boise TD to identify viable evaluation path forward in manufacturing.
• Design and implement advanced equipment monitoring and control methodologies.
• Lead team or sites or suppliers on complex projects in focused meetings with end goal of maturity an equipment technology in record times for technical advantage, cost and productivity.
• Serve as a technical expert within Micron, provide advice and recommendations to senior management on improvements from equipment development. Lead and initiate innovation projects through patents/technical papers.
• Identify and resolve safety hazards; follow safety procedures including lockout, chemical safety, lifting techniques and ergonomically correct methods.

Requirements:
• A minimum of 2-3 years of experience in the semiconductor industry in the area of equipment engineer roles.
• In-depth understanding of the equipment operation, working principles, troubleshooting and tool installation procedure is a must.
• Exposure to R&D equipment transfer and ability to develop/optimize equipment hardware design is preferred.
• Communications and collaboration with partners both locally and globally. Strict adherence to Micron Intellectual Property protection policy is a must.
• Self-motivated and adaptable to Micron’s fast paced, demanding and dynamic work environment; flexibility to work for extended hours, as required.
• Excellent oral and written communication skills with ability to convey the message clearly and sharply both locally and globally.
• Excellent ability to prioritize and manage multiple projects simultaneously; efficiently utilize available resources or seek peers’ and/or management help to get over the roadblocks to drive to solutions.
• Encourage and enforce safe, compliant behavior through periodic communications and the performance management process.

GJS for this position: E2 and above
Location: Fab10N
Closing Date: Until filled

As a NAND CMOS Device Engineer, you will help set the direction for current and future CMOS technology for Micron’s NAND Memory Technology Roadmap!

You will work with the Design Team to set electrical targets and define transistor structures to meet these targets. You will guide the device technology development and be in close relation with Process Integration, Design Engineering, Design, Design Rules, Reliability, Transistor Modeling, TCAD (Technology Computer-Aided Design), and Parametric Test, to name a few! In addition, you will ensure that the developed technology is manufacturable and highly yielding and that these considerations are designed into the technology from the start.

Together with your peers, you craft and implement our NAND-CMOS roadmap and make sure to align to product roadmaps

• You give directions on how to improve our device portfolio, both in performance and cost effectiveness
• You define, execute, and analyze silicon experiments for future device generations
• Interface with Design Engineers to define transistor targets, deliver transistor models, and optimize critical layout constrained Design Rules
• Work with TCAD simulation group to develop strategies for transistor structures to meet targets
• You strive to ensure that transistor models are correctly targeted to anticipate final silicon
• Define electrical test structures for transistors, isolation, design rule verification, and process monitoring
• Highly motivated to ensure transistors are developed meeting the required reliability standards
• You take initiative to collaborate with Manufacturing to ensure transistors are performing as expected and to debug yield/reliability issues
• You foster and enable a collaborative working style and team spirit by mentoring less experienced colleagues

Minimum Qualifications:

• MS/PhD in Electrical Engineering or related field, PhD in Semiconductor Device Technology preferred
• 5 plus years industry experience in the field of CMOS device design, simulation, characterization
• Experience in developing advanced logic transistor technologies
• Experience in developing Analog FETs operating at higher Voltages
• Preferred: Experience in the field of High Voltage applications, reliability, characterization, device development
• Understanding of analog design concepts
• Good presentation skills
• Excellent team and mentoring skills

Develops new or modified process formulations, defines processing or handling equipment requirements and specifications, and reviews processing techniques and methods applied in the manufacture, fabrication, and evaluation of products. Involvement may begin at any step from pilot plant to full-scale manufacturing. Coordinates design requirement review with appropriate engineering/scientific personnel to ensure compatibility of processing methods. Compiles and evaluates test data to determine appropriate limits and variables for process or material specifications. May conceive and plan projects involving definition and selection of new concepts, equipment automation technology, and approaches in the processing or development of new or improved processes.

As a Senior Equipment Engineer/Equipment Engineer in the NTI, you will be expected to support R&D activities associated with rapid deployment of First-of-Kind equipment, the CIP hardware evaluations and managing on the timeline needed to deploy in current technode/next advance technode on time. Good team spirit and good collaborations working is needed with various stakeholders including (not limited to) facilities/fab support/Gas & Chemical/EHS/F4/F10/Central team etc with various equipment setup and improvement work necessitated thereof as well as to ensure extended engagement with F4 on the upcoming First-of-Kind equipment in upcoming technode. Expected to work independently with minimal direction and complete projects in a timely manner and achieve set objectives.

Responsibilities
• Install equipment and/or CIP hardware for evaluation by the process development team to enable early introduction, maturity, and adoption for current and next node of 3D NAND technology.
• Work with the Fab layout and facility team to ensure smooth and on time installation and operation of the equipment.
• Work with process development team to quantify benefits of equipment/CIP hardware.
• Develop and optimize existing equipment hardware to meet the productivity requirements of advanced 3D NAND parts.
• Participate with Boise TD equipment development peers on technology choices for the upcoming nodes and able to translate future technology needs into clear equipment requirements.
• Identify disruptive equipment early, work with manufacturing and Boise TD to identify viable evaluation path forward in manufacturing.
• Design and implement advanced equipment monitoring and control methodologies.
• Lead team or sites or suppliers on complex projects in focused meetings with end goal of maturity an equipment technology in record times for technical advantage, cost and productivity.
• Serve as a technical expert within Micron, provide advice and recommendations to senior management on improvements from equipment development. Lead and initiate innovation projects through patents/technical papers.
• Identify and resolve safety hazards; follow safety procedures including lockout, chemical safety, lifting techniques and ergonomically correct methods.

Requirements:
• A minimum of 2-3 years of experience in the semiconductor industry in the area of equipment engineer roles.
• In-depth understanding of the equipment operation, working principles, troubleshooting and tool installation procedure is a must.
• Exposure to R&D equipment transfer and ability to develop/optimize equipment hardware design is preferred.
• Communications and collaboration with partners both locally and globally. Strict adherence to Micron Intellectual Property protection policy is a must.
• Self-motivated and adaptable to Micron’s fast paced, demanding and dynamic work environment; flexibility to work for extended hours, as required.
• Excellent oral and written communication skills with ability to convey the message clearly and sharply both locally and globally.
• Excellent ability to prioritize and manage multiple projects simultaneously; efficiently utilize available resources or seek peers’ and/or management help to get over the roadblocks to drive to solutions.
• Encourage and enforce safe, compliant behavior through periodic communications and the performance management process.

GJS for this position: E2 and above

Location: Fab10N

Closing Date: Until filled

As a NAND CMOS Device Engineer, you will help set the direction for current and future CMOS technology for Micron’s NAND Memory Technology Roadmap!

You will work with the Design Team to set electrical targets and define transistor structures to meet these targets. You will guide the device technology development and be in close relation with Process Integration, Design Engineering, Design, Design Rules, Reliability, Transistor Modeling, TCAD (Technology Computer-Aided Design), and Parametric Test, to name a few! In addition, you will ensure that the developed technology is manufacturable and highly yielding and that these considerations are designed into the technology from the start.

Together with your peers, you craft and implement our NAND-CMOS roadmap and make sure to align to product roadmaps

• You give directions on how to improve our device portfolio, both in performance and cost effectiveness
• You define, execute, and analyze silicon experiments for future device generations
• Interface with Design Engineers to define transistor targets, deliver transistor models, and optimize critical layout constrained Design Rules
• Work with TCAD simulation group to develop strategies for transistor structures to meet targets
• You strive to ensure that transistor models are correctly targeted to anticipate final silicon
• Define electrical test structures for transistors, isolation, design rule verification, and process monitoring
• Highly motivated to ensure transistors are developed meeting the required reliability standards
• You take initiative to collaborate with Manufacturing to ensure transistors are performing as expected and to debug yield/reliability issues
• You foster and enable a collaborative working style and team spirit by mentoring less experienced colleagues

Minimum Qualifications:

• MS/PhD in Electrical Engineering or related field, PhD in Semiconductor Device Technology preferred
• 5 plus years industry experience in the field of CMOS device design, simulation, characterization
• Experience in developing advanced logic transistor technologies
• Experience in developing Analog FETs operating at higher Voltages
• Preferred: Experience in the field of High Voltage applications, reliability, characterization, device development
• Understanding of analog design concepts
• Good presentation skills
• Excellent team and mentoring skills

Develops new or modified process formulations, defines processing or handling equipment requirements and specifications, and reviews processing techniques and methods applied in the manufacture, fabrication, and evaluation of products. Involvement may begin at any step from pilot plant to full-scale manufacturing. Coordinates design requirement review with appropriate engineering/scientific personnel to ensure compatibility of processing methods. Compiles and evaluates test data to determine appropriate limits and variables for process or material specifications. May conceive and plan projects involving definition and selection of new concepts, equipment automation technology, and approaches in the processing or development of new or improved processes.

As a Senior Equipment Engineer/Equipment Engineer in the NTI, you will be expected to support R&D activities associated with rapid deployment of First-of-Kind equipment, the CIP hardware evaluations and managing on the timeline needed to deploy in current technode/next advance technode on time. Good team spirit and good collaborations working is needed with various stakeholders including (not limited to) facilities/fab support/Gas & Chemical/EHS/F4/F10/Central team etc with various equipment setup and improvement work necessitated thereof as well as to ensure extended engagement with F4 on the upcoming First-of-Kind equipment in upcoming technode. Expected to work independently with minimal direction and complete projects in a timely manner and achieve set objectives.

Responsibilities
• Install equipment and/or CIP hardware for evaluation by the process development team to enable early introduction, maturity, and adoption for current and next node of 3D NAND technology.
• Work with the Fab layout and facility team to ensure smooth and on time installation and operation of the equipment.
• Work with process development team to quantify benefits of equipment/CIP hardware.
• Develop and optimize existing equipment hardware to meet the productivity requirements of advanced 3D NAND parts.
• Participate with Boise TD equipment development peers on technology choices for the upcoming nodes and able to translate future technology needs into clear equipment requirements.
• Identify disruptive equipment early, work with manufacturing and Boise TD to identify viable evaluation path forward in manufacturing.
• Design and implement advanced equipment monitoring and control methodologies.
• Lead team or sites or suppliers on complex projects in focused meetings with end goal of maturity an equipment technology in record times for technical advantage, cost and productivity.
• Serve as a technical expert within Micron, provide advice and recommendations to senior management on improvements from equipment development. Lead and initiate innovation projects through patents/technical papers.
• Identify and resolve safety hazards; follow safety procedures including lockout, chemical safety, lifting techniques and ergonomically correct methods.

Requirements:
• A minimum of 2-3 years of experience in the semiconductor industry in the area of equipment engineer roles.
• In-depth understanding of the equipment operation, working principles, troubleshooting and tool installation procedure is a must.
• Exposure to R&D equipment transfer and ability to develop/optimize equipment hardware design is preferred.
• Communications and collaboration with partners both locally and globally. Strict adherence to Micron Intellectual Property protection policy is a must.
• Self-motivated and adaptable to Micron’s fast paced, demanding and dynamic work environment; flexibility to work for extended hours, as required.
• Excellent oral and written communication skills with ability to convey the message clearly and sharply both locally and globally.
• Excellent ability to prioritize and manage multiple projects simultaneously; efficiently utilize available resources or seek peers’ and/or management help to get over the roadblocks to drive to solutions.
• Encourage and enforce safe, compliant behavior through periodic communications and the performance management process.

GJS for this position: E2 and above
Location: Fab10N
Closing Date: Until filled

JOB DESCRIPTION:

Department: MLCC production

Reports to: Manager

Functional relationships:

- MLCC process engineering in Japan factories

- MLCC related R&D in Japan

- MLCC process engineering in oversea affiliates: China and Philippines

POSITION PROFILE:
The Product Planning Engineer will drive improvements in the MLCC manufacturing process (post-process) and product quality, efficiency, and manufacturing costs through specialized knowledge of processes and products. This role includes providing technical training to local engineers focused on the post-processing aspects of MLCC manufacturing.

Key Duties & Responsibilities:

• Policy and Strategy Alignment: Collaborate with Japan HQ or other affiliate companies to align policies and strategies for project initiatives.
• Problem Solving Meetings:Initiate periodic meetings with Japan HQ or other affiliates to address issues within the division effectively.
• Quality Improvement:Enhance the quality of MLCC products by focusing on post-process improvements.
• Cost Reduction Initiatives: Propel efforts to reduce costs associated with MLCC products while maintaining quality standards.
• Efficiency Enhancements:Improve the efficiency of MLCC manufacturing post-process operations.
• Technology Transfer:Facilitate the transfer of new technologies from Japanese factories to Singapore factory.
• Bridge Between Teams: Serve as a liaison between Japanese factories and related R&D departments, ensuring timely access to necessary information for effective implementation into MES factory.
• Technology Grasping & Proposals: Stay abreast of new technologies; propose improvements in quality, cost, efficiency, and safety based on this knowledge.
• Technical Training Organization:Organize and deliver technical training sessions for local engineers focusing on best practices in post-process.

Ability/Competency required:

• Master degree in engineering field
• At least 2 years working experience in electronics manufacturing industry
• Deep & specialized technical knowledge in plating process and to be able to fully utilize it in actual job for improvement
• Fluent in Japanese and English language to liaise with Japan factories & R&D departments
• Logical thinking, analytical skill and good engineering sense
• Strong mind-set for change and improvement
• Proactive attitude and strong communication and interpersonal skills
• Networking ability with MLCC related functions

Job Responsibilities:

Identify, select, and evaluate new equipment/ new technology to support current and future requirements

• Define, development and establish new equipment design/ capability requirements aligned to Process and Packaging Roadmap
• Develop and engage creative solution for new equipment capabilities/ solution to identified constraints or future technology requirements
• Work with equipment suppliers to develop new capability
• Engage in active participation in Package Development Engineering activities
• Conducts equipment benchmarking to establish the equipment suppliers and platforms for future need
• Create decision matrix for equipment and material selection

Evaluate and qualify new equipment platform and handover to production group

• Plan/submit capital request to acquire new Equipment
• Create and owner of purchasing specification (Doc2) document
• Establish the new equipment qualification criteria and activities roadmap with respective functional teams
• Establish project handover requirements and procedures upon machine qualification
• Prepare documentation for handing over with respective site owner
• Conduct data gathering for low volume production
• Conduct training for Site representatives
• Feedback loop for Continuous Improvement after mass volume production via collaborate with production and HVM team on existing production equipment enhancement through continuous improvement projects

Maintain a matrix of key equipment platform capability and constraints (Equipment Maturity Index, EMI & Tool of Records, TOR) on current and new equipment platform

• Driving EMI, a system to standardize equipment maturity expectations, metrics to communicate tool manufacturing readiness, analyze the requirements to advance tool maturity level
• Maintain and regularly update the TOR, with inputs from local or other assembly site
• Maintain general knowledge of process and material characteristics and translate to equipment design requirement
• Search continually for new equipment or suppliers with improved or new capability that is aligned to Process/Packaging need

Equipment System Readiness, Enablement & Enhancement

• Conduct equipment characterization, identify and enable the critical equipment parameter monitoring system
• Working with PCS, IT & Automation team to enable tool control system such as FDC (fault detection & classification), E3 (enterprise equipment engineering), APC (advanced process control), tool alarm system, IOT, ECM (equipment constant management), R2R (run to run) and other equipment control system whichever applicable
• Equipment automation solution enablement for both system datamation (tool- micron host communication) and factory AMHS readiness and deployment from equipment perspective follow by working with IT & automation team to delivery full automation solution for production running support

Supplier Management & Engagement Program

• Working on several engagement forum from ERM (executive review meeting), TRM (technical review meeting), QBR (quarterly business review) to CIP review to strategize and ensure supplier understand and focus on identified priorities by business value ensuring focus on the greatest benefit
• Manage all the key and critical engagement activities between Micron and supplier to prioritize and enable quality and tool performance improvement
• Collaborate with supplier on technology and path finding focus, engineering improvement, manufacturing efficiency focus which focus on roadmap development/ solution and H2H partnership with competitive landscape strategies

Job Requirements/ Qualifications:

• PhD/Masters/Bachelor’s Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience Required
• Basic knowledge in semiconductor manufacturing assembly, wafer bumping packaging technologies & advanced packaging techniques
• Minimum 3 years’ experience in related semiconductor industry or related manufacturing environment
• Experience with technical knowledge on assembly and/or wafer bumping and/ or advanced packaging technology
• Understanding and/or experience in equipment automation solution e.g. GEM300, AMHS and IIOT solution for datamation such as APC, FDC, E3, PCS, SPC) is a plus
• Fast learner, with initiative and independence (min supervision), good team player, ability to integrate and cooperate with cross function teams and external vendors
• Strong communication (verbal & written) and presentation skills (English speaking is must)
• Understanding of business needs and customers’ requirement, able to participate in cross functional team environment
• Strong project management skills to ensure execution to timelines

Job Responsibilities:

Identify, select, and evaluate new equipment/ new technology to support current and future requirements

• Define, development and establish new equipment design/ capability requirements aligned to Process and Packaging Roadmap
• Develop and engage creative solution for new equipment capabilities/ solution to identified constraints or future technology requirements
• Work with equipment suppliers to develop new capability
• Engage in active participation in Package Development Engineering activities
• Conducts equipment benchmarking to establish the equipment suppliers and platforms for future need
• Create decision matrix for equipment and material selection

Evaluate and qualify new equipment platform and handover to production group

• Plan/submit capital request to acquire new Equipment
• Create and owner of purchasing specification (Doc2) document
• Establish the new equipment qualification criteria and activities roadmap with respective functional teams
• Establish project handover requirements and procedures upon machine qualification
• Prepare documentation for handing over with respective site owner
• Conduct data gathering for low volume production
• Conduct training for Site representatives
• Feedback loop for Continuous Improvement after mass volume production via collaborate with production and HVM team on existing production equipment enhancement through continuous improvement projects

Maintain a matrix of key equipment platform capability and constraints (Equipment Maturity Index, EMI & Tool of Records, TOR) on current and new equipment platform

• Driving EMI, a system to standardize equipment maturity expectations, metrics to communicate tool manufacturing readiness, analyze the requirements to advance tool maturity level
• Maintain and regularly update the TOR, with inputs from local or other assembly site
• Maintain general knowledge of process and material characteristics and translate to equipment design requirement
• Search continually for new equipment or suppliers with improved or new capability that is aligned to Process/Packaging need

Equipment System Readiness, Enablement & Enhancement

• Conduct equipment characterization, identify and enable the critical equipment parameter monitoring system
• Working with PCS, IT & Automation team to enable tool control system such as FDC (fault detection & classification), E3 (enterprise equipment engineering), APC (advanced process control), tool alarm system, IOT, ECM (equipment constant management), R2R (run to run) and other equipment control system whichever applicable
• Equipment automation solution enablement for both system datamation (tool- micron host communication) and factory AMHS readiness and deployment from equipment perspective follow by working with IT & automation team to delivery full automation solution for production running support

Supplier Management & Engagement Program

• Working on several engagement forum from ERM (executive review meeting), TRM (technical review meeting), QBR (quarterly business review) to CIP review to strategize and ensure supplier understand and focus on identified priorities by business value ensuring focus on the greatest benefit
• Manage all the key and critical engagement activities between Micron and supplier to prioritize and enable quality and tool performance improvement
• Collaborate with supplier on technology and path finding focus, engineering improvement, manufacturing efficiency focus which focus on roadmap development/ solution and H2H partnership with competitive landscape strategies

Job Requirements/ Qualifications:

• PhD/Masters/Bachelor’s Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience Required
• Basic knowledge in semiconductor manufacturing assembly, wafer bumping packaging technologies & advanced packaging techniques
• Minimum 3 years’ experience in related semiconductor industry or related manufacturing environment
• Experience with technical knowledge on assembly and/or wafer bumping and/ or advanced packaging technology
• Understanding and/or experience in equipment automation solution e.g. GEM300, AMHS and IIOT solution for datamation such as APC, FDC, E3, PCS, SPC) is a plus
• Fast learner, with initiative and independence (min supervision), good team player, ability to integrate and cooperate with cross function teams and external vendors
• Strong communication (verbal & written) and presentation skills (English speaking is must)
• Understanding of business needs and customers’ requirement, able to participate in cross functional team environment
• Strong project management skills to ensure execution to timelines

Micron Technology’s vision is to transform how the world uses information to enrich life and our commitment to people, innovation, tenacity, collaboration, and customer focus allows us to fulfill our mission to be a global leader in memory and storage solutions. This means conducting business with integrity, accountability, and professionalism while supporting our global community.  Micron’s teams of dreamers, visionaries, and scientists have redefined innovation—designing and building some of the world’s most advanced memory and semiconductor technologies.  Information Security Protection processes from within all business units with connectivity to corporate information security strategy is fundamental to protect Micron’s mission.

As the Frontend Manufacturing IP Security Manager/Principal Engineer, you will be responsible to help transform how the corporate Cyber and Information security strategies connect and integrate into all Micron technology and business teams.  You will work directly with local business unit information security teams to advocate and coordinate global security initiatives within the business areas, bring in real world security threat and awareness training campaigns, as well as leader or general population security awareness campaigns.  A primary attribute of the role is to be the conduit for feedback between Global Security and Micron’s business area teams.  Equally important is working with Frontend Manufacturing teams to internally assess and establish best practices within the business communities while bringing insights from local successes to a broader Micron community.  With business and information knowledge, you will be a partner with Global Security and business leadership to create and enable Micron’s overall security strategy.  In this, you will gain a broad perspective by working on a variety of information sources, control solutions, and dynamic business conditions across a global organization to analyze issues, make well-reasoned recommendations and solve problems to protect and enhance organizational value.

Responsibilities:
• Collaborate and conduit two-way interaction with Global Security Team and business areas supporting roadmaps, strategies, and requirements from both perspectives. Bridge security goals and commitments with articulated business needs driving towards a common set of goals and objectives

• Define clear goals and strategic initiatives to create, advocate, and present across-the-business security campaigns, awareness, and cultural messaging.  Assessments of security influence across Micron

• Understand and lead efforts to meet the requirements of internal and external customers. with Global Security Team, BISO and Data Protection Community to develop associated processes and automation requirements to enable.

• Coordinate with experts on various topics to present and provide education around their areas of expertise.  Create opportunities to increase security knowledge within the Data Security Community

• Coordinate leading and lagging metrics and to security problems, solutions, and business processes.  Partner to enable a business facing dashboard support security strategies and needed efforts

• Provide coordination for the Data Protection Community and BISOs to drive best practices and creative solutions to data security problems.  Drive to enable common guidance and goals (records and access management, unstructured data solutions, vendor and contractor access/data models)

• Partner with BISO representatives to drive best-known-methods within organizations supporting security culture and collaborate opportunity to expand

• Handle escalations and exception approvals for all Global Operations

Requirements :
• Ability to understand and effectively communicate vision and technical concepts in appropriate terminology at all levels of the organization

• Ability to balance security with end user productivity and operational impacts in a large organization to provide transparent, secure solutions

• Strong Agile development knowledge, build in increments and iterate

• Excellent organizational skills and the ability to see solutions to their conclusion

• Ability to be self-directed and a fast learner and ability to gain understanding of new solutions

• A sense of urgency, prioritization, and growth mindset

• Demonstrated ability to promote security practices and drive improvements into organization’s overall security framework

• Advantages with CISSP/CISM/CISA/ISO27001/PMP certification

Education & Experience:

• Bachelors/Masters degree in Engineering or Business Field, Computer Science, or Cyber security related field

• Equivalent experience in industry on Intellectual Property or Cyber Security

• Understanding of information technology general controls, process and structure

• Proven communication skills with multi-functional leaders

• Strong skills in decision-making, prioritization and problem solving

• Strong skills in Project management and organization change management

Identifies, analyzes, monitors and minimizes areas of risk that pertain to information technology. Coordinates closely with the disaster recovery and data security disciplines; all three disciplines (risk management, disaster recovery and data security) may be part of the same department.

As an Project Engineer, you will be responsible to execute project as planned cost and manage the order risk to satisfy customer and keep our promise.

Your Tasks as a Project Engineer will include the following:

• Review Project specification and requirement and highlighting the deviations between Sales technical offer and Project requirement to Contracts Manager/Engineer.

• Produce project design to meet project specification and technical offer, ensuring accurate information to meet project delivery.

• Liaise with internal/external customers and suppliers on technical matters

• Support Sales and Production on technical details.

• Responsible to arrange the factory acceptance test and Site acceptance test from customers

• Implement cost effective design and project management methods.

• Responsible for project dossier (document and drawing) preparation and submission.

Ideally you should have a degree or above, Electrical Engineering background preferred and other engineering degree may apply. Fresh graduates are welcome to apply.

You must have strong sense of responsibility, teamwork and customer oriented. You must be able to speak, read and write English.

Salary : $3,000 - $4,500

Job Description:

1. Lead a group of technicians to maintain all the facilities, building, and services systems (BMS, Electrical etc)
2. Perform Preventive maintenance and corrective maintenance program according to procedure for all electrical & BMS systems
3. Conduct troubleshooting and determine root cause for rectification works of all electrical & BMS systems
4. Liaising and check with contractors on all electrical & BMS preventive and corrective works
5. Comply with all Plant environment and safety guidelines
6. Ensure sufficient critical spares inventory for all electrical & BMS system
7. Ensure complete documentation of procedures and maintenance works
8. Standby duties as and when required for A&A or rectification works
9. Any other ad hoc works assign by HOD

Job Requirements:

1. At least 3 years of relevant experience in electrical engineering
2. Strong technical knowledge of electrical systems, project managament skills, problem-solving abilities and excellent communications skills

Only shortlisted candidates will be notified by the HR department.