Department Head , Quality Assurance
Job Descriptions
· To lead and manage a team on quality assurance in a fast pace semi-conductor industries.
· To take ownership for technical transfer from Head Office (Japan), new products testing; as well as assisting customers during material evaluation and qualification phases, and provide solutions on technical and quality matters on the products.
· To work closely with Head Office (Japan), including Global Quality Assurance, R&D team, Manufacturing team, Engineering Team, Sales/Marketing and Supplier Chain team in achieving towards customer satisfaction.
- To work closely, especially with Japanese group customers (necessary to communicate in local Language), in the establishment of suitable material configurations and specification, to meet their expectations and requirements and providing technical support as necessary.
- To conduct experimental research on properties on products, as well as in-depth failure analysis and testing to facilitate root cause investigation for total improvement
Job Requirement:
- Degree / master in Polymer / Material engineering / Applied Chemistry / Engineering
- Minimum 15 years of relevant work experience in semiconductor industries (with at least 5 years in managerial position), and must be familiar with characteristic of epoxy molding compound for IC encapsulation, epoxy glue for die attachment, lid attachment, sealing.
- Requires detailed knowledge about ;
1) Reliability requirement for power device, automotive semiconductor.
2) Composite material between organic and inorganic.
3) Organic synthesis and adhesion between polymers and metals.
4) Polymer production process especially for Epoxy and Phenolic resin.
5) Metal property especially for silver
6) Rheology for paste material
7) Below equipments:
o DCS (Different Scanning Calorimetry)
o DMA (Dynamic Mechanical Analysis)
o TMA (Thermo-Mechanical Analysis)
o TGA (Thermogravimetric Analysis)
o Viscometer
o Rheometer
o GPC (Gel Permation Chromatography)
o SEM (Scanning Electron Microscope)
o Printing Machine
o Dispensing Machine
o Die Bonding Machine
o Wire Bonding Machine
- Familiar with Japanese Patent system
- Familiar with materials and custom regulations in respective countries, such as Japan (Japan (CSCL) , USA (TSCA), EU (EINECS,REACH), Korea (ECL) , Philippines (PICCSS), China (IECSC), Taiwan(ECN).
- Industrial experiences in failure analysis (FA or polymer science and semiconductor material composition) is necessary).
