Your main responsibilities include:

• Develop and maintain product datasheet testing and characterization test programs for NAND and NOR components
• Working with product reliability engineers to define test flows for individual products
• Provide support to operation team to ensure seamless execution for generated test flow on the tester with live product
• Perform electrical failure analysis for failure validation and characterization

You are encouraged to apply if you can demonstrate some of the qualities listed below:

• Master's or Bachelor's degree in Engineering field. Microelectronic/Electrical/Computer Engineering fields are preferred.
• Positive attitude and self-motivation towards learning and development.
• Good analytical mindset and structured personality.
• Good written and verbal communication skills.
• Hands on experience with C++/Python and Object-Oriented Programming is a plus
• Understanding Automated Test Equipment and flash memory is a plus.
• Fresh graduates are welcome to apply.

Working location:

• 990 Bendemeer Road, Singapore 339942

As a Non-Volatile Memory Quality & Reliability Assurance (NVMQRA) Engineer at Micron Technology, you will be responsible for performing formal Failure Analysis of customer reported failing devices via the Returned Material Authorization (RMA) process. You will be required to summarize lab analysis results at the electrical and physical level to identify root cause and establish an associated containment plan. In this role, you will have the opportunities to collaborate with various engineering and manufacturing stakeholders to evaluate and review Corrective Actions /Preventive Actions. You will provide documentation of the RMA findings and oversee the final customer report till closure. In addition, for the senior role, you will be asked to provide guidance and lead the team when solving complex unplanned deviations reported by our customers. Project management skills are necessary and the ability to make critical decisions that directly translate to quality and timely completion of the project is highly desirable. You will also be required to spearhead the sustaining efforts and keeping up to date on new product knowledge, as well as developing and mentoring new talents.

Responsibilities and Tasks

Perform Failure Analysis of Customer Returns

• Understand customer complaint of the memory component failure
• Initiate communication with Micron Customer-facing team for further details on customer complaint, requesting additional questions to provide best opportunity for successful analysis
• Perform bench level analysis including initial data image analyis/examination
• Perform Automated Test Equipment (ATE) analysis and interpret results
• Work with the appropriate engineering teams (e.g., PE, PYE) to perform detailed fault isolation when electrical failure has been confirmed
• Summarize findings and submit for physical failure analysis (PFA).

Provide FA Reports for Micron Customer Facing Team for Communication to External Customers

• Summarize analysis at electrical and physical level into customer friendly formats.
• Work with the appropriate manufacturing Global Quality teams through the appropriate request systems (example: GPSS) for Root Cause and/or Corrective Action and a containment plan
• Identify potential risk to external customers
• Communicate with respective BU (Business Unit) on potential impact to customers
• Communicate FA updates through interim reports or during scheduled meetings with the customers.
• Provide formal FA Report with findings

Sustain Knowledge of Device Capabilities and Characteristics

• Keep up to date with latest Fab/ASM process technology
• Understand datasheet specifications for each device and the differences from previous technode for NOR * NAND product family
• Comprehension of qualification data and potential impact to customer operation
• Stay up-to-date on common customer applications and usage model
• Partnering with customer support team to resolve ongoing customer issues

Qualifications and Experience

• Excellent verbal and written communication skills in English. The ability to communicate clearly and concisely both verbally and in writing is critical in this role.
• Good organization skills and ability to multitask and coordinate between multiple issue at any given time.
• Ability to work effectively in cross-functional teams and handle pressure situations in a professional manner
• Excellent problem-solving and analytical skills with strong attention to details.
• Familiarity with NexTest /Teradyne bench analytical tools, scripting in linux console will be an added advantage.

Candidates with 2-3 years of experience in the semiconductor industry as Product or QA engineer are preferred. Relevant experienced candidates will be considered for the Senior Role.

Education

A Bachelor or Masters Degree in Electrical Engineering or similar field of study.

Job Description

• Reporting to Global Category Microcontroller & Memories (MCM), strive to secure “Best in Class” consistent and sustainable supplier quality performance to reach the Continental Business and Quality targets.
• Maintenance of the defined Supplier Quality Management System (procedures, guidelines, and tools) to ensure the requested quality is in line with the defined supplier management strategies to meet the quality targets.
• Execution of supplier evaluations and assessments to support the cross-functional supplier selection team with the required quality data.
• Driving supplier development & improvement activities at supplier's site.
• Initiation and introduction of the preferred supplier and components strategy.
• Design, initiation, and control of preventive quality management measurements in the design and development phase for supplied parts and services to ensure that our products meet the quality requirements defined.
• Component introduction through robust APQP process which include Component sourcing, writing of specifications, handling of qualifications and risk management.
• Manage change requests (PCN) from component suppliers and assure comprehensive qualification of any change.
• Support of the data system to collect and evaluate supplier quality related key performance indicators (KPIs) for the regular reporting of quality performance.
• Support for the continuous improvement process of all supplier quality-related processes, guidelines, and tools by means of supplier audits, on-site assessments, and benchmarking and best practice sharing programs.

Qualifications

• Degree in Electronics/Electrical Engineering (or related) with minimum 5 years’ experience, preferably in the automotive industry
• Candidates with experience in semiconductor processes (e.g., wafer process technologies, back-end assembly, and testing), knowledge in electronic component & qualification requirements (e.g., AEC-Q, JEDEC, IP qualification) preferred. Candidate with more work experiences may be considered for Principal role.
• Strong experience in quality systems, process audits and part qualification.
• Understanding of automotive practices such as APQP/PPAP/VDA6.3/IATF16949.
• Able to lead suppliers' development and audit activities within Asia.
• Able to work independently and travel frequently (e.g. SE-Asia, China, Japan & S. Korea).
• Strong interpersonal and communication skills e.g. in collaborations, problem solving process, conveying technical details and presentation.

Responsibilities

Excellent execution on assembly process for 1st NPI success and smooth transfer process from NPI to HVM

• Excellent execution of the qualification of NPI products / packages build that proliferate from the pilot products and packages according to planned timeline
• Full responsible on support NPI business process with process TRA, POS, PFMEA/QCP, risk mitigation and documentations.
• Deliver BIC yield and cost on product NPI with integration of DFx BIC package solution, process guideline and design rules.
• Collaboration with multi-functional team from NPI to LVM/HVM process transfer. On-time execution of NPI Customer samples and Engineering Samples build for new products and packages

SME Process Owner Responsible for Continuous Improvement on Process Yield, Defect Elimination and Process Characterization

• Process owner to perform on-time detection with data analysis for process yield improvement. Lead the defect elimination and continue improvement action, with problem solving methodology, statistical analysis and integration solution decision.
• Process owner to develop process recipe for BIC UPH, conducting process characterization to define process parameters and boundary.
• Continuous develop in depth assembly process technical knowledge, well understand process capability/tolerance//spec limit/CpK, and apply key tools PFMEA/QCP/APC/FDC/Alarm on assembly processes Cz/Development/NPI.
• Global leader for cross team collaboration on network BKM, process recipe spec and recipe standardization/conversion.

Technology enablement and development – Process, Material, Equipment

• Participate and support Product Roadmap, to enable key process capability and technology development to ensure packaging solution is ready prior 1st Qual Silicon deliver.
• Frequent engagement with equipment and material supplier (at least interval of monthly or daily/weekly for process issues)
• Collaboration with Supplier and involvement Supplier Roadmap (Material/Equipment/OSAT), to understand market trends and competitor’s direction, ensure key process technology and capability enablement is in-line.
• Frequent review and participant Competitor Analysis, to understand market trends and competitor’s technology/capability boundary
• Engage and follow PDE business process (TGR, TORB, KEG interlock) for new technology qualification, alignment and safe launch

Teamwork and General expectation

• Trainer/Buddy/Mentor for new team members, build effective relationships within team and cross team (peers, counterpart)
• Regularly review data and direction with supervisor. Demonstrate sound data analysis and judgment. Present reports and findings with appropriate conclusions, recommendations and decision making.
• Develop, or coordinate development of, training materials for existing/new process
• Safety Identify and promptly report hazards, follow safety procedures and area work rules including proper PPE, lockout and chemical safety.

Qualification

• Bachelor or Masters in Electrical Engineering, Materials Science, Chemical Engineering, or related field. A PhD is a plus.
• 1-3 or more years of experience in Semiconductor Manufacturing, Process & Equipment Engineering and/or New Product Introduction.
• Demonstrated track record in baseline performance improvement, business process creation, process simulation techniques, data interpretation skills and proficiency in statistical analysis/method.
• Be able to comfortably work across organizational boundaries and geographies.
• Ability to effectively collaborate with multi-functional organizations to understand needs and translate them into actionable plans, deliverables, and resource requirements.
• Organized, meticulous, and strong focus on results.
• Excellent analytical skills
• Excellent communication and written skills

Responsibilities:

• To lead and drive the requirements gathering process.
• To lead and manage a small team of developers to deliver the modules to develop web-based application systems.
• Participate in the design and development of web applications based on Ecquaria’s product (J2EE-based).
• Lead and manage the user acceptance testing process.
• Implement, customize, test, document and maintain software applications.
• Ensure that the modules delivered are according to the specifications and are of high quality.

Requirements:

• A Degree/Diploma in Computer Science with at least 3 years' software development experience in Internet technology in Win NT, UNIX or LINUX platform
• Those with leadership experience may be considered for the Project Lead position.
• Technical skills include proven object-oriented programming experience with Java and C++ together with extensive RDBMS through JDBC
• Experience in J2EE, Web Services and XML will be advantageous
• Experience in Elixir reporting solutions will be advantageous
• Very strong in SQL
• Data analysis skill will be an added advantage, although this is not compulsory to have.
• Good interpersonal skills

Toppan Ecquaria is an equal opportunity employer and values diversity within our company. We welcome all interested candidates to apply for this position, however, we regret to inform that only shortlisted candidates will be contacted by us for an interview.

Find us at www.topppanecquaria.com or www.linkedin.com/company/toppan-ecquaria

For more career opportunities, please visit our career site at:- https://toppanecquaria.com/careers/job-openings?utm_source=Jobstreet&utm_medium=Page&utm_campaign=2020

(Please copy & paste the above link onto your browser)

Job Description

• Understanding of Project Specifications, construction drawings and to ensure that all site activities comply with the regulations and client’s requirements
• Monitor site works to ensure the method statements and work procedure are strictly followed.
• Competent in carrying out supervision of structural works by identifying any non-conformity of contractor’s work site
• Ensure the Builder (incl. technical supervisors) executes the work in accordance to Consultant’s instructions
• Check drawings for discrepancies and highlight to Consultant, suggesting possible solutions to prevent delays
• Conduct quality inspections and quality control of materials used for the project
• To ensure proper documentation of site inspection records, safety records and approved /as-built drawings
• Maintaining and updating site records on progress of work, housekeeping and preparing reports
• Verify the contractors’ progress payment, claim in terms of work done and materials/equipment delivered and stored on site
• Witness all the inspection, testing and commissioning sessions performed by the contractors to ensure compliance with designs and specifications
• Report to project QP / Project Consultants Team on quality and progress
• Supervision of demolition of basement/foundation, ERSS construction and all other design works
• To manage & coordinate with the site supervisors (incl. RTO) with respect to C&S engineering works, architectural and M&E engineering works
• Possesses a complete understanding of local requirements, especially to comply with BCA's criteria for build-ability and safety assurance system
• To carry out regular site checks on Builder and ensure compliance on health and work safety in accordance with MOM
• To attend site, progress, variation and coordination meetings.
• Period: 12 months
• Start from: January 2025

Requirements:

• min. Degree in Civil / Structural Engineering or equivalent
• At least 8 years of relevant experience in supervision of Hospital and Architecture work
• Resident Engineer Certificate accredited by IES / ACES is a must, candidate without RE certificate need not apply
• Conversant in statutory code and requirements
• Good team player with strong interpersonal and communications skills essential

Please indicate project involved, expected salary and notice period required in CV.

We regret that only short-listed candidates will be notified.

For more posting, please refer to https://www.facebook.com/profile.php?id=61566487478500&mibextid=LQQJ4d

Key Responsibilities:

• Team Leadership: Manage and mentor a development team of 5 – 10 members.
• Project Management: Provide accurate estimates and oversee project deliverables .
• Frontend Development: Lead front-end development using Node.js, JQuery, Bootstrap, and related tools
• Technical Expertise: Utilize Java, Python, Groovy & Grails, Spring MVC, Hibernate, and other frameworks for full-stack development.
• Banking Experience: Develop secure and compliant banking-related applications.
• Quality Assurance: Conduct code reviews and maintain coding standards.
• Consulting: Propose technical solutions to client challenges and improve system efficiency.
• Product Demonstrations: Present project outcomes to clients and stakeholders.

Qualifications and Skills:

• Experience: 10+ years in software development projects, with a strong focus on banking solutions.
• Leadership: Proven ability to lead development teams of 5 - 10 members.
• Banking Expertise: Hands-on experience with banking systems, processes, and compliance.
• Technical Skills: Proficient in Java,Python, Groovy & Grails, Spring MVC, Hibernate, and frameworks like Node.js
• Frontend Development: Expertise in JQuery,Bootstrap, BackboneJS, and related tools.
• Database: Experience with Oracle,PostgreSQL
• Communication: Strong ability to manage client expectations and liaise effectively.

Advance Packaging Integration – Senior Engineer (Package Development Engineering, Silicon Technology Package Integration) (PDE STPI)

We are looking for a Package Silicon Integrator in Package Development Engineering (PDE) Senior Engineer who will lead and drive Micron’s Packaging Technology Development Projects meeting Time to Market (TTM) business unit needs as well as meeting performance targets for Thermal, Electrical, Mechanical, Reliability and Cost. You will collaborate with Micron’s multi-functional team that include Product Development, Wafer level process, Assembly, Test, Manufacturing and Global Quality. Together, we will be responsible for the designing Test Vehicle Development Strategy, and execution to definition, development, and delivery of state-of-the-art product/packages that will shape the future of advanced computing, automotive and mobile products.

Responsibilities will include, but are not limited to:

• Drive package technology integration activities for the silicon test chip development projects and support NPIs to keep roadmap items on track to meet “go to market” timelines.
• Coordinate core team in Development and NPI space of advanced 2.5D/3D packages and standard packaging to drive material and BOM choices, body sizes, manufacturability, and package constructions to achieve acceptable Design for Manufacturing (DFM) and Design for Reliability (DFR) requirements.
• Evaluate wafer design inclusive of bondpad, scribe, pillars/bump and polyimide, and drive materials and BOM choices such as die thickness and mold compound to meet chip package interaction requirements.
• Drive materials characterization from both package and die components to understand chip package interaction mechanism using TMA, DMA, nanoindentation, and packaging mechanical and thermal stress stimulus.
• Drive novel solutions with silicon design and product teams to recommend the optimum package solutions to meet electrical, mechanical (1st, 2nd, and 3rd level interconnect), thermal, reliability, cost, and other system level requirements.
• Interface closely with multi-functional team that include Product Development, Wafer Level Process, Assembly, Test, Manufacturing and Global Quality and manage the product/package to mass production.

Requirements:

• Bachelor/Masters of Science in physics, materials, mechanical, chemical, or electrical engineering. MS or PhD preferred
• 5+ years of relevant experience in semiconductor manufacturing or a related field, with hands-on experience in semiconductor packaging or Frontend processes, specifically in technology on
• Appreciation for Structured Problem Solving
• Ability to interpret die-, package-, and system-level design and simulation (thermal/mechanical/electrical) methodologies and results
• Knowledge in Chip Package Interaction (CPI)
• Experience and working knowledge with 2.5D/3D heterogeneous integration technologies such as WLFO, SoIC, CoWoS, WoW, InFO, and other chiplet/SiP architectures is a plus
• Experience with wafer bumping, package assembly, substrate technology, BOM selection, testing and product development lifecycle
• Excellent communication skills with the ability to convey complex technical concepts to both technical and non-technical partners
• Demonstrated leadership experience in guiding multi-functional teams and driving technical excellence

Keen on the role? Apply now!