· Participation in the development of hardware and software modules of "Die Bonder equipment for the semiconductor industry (analysis, modelling, calculation, measurement, qualification)

· Definition of hardware and software requirements for an interdisciplinary development team (mechanics, electronics, software, motion control)

· Conduct and analyze experiments in order to identify suitable system parameters and machine production sequences

· Optimization of the Die Bonder system with the focus on accuracy, stability and productivity

· Development of "Die Bonding" process technologies according to current or future customer requirements (analysis, modelling, calculation, measurement)

· Customer Support

· Support internal and external customers (occasional business travel)

· Support product management on customer projects

· Support manufacturing engineering on assembly and supplier issues

· Knowledge Management

· Interpretation, documentation and presentation of new results

Education

· Technical education at university. Ideally microsystem technology, mechanical, electrical or mechatronic.

Experience

· Work experience in semiconductor or mechanical/electrical engineering or in a related field is advantageous.

Expertise

· (Business knowledge, languages, MS-Office, etc.)

· Expertise in mathematics, mechatronic or material science

· Flair for practical work in the lab and with experience with measurement equipment

· Microsoft office and programming knowledge

Personal Compentences

· (Social skills, management experience or strategic awareness, etc.)

· Capacity for teamwork as well as initiative and personal responsibility

· Innovative, systematic and solution-oriented work approach

· Ability to present complex topics in appropriate ways for specific audiences