Key Job Accountabilities:
· Sustain the respective eWLB processes for all eWLB engineering products and be technical expertise in their respective areas.
· Ensure new products meet special requirements of customer at various processes.
· Ensure smooth transition of new products from engineering qualification to LVM down to HVM by providing technical support at respective processes.
· Perform continuous improvement, engineering evaluations and process optimization through DOE and JMP analysis approach.
· Support the qualification of new and alternative materials (direct and indirect), tools, and equipment.
· Review the FMEA, OCAP and Control Plan of new products to achieve better yield and assembly performance prior and during LVM and HVM transition.
Participate in cost reduction projects during engineering builds.
Required Experience and Qualifications
· Requires B. Eng, B. Sc, M. Eng, M. Sc or PhD in Electrical, Electronics, Mechanical, Chemical Engineering, Physics, Material Science or its equivalent.
· Minimum 2 years of relevant experience in wafer process is preferred.
· Minimum 5 years of experience in relevant areas is an added advantage.
· Familiar with DOE, FMEA, SPC and 8D methodologies, and data analysis using JMP.
· Self-driven and good communications skills.