As a University of Applied Learning, SIT works closely with industry in our research pursuits. Our research staff will have the opportunity to be equipped with applied research skill sets that are relevant to industry demands while working on research projects in SIT.

The primary responsibility of this role is to deliver on an industry-partnered Ignition research project where you will be part of a collaborative team exploring innovative ways of characterizing the physical and rheological properties of liquid personal care products and understanding the impact of these properties in product design and process development.

Key Responsibilities

• In this role, you will perform shear and extensional rheological characterization of a large variety of liquid personal care products including lotions, topical oils, and more. We will explore innovative and emerging methods of rheological characterization and analyzing rheological data to extract material parameters to build a database of materials. Working with our industrial partner we will establish an understanding of rheological properties that are useful for product formulation and process design related to lab and larger scale extrusion/dispensing applications.More specific responsibilities include:
  • Participate in and manage the research project with Principal Investigator (PI), and the research team members to ensure all project deliverables are met.
  • Undertake development of rheological protocols and characterization of liquid personal care products
  • Formulate model materials with various additives to understand their impact on product rheology
  • Design, execute, and interpret experiments independently and with support from the PI.
  • Prepare and deliver written articles, reports, and presentations for industrial partners and external audiences.
  • Attend and present at regular group meetings to receive feedback on work done and future plans
  • Carry out Risk Assessment, and ensure compliance with Work, Safety and Health Regulations.
  • Coordinate procurement and liaison with vendors/suppliers.
  • Work independently, as well as within a team.

Job Requirements

• Have relevant competence in the areas of rheological characterization and analysis, wet lab work, material formulation
• Have a degree in pharmaceutical engineering, chemical engineering, mechanical engineering, food or materials science/engineering, or a related field. Possessing a Master’s degree will be advantageous.
• Knowledge of any of the following will be advantageous: material dispensing/extrusion processing, material science, textural and sensory analysis

Key Competencies

• Able to build and maintain strong working relationships with people within and external to the university.
• Self-directed learner who believes in continuous learning and development.
• Proficient in communicating via technical writing and presentations.
• Possess strong analytical and critical thinking skills.
• Show strong initiative and take ownership of work.

Job Description:

Candidate will be part of Far-Backend Of Line (Far-BEOL) team of process module engineers, advancing specialty technologies at IME. His or her main roles and responsibilities include:

• Develop and support Chemical Mechanical Planarization (CMP) unit process capabilities for silicon photonics, flat optics, advanced packaging, MEMS, and wide bandgap semiconductor applications.
• Deliver innovations involving process methodologies, materials, or approach, and generate intellectual property related to various aspects of CMP.
• Participate as team member with process integration teams to actively support CMP process development, optimization and troubleshooting for various industry and grant projects.
• File patents/know-hows on new development activities.
• Publish research findings in prestigious journals and conferences.

Job Requirement:

• Masters with specialization in Electronics / Microelectronics / Materials Engineering / Chemical Engineering / Materials Science/ Chemistry / Physics or equivalent.
• Minimum 5 years of experience in CMP technologies, preferably in an industrial setting.
• Prior hands-on experience working on industry-scale 200 mm or 300 mm CMP equipment platforms (e.g., AMAT or Ebara platforms), with in-depth technical knowledge in process development, materials, and inline process control related to CMP.
• Knowledge of silicon photonics, advanced packaging, MEMS, or wide bandgap semiconductor technology platforms would be a plus, but not mandatory.
• Strong experimental design (DOE) and data analysis skills is preferred.
• Good interpersonal and strong demonstrated skills in collaborating with internal and external stakeholders.
• At least 2 years of demonstrated experience in managing projects of moderate complexity is preferred
• Good analytical skills and oral/written communication skills, with ability to deliver clear and concise messages to both internal and external stakeholders.
• Self-driven with strong interest in next-generation applications of CMP technologies and industry trends.

• We are a chip design service company invested by an international consortium and founded by a senior chip design technical team.
• The company is headquartered in Singapore and will take root in Singapore for long-term development.
• The company has strong R&D capabilities and its core technical team members all have more than 10 years of experience in chip design.
• We have rich industry experience and deep practical accumulation in ASIC design and business management.

Our office is located in one North and walking distance from MRT.

We Provide competitive salary and compensation package for the right candidate. We are work-life balance and friendly to employees with various benefit.

Job Description：

1. Works with the front-end design team to complete the chip floorplan , clock architecture, and powerplan .

2. Takes charge of the physical design tasks from the Netlist to the GDSII, including P&R, formal verification, static timing analysis, physical verification, power analysis, design for reliability and tapeout.

3. Researches the physical design methodology of advanced process nodes, and builds an automatic physical design platform.

Position Requirements:

1. Holds a bachelor's degree or above in electronic engineering, microelectronics, or computer science.

2. At least 5 years of work experience in the digital backend design field. Hands-on project experience is required. Tapeout experience at advanced technology is prefered. ( for excellect junior candidates with 3+ years experience will be considerated )

3. Those with experience in TCL , Perl or Python script development and familiar with EDA tool design will be plus.

4. Strong communication ability, good confidence and self-movitation.

5. Bilingual and with good teamwork spirit.

6. Salary is negotiable for excellent candidates.

Summary:

• Basic up to 6k
• Performance bonus
• 5 days work week
• Location: Pioneer
• MNC company - stable revenue
• Strong in CATIA

Key Responsibilities:

• Produce CNC design solutions for customize specification
• Produce design for automation
• Make drawings (2D & 3D) in CATIA
• Make parts explosion / BOM list using ENOVIA
• Documentation for fabrication
• Evaluation for design solutions
• Support production for machine modification design
• Do engineering presentations
• Other related adhoc duties

Key Requirements:

• Min Diploma in Mechanical Engineering
• Min 2 years relevant working experience
• Strong in CATIA

Interested applicants, please submit your updated resume in MS Words format by using the APPLY NOW BUTTON.

By submitting your personal data and/or resume, you give consent to the collection, use, and disclosure of your personal data and/or resume by the company (or its agent) for the purpose of the processing and administration by the company relating to this job application.

Please be notified that only shortlisted candidates will be notified.

Your recruiter for this job: Stella

WhatsApp me @ 8772 4117 for a prompt response to your enquiry!

Stella Aw Yong See Hui | R24121552

Recruit Now Singapore Pte Ltd | EA No: 21C0845

ROLE:

A*Star-IME is currently working on establishing a hybrid fabrication platform for 150mm and 200mm Silicon Carbide (SiC) power MOSFETs as a new pillar on Singapore"s Future of Microlectronics in wide-bandgap. The main objective of this SiC RnD program is to advance 200mm SiC technologies in various areas, such as epitaxy, device design, process integration & fabrication, and power module packaging. The ultimate aim is to drive disruptive innovations in power device research, specifically focusing on >1.7KV power MOSFETs. These innovations will have significant applications in enhancing automotive technologies, vehicle electrification, safety measures, sustainable energy grids, data centers, and industrial & aerospace automation. Key aspects for this role to be successful include the development and integration of several process modules, such as gate oxidation, implantation, implant activation, layout design verification, lithography, and ohmic contact formation. We are actively looking for individuals with extensive industry experience in device physics and process integration to join our team. The candidate will contribute to process integration, E-test and module process related data analysis, yield enhancement, and device physics.

RESPONSIBILITIES:

• Lead develop process technology for SiC power MOSFETs and ensure it meets the requirements for prototyping manufacturing

• Collaborate with advanced process module development team to establish a process flow for fabricating specific MOS devices

• Responsible to develop and improve test structures that enable fast and rigorous characterization of process

• Accountable to improve device performance and yield through the design, execution, and analysis of experiments for each specific device and product

• Work with cross-functional teams to minimize defects and address technical and yield concerns

• Drive CIP (Continuous improvement plans) to deliver integrated process modules and specific device per project goals

• Make decisions regarding the delivery of process, active and passive devices to multiple customers

REQUIREMENTS:

• MS/PhD Degree in Electrical Engineering or related field

• >3 years industrial experience for MOSFET process integration and device physics

• Proactive, self-motivated, and results-oriented professional with the ability to make efficient contributions to and lead technical discussions

• Extensive expertise in material and process integration

• Comprehensive understanding of semiconductor materials and the physics of MOSFET devices

• Strong communication skills to effectively communicate information about module integration for device fabrication and with customers

• Excellent analytical skills for interpreting process and device data, coupled with strong presentation abilities

As a Senior Package Design Engineering (PDE) Central Engineering System and Analytics (CESA) Engineer, you will develop integrated solutions to empower Backend Operations to make data-driven and heuristics-based decisions. You will work across Global Operations and sites to improve Cost, Scale, Quality, and Cycle Time by defining and designing data architecture and collaborating with key partners.

Responsibilities

• Yield Enhancement (YE) lots analysisLead YE lot analysis including reconstructing fuse identififaction (FID) for traceability, statistic comparison for different group
  
• Yield modelling / pareto benchmarkingIdentify actionable opportunities from YE lots
  Develop and improve Yield Models for HBM
  Periodically improve models based on actual performance
  
• Best Known Methods (BKM) DeploymentDevelop BKM’s for YE and drive implementation
  Identify/align BKMs and monitor implementation
  Works with different teams in the identification of critical metrics

Requirements:

• PhD/Masters/Bachelors in Statistics, Mathematics, or a related field; advanced degree preferred.
• Minimum of 3 years of experience in semiconductor manufacturing or related fields
• Preferably with experienced in Package Design Engineering and Yield Enhancement
• Strong understanding and knowledge of semiconductor manufacturing processes and technologies.
• Proficiency in statistical/machine learning and statistical techniques skills will be additional advantageous;
• Experience in MRDA will be a plus
• Proven ability to make decisions, multi-task, and solve problems and address root causes.
• Exhibit critical thinking to see opportunities.
• Effective communication skills in verbal/written.
• Self-motivated. Able to work independently with minimal supervision.
• Able to travel as required to support department and company objectives.

Job Description:

Candidate will be part of Far-Backend Of Line (Far-BEOL) team of process module engineers, advancing specialty technologies at IME. His or her main roles and responsibilities include:

• Develop and support Chemical Mechanical Planarization (CMP) unit process capabilities for silicon photonics, flat optics, advanced packaging, MEMS, and wide bandgap semiconductor applications.
• Deliver innovations involving process methodologies, materials, or approach, and generate intellectual property related to various aspects of CMP.
• Participate as team member with process integration teams to actively support CMP process development, optimization and troubleshooting for various industry and grant projects.
• File patents/know-hows on new development activities.
• Publish research findings in prestigious journals and conferences.

Job Requirement:

• Masters with specialization in Electronics / Microelectronics / Materials Engineering / Chemical Engineering / Materials Science/ Chemistry / Physics or equivalent.
• Minimum 5 years of experience in CMP technologies, preferably in an industrial setting.
• Prior hands-on experience working on industry-scale 200 mm or 300 mm CMP equipment platforms (e.g., AMAT or Ebara platforms), with in-depth technical knowledge in process development, materials, and inline process control related to CMP.
• Knowledge of silicon photonics, advanced packaging, MEMS, or wide bandgap semiconductor technology platforms would be a plus, but not mandatory.
• Strong experimental design (DOE) and data analysis skills is preferred.
• Good interpersonal and strong demonstrated skills in collaborating with internal and external stakeholders.
• At least 2 years of demonstrated experience in managing projects of moderate complexity is preferred
• Good analytical skills and oral/written communication skills, with ability to deliver clear and concise messages to both internal and external stakeholders.
• Self-driven with strong interest in next-generation applications of CMP technologies and industry trends.

Remuneration: Basic + VB

Work location: Alexandra

Job Description:

Report to the Project Director / Manager in Charged of the WTW system.

• Project Support: Provide technical expertise to oversee the design, development and construction of the WTW system.
• Interface with WTW system designer, vendors, fabricators including drawings reviews, sourcing equipment, cost control and monitoring, schedule monitoring and update.
• Project Execution: Oversee project implementation according to the requirements and objectives. This includes schedule monitoring, vendors sourcing and recommendation, purchase/ cost evaluation, resources allocation, attend to inquiries, clarifying technical details, supervising project execution, implementing corrective actions, conducting Factory Acceptance Tests, and finalizing as-built
• documentation.
• Troubleshooting and Repair: Diagnose and resolve malfunctions in deck machinery using technical manuals, hand tools, and power tools.
• Record Keeping: Meticulously maintain records of all changes, maintenance, repairs, and inspections.
• Develop operating, maintenance and safety procedures for the WTW system.

Job Requirements:

• Degree in Mechatronic or equivalent
• Min 5 years working experience in Marine Industry or shipyard environment.
• Good understanding of deck machinery such as winch, crane, lifting and handling equipment and the related IACS (particular ABS, DNV, BV) rules and regulations.
• Specific experience in WTW system (Offshore Passenger Transfer System) is highly advantageous
• Strong understanding of mechanical principles, hydraulic and electrical system and P&ID with ability to perform trouble shooting.
• Strong leadership with problem-solving skills. Strong understanding in structural design is highly advantageous
• Ability to speak both English and Mandarin to liaise with Mandarin speaking clients
• Software – able to use MS Office, MS Powerpoint, MS Project, Adobe and AUTOCAD. Ability to use Primavera scheduling software is highly advantageous
• Good understanding of Document Control. Knowledge of ISO9001:2015 QAM system is highly advantageous
• The candidate must be willing to travel and work in marine and offshore environment.

Daniel Wilson | Reg No.: R24125247

Recruit Now Singapore Pte Ltd | EA Licence No.: 21C0845

Summary:

• Basic up to 4.5k
• Performance bonus
• 5 days work week, 8-5pm
• Location: Pioneer
• MNC company
• Career Advancement
• Proficiency in CNC machines

Key Responsibilities:

• To repair & service CNC machines in the region
• To implement service programmes for customer service
• Machine Installation
• Documentation (Service report, Machine registration, filing and record)
• Other related adhoc duties

Key Requirements:

• Min Diploma in Electrical / Mechanical / Mechatronics Engineering
• Min 2 years of relevant experience in servicing CNC turning / milling machines
• Possess class 3 driving license

Interested applicants, please submit your updated resume in MS Words format by using the APPLY NOW BUTTON.

By submitting your personal data and/or resume, you give consent to the collection, use, and disclosure of your personal data and/or resume by the company (or its agent) for the purpose of the processing and administration by the company relating to this job application.

Please be notified that only shortlisted candidates will be notified.

Your recruiter for this job: Stella

WhatsApp me @ 8772 4117 for a prompt response to your enquiry!

Stella Aw Yong See Hui | R24121552

Recruit Now Singapore Pte Ltd | EA No: 21C0845

Summary:

• Basic up to 6k
• Performance bonus
• 5 days work week
• Location: Pioneer
• MNC company - stable revenue
• Strong in CATIA

Key Responsibilities:

• Produce CNC design solutions for customize specification
• Produce design for automation
• Make drawings (2D & 3D) in CATIA
• Make parts explosion / BOM list using ENOVIA
• Documentation for fabrication
• Evaluation for design solutions
• Support production for machine modification design
• Do engineering presentations
• Other related adhoc duties

Key Requirements:

• Min Diploma in Mechanical Engineering
• Min 2 years relevant working experience
• Strong in CATIA

Interested applicants, please submit your updated resume in MS Words format by using the APPLY NOW BUTTON.

By submitting your personal data and/or resume, you give consent to the collection, use, and disclosure of your personal data and/or resume by the company (or its agent) for the purpose of the processing and administration by the company relating to this job application.

Please be notified that only shortlisted candidates will be notified.

Your recruiter for this job: Stella

WhatsApp me @ 8772 4117 for a prompt response to your enquiry!

Stella Aw Yong See Hui | R24121552

Recruit Now Singapore Pte Ltd | EA No: 21C0845

As part of IME Integrated Circuit Design and System Department, we are seeking a candidate with relevant experience in analog integrated circuit design. This candidate will contribute to developing analog circuit blocks e.g. low-power operational amplifiers, voltage/current references, and voltage regulators based on thorough topology analysis. This candidate will work closely with other team members for the circuit design, test verification, as well as system integration and validation for a broad range of innovative sensor systems.

Role & Responsibilities

• Circuit schematic design and simulation, layout supervision, pre-tapeout design verification, test plan development and chip measurement
• Work together with teams to investigate novel circuit/system solutions to create new inventions

Requirements

• Bachelor’s / Master’s degree in Electronic Engineering
• Good understanding of CMOS analog IC design methodologies
• Familiar with analog IC design and verification flow
• Industry experience would be a plus
• Familiar with the IC test equipment such as oscilloscope, spectrum analyzer, etc.
• Able to generate high-quality scientific publications and patents
• Team player, quick learner and self-driven

Basic salary: ($3,200 - $4,500)

Location: Serangoon

Mon - Fri, 8.30am to 6pm

Job Description

• Technical transfer product/project in assembly and testing, and from customers
• Provide technical support in manufacturing and testing in product build
• Provide technical support to QC in RMA issue
• Provide technical support to QA in Compliance, Regulatory, Customer & Audit

Job Requirements

• Minimum Diploma in Electronics Engineering
• At least 2 years of relevant work experience in Electronics Manufacturing industry
• Technical competent to handle product/project manufacturing, transfers and troubleshooting
• Experience in product/project, PCBA manufacturing and testing
• Able to liaise with customer on technical matters
• Experience in manufacturing environment with ISO13485 & FDA would be highly advantageous
• Good communication and problem-solving skills
• Medical product experience and Quality Management System exposure would be highly advantageous

Daniel Wilson | Reg No.: R24125247

Recruit Now Singapore Pte Ltd | EA Licence No.: 21C0845

Job Description:

• Developing and optimizing thin film processes, such as Physical Vapour Deposition (PVD) and e-Beam Evaporation for Micro-Electro-Mechanical-Systems (MEMS), Wide-Band-Gap (WBG) and Photonics applications.
• Thin film property characterization and process issue troubleshooting.
• Develop film defect reduction and yield improvement strategies.
• Act as a subject matter expert and resource for colleagues in integration teams.
• Work with Fab team in establishing statistical process control for thin film module.
• Generate and present reports to both internal and external customers.

Job Requirements:

• Bachelors/Masters in Materials Science and Engineering, Physics, Electrical Engineering, or closely related fields are welcome to apply.
• 3+ years direct industry experience in PVD and evaporation is preferred.
• Good understanding of thin film deposition techniques, defect reduction methodologies, yield improvement and thin film property characterization is desired.
• Understanding of thin film tool hardware, especially PVD and evaporation, is advantageous.
• Knowledge and prior hands-on experience on basic process characterization techniques such as SEM/TEM, EDX, SIMS, FTIR, XPS, ellipsometry is advantageous.
• Good understanding of thin film deposition techniques, defect reduction methodologies, yield improvement and thin film property characterization is desired.
• Possess good interpersonal and oral/written communication skills, with ability to deliver clear and concise messages to both internal and external stakeholders.

Job Responsibilities:

• Schematic capture, optimization and simulation.
• Develop efficient circuit designs and digital STD cell library meeting performance, power and area target.
• Study and invent new digital STD cell circuit architecture.
• Work with a layout designer to implement the layout of circuit.

Requirements:

• Bachelor's degree or above in Electronics, Computer Science, or related fields.
• Experience on high performance and low-power analog design.
• Experience on deep sub-micron process technology (12nm and below) taped outs.
• Excellent interpersonal and communication skills.

ROLE:

A*Star-IME is currently working on establishing a hybrid fabrication platform for 150mm and 200mm Silicon Carbide (SiC) power MOSFETs as a new pillar on Singapore"s Future of Microlectronics in wide-bandgap. The main objective of this SiC RnD program is to advance 200mm SiC technologies in various areas, such as epitaxy, device design, process integration & fabrication, and power module packaging. The ultimate aim is to drive disruptive innovations in power device research, specifically focusing on >1.7KV power MOSFETs. These innovations will have significant applications in enhancing automotive technologies, vehicle electrification, safety measures, sustainable energy grids, data centers, and industrial & aerospace automation. Key aspects for this role to be successful include the development and integration of several process modules, such as gate oxidation, implantation, implant activation, layout design verification, lithography, and ohmic contact formation. We are actively looking for individuals with extensive industry experience in device physics and process integration to join our team. The candidate will contribute to process integration, E-test and module process related data analysis, yield enhancement, and device physics.

RESPONSIBILITIES:

• Lead develop process technology for SiC power MOSFETs and ensure it meets the requirements for prototyping manufacturing

• Collaborate with advanced process module development team to establish a process flow for fabricating specific MOS devices

• Responsible to develop and improve test structures that enable fast and rigorous characterization of process

• Accountable to improve device performance and yield through the design, execution, and analysis of experiments for each specific device and product

• Work with cross-functional teams to minimize defects and address technical and yield concerns

• Drive CIP (Continuous improvement plans) to deliver integrated process modules and specific device per project goals

• Make decisions regarding the delivery of process, active and passive devices to multiple customers

REQUIREMENTS:

• MS/PhD Degree in Electrical Engineering or related field

• >3 years industrial experience for MOSFET process integration and device physics

• Proactive, self-motivated, and results-oriented professional with the ability to make efficient contributions to and lead technical discussions

• Extensive expertise in material and process integration

• Comprehensive understanding of semiconductor materials and the physics of MOSFET devices

• Strong communication skills to effectively communicate information about module integration for device fabrication and with customers

• Excellent analytical skills for interpreting process and device data, coupled with strong presentation abilities

Job Description:

• Developing and optimizing thin film processes, such as Physical Vapour Deposition (PVD) and e-Beam Evaporation for Micro-Electro-Mechanical-Systems (MEMS), Wide-Band-Gap (WBG) and Photonics applications.
• Thin film property characterization and process issue troubleshooting.
• Develop film defect reduction and yield improvement strategies.
• Act as a subject matter expert and resource for colleagues in integration teams.
• Work with Fab team in establishing statistical process control for thin film module.
• Generate and present reports to both internal and external customers.

Job Requirements:

• Bachelors/Masters in Materials Science and Engineering, Physics, Electrical Engineering, or closely related fields are welcome to apply.
• 3+ years direct industry experience in PVD and evaporation is preferred.
• Good understanding of thin film deposition techniques, defect reduction methodologies, yield improvement and thin film property characterization is desired.
• Understanding of thin film tool hardware, especially PVD and evaporation, is advantageous.
• Knowledge and prior hands-on experience on basic process characterization techniques such as SEM/TEM, EDX, SIMS, FTIR, XPS, ellipsometry is advantageous.
• Good understanding of thin film deposition techniques, defect reduction methodologies, yield improvement and thin film property characterization is desired.
• Possess good interpersonal and oral/written communication skills, with ability to deliver clear and concise messages to both internal and external stakeholders.

As the Research Engineer (Equipment/Operations), you are directly involved in tool installation activities for semiconductor process tools. You would need to work proactively to coordinate with the contractor on the ground for the execution and take corrective and preventive actions of lessons learned, due diligently to prevent reoccurrence. You are responsible for performing utilities turn-on after installation is completed. You must perform the activities per ASTAR site procedure and safety policies to ensure all tool-install-related activities are completed, meeting safety, quality, schedule and budget requirements. You will also be required to perform other activities such as operations for the different semiconductor modules (Diffusion, Litho, Dry/Wet Etch, Thin Film, Implant, etc).

Responsibilities:

• Coordinate with all tool-install base contractors to execute equipment hookup for new tools, to meet the high-quality standards, dynamic schedule, and forecasted budget.
• Coordinate with the Project owner (NGTC/APM) to facilitate utility release as per the planned schedule and update tool release status timely
• Follow all safety and environmental procedures to ensure compliance with EHS-related regulations, risk assessment, safe work procedures, and permit-to-work system.
• Play an active role in safety, actively participating in safety discussions and safe work practices.
• Establish regular area walks to identify opportunities for improved safety, cleanliness, housekeeping and efficiency
• Establish regular, working interaction with peers as well as vendors in tool installation & facilitation, communicating clearly and respectfully all relevant information.
• Keep the reporting officer informed regarding the progress of assigned work and any abnormalities observed in your area.
• Demonstrate ability to understand drawing and highlighting discrepancies
• Follow area-specific procedures and documentation
• Prioritize work tasks to meet schedule and expectations, minimum guidance
• Perform tool tool-relativities and cleanroom systems troubleshooting during the hookup phase
• To perform equipment trouble-shooting of the equipments in NGTC when the need arises
• To perform utility-on after installation completion and to work closely with LCAM for complete closure
• To perform tests balancing of exhaust for new tools whenever necessary
• To perform measures for tool consumption during the hookup phase and to work closely with LCAM
• Use methods to organize, calculate, and display data accurately for utility and flowrate measurement
• Perform site activities in accordance to the Discipline

Requirements:

• Degree/Diploma in Mechanical/Electrical/Chemical engineering or equivalent
• Semiconductor experience (Equipment & Process)
• Facilities field or Wafer Fab Manufacturing equipment background will be an advantage.
• AutoCAD

Fabrica AI Full time Electrical Engineer - Invention of Automatic Tile Grouting Robots

Fabrica AI is reinventing how robots are developed. Currently novel robots take 5-20 years. We are building a design automation platform to bring it down to a month, and have already demonstrated significant progress by developing tile grouting robots in record time. Robotics simulation and reinforcement learning has been advancing a lot making it 1000x cheaper to train robots compared to 5 years ago, and as Jensen Huang said at Nvidia GTC 2024, "the ChatGPT moment for robotics may be just around the corner." A couple other companies are building on the same paradigm shift but we are the only ones using it to automate hardware design, not just software.

Building robots and a design automation platform together brings great synergy - the platform helps us develop robots faster than anyone else and the robots allow us to gather data and do experiments at scale. Data gathering can be done through partnerships with other robotics companies, but doing experiments is crucial for grounding the platform in reality and ensuring its usefulness. The grouting robots are already deploying daily at construction sites and bringing value to clients. We are currently negotiating sales worth around 500k USD. With manufacturing cost multiple times lower than companies using a traditional robotic arm, our robots have an ROI in weeks. Our robot is also small and simple to use, operating from a single button without the need to upload floorplans or do any complex setup. Soon we would be expanding into other simple and valuable robots for the construction industry.

We’ve raised over 2.5m USD from Hoxton Ventures, Credo Ventures, our Professor from Cambridge University, Woh Hup, and the owner of BHCC (listed construction company). We’ve 2500sqft of space in Singapore where we have over 20 team members, and 1200sqft of space in Czechia where we have our software team.

Jakub Suchanek (CEO) has an engineering degree from the University of Cambridge and experience working on self-driving cars at Wayve and machine learning at Granta Innovation and Wacker. He is a worldwide winner of NASA SpaceApps and has won bronze medals in International Olympiads in Informatics and Physics.

Ronald Luc (CTO) earned a degree in Math and Computer Science from Masaryk University, where he was a teaching assistant, and supervised several deep learning theses. He has years of industry experience in both machine learning and self driving cars. With Jakub he won TechFest Munich, one of the EU’s top hackathons; and represented Czechia at the International Olympiad in Informatics.

Keefe Wayne Teo (COO & CFO), a University of Cambridge engineering graduate, served as president of Hackbridge.io, promoting entrepreneurship in tech. He has 100+ citations in research journals and four papers on sustainable energy. He previously worked at Entrepreneur First and has business development experience from other companies.

Website: https://www.fabrica.ai/ (and various press releases, awards, etc.)
Latest Grouting Robot Demo: https://www.youtube.com/watch?v=AVWjmaMuYM0

Fabricator videos

https://www.youtube.com/watch?v=4aoQ4QaEOPQ

https://www.youtube.com/watch?v=xnENP7zWzEM

https://youtu.be/qXpkFeEidac

https://www.youtube.com/watch?v=5SBiEBLMQ9k

Your role would revolve around real-world industry deployments taking us from a TRL of 7 to 9. You may be remunerated with a combination of salary and share options. The following tracks are available:

Core responsibilities:

• PCB, electronics design
  • Working with both hobbyist and industrial microcontrollers, single board computers, motor drivers etc.
  • Integrating motor systems of different types (DC, BLDC, with encoder feedback…), sensor modules etc.
  • PCB design
• Embedded programming

Possible additional responsibilities:

• Testing our robot on construction sites
• Managing external PCB production
• Harness design
• Overseeing a team doing all the above

Requirements:

• Experience with electronics design and embedded software at at least one industrial level project
• Value the direct impact on the product and proximity to clients at a startup and the growth potential of a startup more than having a stable job at a reputable company
• Willing to work without a very well defined job scope and willing to adapt to changes week on week
• Ability to think of metrics to measure progress and deciding based on back on the envelope calculations
• Keenness to do more than is expected, impact driven, past side projects
• Excited about robotics and similar technical areas and exploring them in work and other projects
• Growth mindset driven

Our development process is very iterative and agile. Thus your role/tasks is/are likely to evolve over time. You would play a significant part in deciding how your work would contribute to our overall goals. If you like this process, you’d be a good fit for us.

Check out the link above for more information, and send your CV to [email protected]

Product area

Whether it is paying online with Autofill, using tap and pay in stores, or using the Google Pay app, the Payments team at Google is focused on making payments simple, seamless, and secure. In addition to consumer payment technologies, the Payments team also powers the money movement between Google and its consumers and businesses.

Job description

Google's software engineers develop the next-generation technologies that change how billions of users connect, explore, and interact with information and one another. Our products need to handle information at massive scale, and extend well beyond web search. We're looking for engineers who bring fresh ideas from all areas, including information retrieval, distributed computing, large-scale system design, networking and data storage, security, artificial intelligence, natural language processing, UI design and mobile; the list goes on and is growing every day. As a software engineer, you will work on a specific project critical to Google’s needs with opportunities to switch teams and projects as you and our fast-paced business grow and evolve. We need our engineers to be versatile, display leadership qualities and be enthusiastic to take on new problems across the full-stack as we continue to push technology forward.

Qualifications

Job responsibilities

• Build out data infrastructure and data pipelines in a secure and privacy compliant manner.
• Work with feature teams to provide reliable data and infrastructure.
• Maintain existing data infrastructure and ensure critical data is available and reliable.

Minimum qualifications

• Bachelor's degree or equivalent practical experience.
• 1 year of experience with software development in one or more programming languages (e.g., Java, C++).

Preferred qualifications

• Experience working with large data and creating and making available data cubes for other teams.
• Experience in optimizing data processing pipelines and data serving.
• Experience with data analysis and visualization tools (e.g., SQL, Colab).

Interested applicants are invited to apply directly at the NUS Career Portal

Your application will be processed only if you apply via NUS Career Portal

We regret that only shortlisted candidates will be notified.

Job Description

The Coastal Protection and Flood Resilience Institute (CFI) Singapore is actively seeking a Research Engineer to contribute to a groundbreaking research project. This research explores the efficacy of integrated nature-based solutions in sediment erosional control and coastal protection. The goal is to develop innovative, physically based models that quantify the protective benefits a vegetation meadow can offer to shorelines.

The Research Engineer will participate in experimental research, with a specific focus on studying sediment flux in hybrid solutions to coastal protection. He/she will lead and execute flume experiments, data analysis and field sampling as well as specific tasks which includes planning and conducting experiments, running laboratory analyses, collection and analysis of data, and performing basic administrative duties.

He/she will work need to work with Assistant Professor Gary Lei from Civil and Environmental Engineering and Dr. Ow Yan Xiang from the Tropical Marine Science Institute (TMSI) at NUS. Ideally, we are interested in candidates with prior experience with laboratory experiments.

Job Requirements

• Possess a bachelor’s degree in environmental engineering /Environmental Science/ Mechanical Engineering, or a closely-related field.
• Priority will be given to applicants who have prior research experience in coastal engineering, aquatic plants science, eco-hydraulics, and/or environmental fluid mechanics.
• Strong verbal and written communication skills.
• Proficient with Microsoft Suite and R, or other equivalent analytic software.
• Open to fixed-term contract.

What you will do

1. DFT architecture exploration & evaluation for next-gen process node & package technology of MediaTek:

• Scan chain insertion & ATPG pattern generation
• Pattern validation through simulation & silicon analysis(pass/fail, shmoo, fail log, etc.)
• Diagnosis to help manufacture process improvement

2. Co-work with SoC architect, RTL designer, physical design engineer, and package engineer to define best architecture for 3D-IC:

• PPA(Performance/Power/Area) impact analysis & mitigation via DFT innovation
• Develop & integrate DFT-related RTL design modules to test chip

What you will bring

1. Master's Degree in EEE/ EE/ CE
2. Expertise in Synopsys and/or Mentor DFT tools, and HDL simulators like Synopsys VCS
3. Fluency in script language including but not limited to TCL/Perl/Python
4. Experience about MBIST with state-of-the-art SRAM structure & EDA tools is big plus
5. Skill for RTL design & integration, and physical failure analysis(PFA) will also be plus
6. Ability to think and work independently with different teams
7. Interest in understanding more details in entire design flow
8. Ability to use English for discussing technical details
9. More than 4-year industrial work experience is preferred

Interested applicants are invited to apply directly at the NUS Career Portal

Your application will be processed only if you apply via NUS Career Portal

We regret that only shortlisted candidates will be notified.

Job Description

The job holders are to work with PI and the research team to process air quality data and study small-scale dispersion of airborne pollutants in urban environment.

Qualifications

One or more of (but not limited to) the following:

• Bachelor Degree in Engineering or relevant field
• Experiences of (small-scale) simulations of air pollutant dispersion, meteorology modelling, data processing
• Demonstrating as a fast learner of conducting literature study and literature summary
• Experiences of handling big data via R, Python, Matlab, etc.
• Experience with UNIX-based operating systems and bash script or similar
• Strong interests in applying machine learning models and applications to atmospheric research
• Proactive in assisting and contributing to quality scientific research publications
• Proficient in technical presentation, slide making, report writing, etc.
• Proven rounded and effective team player with strong initiative and ownership of the research project

Responsibilities

• Support and provide mechanical engineering design
• Handle design works and/or project management relevant to ACMV, Fire Protection, Sanitary and Plumbing.
• Supervise and coach a team of engineers in mechanical services for the project from concept stage, design development, contract documentation, authority submissions, site administration to project completion
• Act as either Project Manager or Team Leader in projects.
• Act as mentor to new employees.
• Provide technical assistance to engineers.
• Advise engineers on the project administration and contractual issues.
• Conduct technical discussion on common design problems with engineers

Requirements

• Recognised Degree in Mechanical Engineering with PEB Singapore
• Candidate must have min 6 years of relevant working experience in design engineering of ACMV / HVAC, Fire Protection and Plumbing services with Engineering Consultancies in Singapore
• Proven track record of working across organization boundaries to define requirements, solve complex problems and drive programs to successful completion
• Good understanding of Singapore Code of Practice and local authority submission process (LTA / PUB / BCA)
• BIM and CAD capabilities (REVIT / Microstation / Autocad) will be added advantage

Job Description:

• Be involved in project plan, Coordination operation
• Attend the project meeting if required
• Day-to-day site operation to ensure works are constructed as per project & safety requirement
• Supervise site works
• Liaise with clients on site works/project
• Other ad hoc duties as assigned
• Initiate and co-ordinate projects according to schedule.
• Assist engineering analysis and attend the site meeting.
• Any other duties as assigned by the project managers.

As a PDE Central Process Integration Principal Engineer, you will lead the development and integration of assembly and packaging processes for cutting-edge semiconductor products, such as DRAM, NAND, controllers, graphics, 3D-stacked (3DS) technologies, and High Bandwidth Memory (HBM). The ideal candidate will drive innovation in packaging technology and ensure seamless process integration during new product introductions.

This position involves working closely with multi-functional teams to research, design, and implement new packaging solutions while optimizing production yields and ensuring the successful commercialization of next-generation semiconductor technologies.

JOB RESPONSIBILITIES

Promote worldwide synergy

• Improve benchmark performance and efficiency gains through global project management and execution
• Network BKM leveraging and enhancement, business process creation and re-engineering
• Maintain a strong and open relationship with peer group and managers in other functional areas within central team and outside in areas such as Sites, TD, Product Engineering, Global Quality
• Help drive and fix the issue where necessary

Drive FE-AT Integration initiatives

• Business process governance between Fab – Assembly (WSPEC, FE2BE forum, WPSWAT)
• Lead & drive FE-AT excursions
• Yield, DPM related issues that involves both Fab – Assembly

Cross sites benchmark & achieve BIC yield performance

• Lead PI programs, PI Loop taskforce and/or team in network to address yield and quality challenges, optimize process flow

Identify, Propose & Drive new initiatives programs

• Propose & lead strategic programs to shift left/ shorten cycle learning across TN phase (PD, NPI, HVM)
• Process flow simplifications & standardizations
• Cross technology streamline (Process, tools, etc)
• Sites expansions process & qualification requirements
• Drive roadmaps with multi-functional teams (FE, AT Procurement, APTD, APPDE)

JOB QUALIFICATIONS

• Bachelor's degree in Engineering (Electrical, Mechanical, Materials Science, or related field).
• 3+ years of experience in semiconductor packaging technology development, process integration, or new product introduction (NPI)
• Strong background in frontend fabrication processes (FAB)
• Proven experience in data analysis, statistical process control (SPC), and process optimization.
• Strong problem-solving skills, attention to detail, and a proactive approach to technology development.
• Excellent communication and teamwork skills, with the ability to work across departments and with external partners.
• Hands-on experience in the development and implementation of cutting-edge semiconductor packaging technologies.
• Experience leading multi-functional teams in process development, technology transfer, and ramp-up.
• In-depth knowledge of the latest industry standards and trends in semiconductor packaging and assembly.