JOB SCOPE & JOB RESPONSIBILITIES

• Drive the creation and refinement of piping layouts, material take-offs (MTOs), and 3D model evaluations for intricate piping systems.
• Analyse stress and vibration data, offering technical expertise and recommendations.
• Collaborate closely with multidisciplinary teams to ensure cohesive project progress.
• Oversee technical specifications, support standards, and material selection to meet project requirement.
• Conduct regular progress assessments and provide strategic recommendations for project requirements.
• Offer technical guidance during contruction and installation phases to ensure successful project outcomes.
• Mentor and guide junior engineers, promoting a culture of quality and efficiency in design.
• Any other duties as assigned by superior.

JOB REQUIREMENT

• Bachelor Degree in Mechanical Engineering or a related field (or equivalent experience).
• At least 10 Years of experience in piping design, stress evaluation, and construction engineering support, including 5 Years in a supervisory capacity.
• Proficient in AutoCAD and 3D modelling tools (eg., Navisworks etc)
• Strong technical knowledge of piping stress/vibration analysia, material selection, and system design.

Must meet the following criteria:

1)Degree and qualifications in related field.

2)Must be able to speak and understand English so as to communicate with the team members.

3)Must be able to lead a groups of worker.

4)Must be a good leadership.

5)Must be able to coordinate workers and projects.

6)Must be able to work under tight deadlines.

JOB DESCRIPTION

Commissioning and Trouble-shooting to the all kind of air- con system,(A.C.C.U, A.H.U, F.C.U, SPLI type , WINDOW type , PACKAGE type , AND CHILLER type) check the Electrical wiring diagram to the system.

Overhauling all kind of Compressor to the refrigeration system(Carrier (5f/5h series), Daikin(c55/c58/c74/c75 series),Sabroe(cmo 20, 30 /smc 100/bf series), Bock(f-series), York( ms/mrseries), Carlyle (06ea/06ed series), Bitzer.

Mitsubishi (MS/O6B Series) open type and semi-hermetic type).

Split type air condition installation and troubleshooting.

Package type air condition installation and trouble shooting.

Re-fabricate and modify the piping to the Condenser by brazing method.

Re-fabricate and modify the piping to the Evaporator coil & steam coil by brazing.

Retro-fittings to the refrigeration system as per Environmental free zone Freon gas.

Service report maintains, & Attendant customer feed-back.

JOB REQUIRMENT

Minimum Degree or diploma in Relevant Engineering.

Minimum 10 years of experience on the relevant field.

Must have good communication knowledge.

Must have pervious Singapore experience.

Must able to work in any shift or any timing slot.

As an Engineer of MSB Lean Manufacturing, you will manage the implementation of Lean transformation methodologies and tools in Assembly, Test and SSD manufacturing at MSB. You will collaborate closely with site functional teams to identify, explore and implement lean methodologies and tools to drive improvements in throughput, labor productivity, yield, and cycle time performance.

Responsibilities:

• Lead the adoption and implementation of Lean methodologies and tools across Assembly, Test, and SSD manufacturing.
• Facilitate continuous improvement events across different functional teams (e.g., Kaizen, Value Stream Mapping (VSM), Projects, Workshops).
• Develop and sustain programs and systems to foster a Lean culture.
• Conduct labor productivity analyses (e.g., Touch-time, MMR, spaghetti charts) to enhance operator and technician efficiency and reduce operational errors.
• Oversee Utilization/ Overall Equipment Effectiveness (OEE) to identify key sources of losses and improvement opportunities.
• Collaborate with functional experts to identify areas for improvement through the application of Lean methodologies and tools.
• Propose Lean approaches and initiatives, including Kaizen and Continuous Improvement Projects.
• Act as the key integrator between central and site functional teams, developing, driving, and communicating progress on critical Lean improvement initiatives.
• Develop an overall view of critical initiatives and their impact on key performance indicators.
• Provide visibility on program status, including key achievements with clear ownership.
• Trigger interventions to ensure programs stay on track towards targets.
• Support regular reporting and meetings with senior leadership, including deep dives for weekly/monthly reports and ad-hoc senior management updates.

Requirements

• Bachelor’s /master’s in Industrial and system engineering, engineering management, Production & Operation Management, or related field.
• > 2 years of experience in Overall Equipment Effectiveness (OEE) and/or Lean manufacturing fundamentals in the semiconductor industry
• Strong project management, analytical skills and problem solving skills
• Possess good communication and interpersonal skills, with the ability to work effectively with multiple multi-functional teams.
• Knowledge of Semiconductor processes, engineering and/or manufacturing operations

Keen on the role? Apply now!

We are looking for a Package-Silicon Integration Engineer in Micron's Package Development Engineering(PDE) Group, who will be responsible for driving advanced package development for next generation silicon and package technologies. You will collaborate with various functional teams such as silicon wafer design, package design, wafer fab to meet project requirements. You will drive the technology development through multiple phases of product maturity and contribute to Micron's strategic objectives of Technology leadership.

RESPONSIBILITIES include but are not limited to:

• Work with package design and development teams to complete chip package interaction risk assessment.
• Work with scribe designers and assembly engineers to find solutions for dicing problems and implement relevant design rules/FMEA.
• Work with die designers to enable design for manufacturing in area like die size, scribe width and pad size.
• Collaborate with R&D/manufacturing wafer fabs and packaging teams to solve relevant issues, and improve yield, quality and manufacturability.
• Contribute to development of new silicon and package technologies by engaging with Micron’s internal factories.
• Define test vehicles, plan DOEs, characterize enabling technologies, document best-known-process and hand-off to manufacturing.
• Identify technology, quality, business process gaps and develop solutions.

EDUCATION, EXPERIENCE & QUALIFICATION REQUIRED

• Masters or Bachelor’s degree in Engineering (Mechanical, Materials Science, Electrical, Chemical) or related field
• 5-7 years of semiconductor fab experience in Chip package interaction and integration
• Strong Project / Program management skills
• Possess sound methodology for organizing work, decision-making and setting priorities
• Strong analytical, problem solving, and organizational skills
• Proficiency in computer applications like Excel, Word, Power Point.
• Self-motivated and team-oriented.
• Strong interpersonal, oral and written communications-skills.

Keen on the role? Apply now!

Job Description

• Working with Process Engineer & Engineering team on QC requirement
• Documenting inspection criteria and quality plan
• Work with QA, Process and Product team on corrective action with quality issue
• Work with Process team on in-process audit and FQC audit

Job Requirements:

• Minimum Diploma in Manufacturing /Quality Engineering
• At least 1 year of relevant working experience in Electronics Product Manufacturing environment
• Control of Supplier Quality Assurance (SQA)
• Quality control of in-coming, in-process and out-going products
• Knowledge of ISO 9001, 14001, 13485 & 45001, FDA requirement
• Able to understand IPC requirement in PCB
• Assembly, quality requirement of plastic molding, die casting, extrusion, metal stamping and machining parts

*Please be notified that only shortlisted candidates will be notified*

By submtting your personal data and/or resume, you give consent to the collection, use, and disclosure of your personal data and/or resume by the company (or its agent) for the purpose of the processing and administration by the company relating to this job application.

EA Personnel Name: Chan Jun Wei

EA Personnel No: R1543992

EA License No: 21C0845

Working Location: Buona Vista

Working Time: 5 day work week, 8:45am - 5:30pm

Job Description

● Utilise 3D CAD design tools and perform high precision 3D printing (FDM

& DLP)

● Utilise basic microcontrollers boards such as Arduino, ESP32 or STM32

to build simple circuit boards for sensor control and data acquisition

● Testing and assembly of electronics and mechanical parts and debugging

of software using basic tools like python or C++

● Familiar with maintenance of laboratory inventory and laboratory

administrative tasks (Procurement, equipment preventive

maintenance/repairs and safety matters)

● Enthusiastic, highly motivated, able to multitask, with excellent

interpersonal and communication skills.

● Administrative works, such as ordering and payment with SAP system.

Job Requirements

● Basic experience in 3D CAD design software, like Solidworks and Fusion360.

● Basic experience with microcontroller boards like Arduino, Esp32, STM32.

● Basic experience in handling simple electronics and basic hands-on soldering skills

● Prior experience or have interest in handling administrative tasks like raising Purchase Orders, payment requests, arranging preventive maintenance of equipment and liaising with vendors.

● Diploma/Higher Nitec/ Nitec holders in Bioengineering, Biophysics, physics, mechatronics, electrical engineering, mechanical engineering, computer engineering, or any related fields.

If you do not possess the above experience, your application will still be considered on individual merits and you may be contacted for other opportunities.

By submitting your personal data and/or resume, you give consent to the collection, use, and disclosure of your personal data and/or resume by the company (or its agent) for the purpose of the processing and administration by the company relating to this job application.

Please be notified that only shortlisted candidates will be notified.

EA Personnel.: Chan Jun Wei
EA Registered no.: R1543992
Recruit Now Singapore Pte Ltd
EA License no.: 21C0845

Job Responsibilities:

• Design and develop high-quality, scalable, and maintainable mobile applications.
• Collaborate with cross-functional teams to define, design, and ship new features.
• Ensure the performance, quality, and responsiveness of applications.
• Identify and correct bottlenecks and fix bugs.
• Help maintain code quality, organization, and automatization.
• Stay up-to-date with the latest trends and technologies in mobile development.

Requirements:

• 1-2 years of experience in IOS/Android App development.
• Bachelors degree in Computer Science, Information Technology, or a related field.
• Strong knowledge of Flutter, React, Dart and native programming language.
• Proven experience in building mobile applications for Android and iOS.
• Understanding of the full mobile development life cycle.
• Familiarity with RESTful APIs to connect mobile applications to back-end services.
• Strong understanding of design principles and user interface guidelines.
• Excellent problem-solving skills and ability to work in a team environment.
• Good communication and interpersonal skills.

The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.

As a Non-Volatile Memory Quality & Reliability Assurance (NVMQRA) Engineer at Micron Technology, you will be responsible for performing formal Failure Analysis of customer reported failing devices via the Returned Material Authorization (RMA) process. You will be required to summarize lab analysis results at the electrical and physical level to identify root cause and establish an associated containment plan. In this role, you will have the opportunities to collaborate with various engineering and manufacturing stakeholders to evaluate and review Corrective Actions /Preventive Actions. You will provide documentation of the RMA findings and oversee the final customer report till closure. In addition, for the senior role, you will be asked to provide guidance and lead the team when solving complex unplanned deviations reported by our customers. Project management skills are necessary and the ability to make critical decisions that directly translate to quality and timely completion of the project is highly desirable. You will also be required to spearhead the sustaining efforts and keeping up to date on new product knowledge, as well as developing and mentoring new talents.

Responsibilities and Tasks

Perform Failure Analysis of Customer Returns

• Understand customer complaint of the memory component failure
• Initiate communication with Micron Customer-facing team for further details on customer complaint, requesting additional questions to provide best opportunity for successful analysis
• Perform bench level analysis including initial data image analyis/examination
• Perform Automated Test Equipment (ATE) analysis and interpret results
• Work with the appropriate engineering teams (e.g., PE, PYE) to perform detailed fault isolation when electrical failure has been confirmed
• Summarize findings and submit for physical failure analysis (PFA).

Provide FA Reports for Micron Customer Facing Team for Communication to External Customers

• Summarize analysis at electrical and physical level into customer friendly formats.
• Work with the appropriate manufacturing Global Quality teams through the appropriate request systems (example: GPSS) for Root Cause and/or Corrective Action and a containment plan
• Identify potential risk to external customers
• Communicate with respective BU (Business Unit) on potential impact to customers
• Communicate FA updates through interim reports or during scheduled meetings with the customers.
• Provide formal FA Report with findings

Sustain Knowledge of Device Capabilities and Characteristics

• Keep up to date with latest Fab/ASM process technology
• Understand datasheet specifications for each device and the differences from previous technode for NOR * NAND product family
• Comprehension of qualification data and potential impact to customer operation
• Stay up-to-date on common customer applications and usage model
• Partnering with customer support team to resolve ongoing customer issues

Qualifications and Experience

• Excellent verbal and written communication skills in English. The ability to communicate clearly and concisely both verbally and in writing is critical in this role.
• Good organization skills and ability to multitask and coordinate between multiple issue at any given time.
• Ability to work effectively in cross-functional teams and handle pressure situations in a professional manner
• Excellent problem-solving and analytical skills with strong attention to details.
• Familiarity with NexTest /Teradyne bench analytical tools, scripting in linux console will be an added advantage.

Candidates with 2-3 years of experience in the semiconductor industry as Product or QA engineer are preferred. Relevant experienced candidates will be considered for the Senior Role.

Education

A Bachelor or Masters Degree in Electrical Engineering or similar field of study.

Job Responsibilities:

• Design and develop high-quality, scalable, and maintainable mobile applications.
• Collaborate with cross-functional teams to define, design, and ship new features.
• Ensure the performance, quality, and responsiveness of applications.
• Identify and correct bottlenecks and fix bugs.
• Help maintain code quality, organization, and automatization.
• Stay up-to-date with the latest trends and technologies in mobile development.

Requirements:

• At least a minimum of 5 years of relevant experience in IOS/Android App development.
• Bachelors degree in Computer Science, Information Technology, or a related field.
• Strong knowledge of Flutter, React, Dart and native programming language.
• Proven experience in building mobile applications for Android and iOS.
• Understanding of the full mobile development life cycle.
• Familiarity with RESTful APIs to connect mobile applications to back-end services.
• Strong understanding of design principles and user interface guidelines.
• Excellent problem-solving skills and ability to work in a team environment.
• Good communication and interpersonal skills.

The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.

Summary

This position is accountable for preparing the detailed Construction plans in accordance with the JGCAP’s company policies as the key person under the direction by JGCAP’s Site In-charge/ Project Manager and coordinating all construction activities on site among all JGCAP’s disciplines including subcontractors using his technical experiences and construction know-how and ensuring the completion of the work on schedule.

The detail plans as described above are as follows:

• Execution formation with the direction by JGCAP’s Site In-charge/ Project Manager.
• Outline of the Construction & sequence of work.
• Temporary facilities plan (If require) and subcontracting Plan.
• Manpower mobilization plan.
• Construction equipment mobilization plan.
• Work closely with the project scheduler on construction schedule and progress reporting.
• Constructability studies and plans, coordinate with Project Engineers and other related discipline as and when necessary.
• Scaffolding plan.
• Reflect the constructability plans in the inquiry for subcontracting.
• Preparation of documents such as specifications, procedures, manuals and etc.
• Erection plan of extra heavy equipment, inclusive of haulage plan.
• HSSE work control plan including rules and promotion plan together with JGCAP’s Site HSSE personnel.
• Coordinate with Project team of vendor specialists for work which need vendor specialist support.

Duties & Responsibilities:

• Initiate the subcontractors sourcing, inquiry package issuing, work scope clarification, sub-contractors evaluation & selection, cost negotiation and PO issuance.
• Work scope clarification & confirmation, BQ verification and construction direct & indirect cost estimation.
• Initiate Project’s Kick off meeting with the selected subcontractor and coordinating with selected subcontractors to ensure they are in line with company or project strategies and planning. Discussing and clarifying the detail of scope of work, execution plan, commercial issue and technical issue to minimize potential future conflict.
• Carry out constructability studies, construction activities planning and execution plan for the job.
• Coordinating with all engineering disciplines to ensure design, cost and client’s requirement can be achieved.
• Handling of issued drawings or field change sheet to ensure latest drawings to be applied.
• Work closely with the team member and subcontractor to prepare all the MSRA required for the project.
• Working closely with scheduler, subcontractors and clients to plan ahead and schedule critical work paths in order to avoid delays or obstructions on mechanical completion.
• Day to day management of the site, including supervising and monitoring the work progress, site labour force and any work of subcontractors.
• Overseeing quality control and health and safety matters on site.
• Maintain knowledge on all contract terms and legal requirements for project to avoid any delay in projects.
• Identify and resolve all technical issues in Construction process.
• Liaising with clients and company project team, including attending regular meeting and submitting reports to keep them informed of progress and construction issues.
• Liaising with any vendors, consultant, supervisors, subcontractors and the general workforce involved in the project.
• Assist the JGCAP’s Site In-charge/ Project Manager to monitor and manage the overall construction cost, including subcontractors’ progress billing, construction expenses and cost of variation order.
• Prepare and submit the weekly and monthly progress/construction reports to management.

Education Qualifications & Other Requirements:

• Degree in Mechanical engineering or equivalent.
• Over 3 years’ relevant experience in construction management field.
• Candidate with vast experience is also encouraged to apply.
• Experience in oil and gas or chemical projects.
• Knowledge in construction planning.
• Knowledge and experience in sub-contracting work.
• Proficient in MS Office, MS Powerpoint and schedule reporting.
• Clear awareness of construction management tools and method of execution.
• Familiar with Construction Practices.

Interested parties, please send in your detailed resume.

Responsibilities

• Undertake detailed design in Building Structures
• Execution of projects and liaison with the Client, Client’s Consultants, Contractors, and authorities to provide technical support for design
• Checker to obtain approval of design and drawings
• Prepare design report & attend meeting to resolve technical issue

Requirements

• Degree in Civil and Structural Engineering or its equivalent that is recognized by the Professional Engineers Board of Singapore
• Well versed with local authority codes and regulations
• Minimum 4 years of relevant building structure with civil experience
• Involve in large scale building (HDB/ Condominium/ Commercial) structural design project
• Good exposure in the analysis and design of PPVC, Precast and concrete structures, steel structures
• Good knowledge of the various engineering design software and analytical tools
• Applicant who has lesser experience will consider for Engineer role

Job Responsibilities:-

• Utilize in-depth knowledge of Foundation IP to evaluate and qualify IP’s. Able to benchmark and optimize Std cells/IO’s/memory for optimum performance, area or power needs of a project
• Conduct Spice simulations to verify the performance and reliability of designs on RC extracted netlists
• Perform library characterization to ensure accurate timing, power, and area models. Stay up-to-date with industry trends and emerging technologies in library characterization and PPA analysis
• Help to develop and maintain EDA automation scripts to streamline CAD flow and design processes
• Modify and optimize IPQA scripts to improve efficiency and performance
• Analyze and understand both hard and soft IPs within SOC designs. Work with IP vendors to deliver custom specs needed for MXL project needs
• Review silicon reports and provide detailed analysis to identify and resolve issues
• Work closely with vendors and cross-functional teams to ensure successful project outcomes. Collaborate with design teams to ensure seamless integration of libraries and IP blocks
• Maintain comprehensive documentation of IP Vendor engagement. Troubleshoot and resolve issues related to IP, EDA tools and automation flows

Job Requirements:-

• Bachelor’s or Master’s Degree in Electrical Engineering, Computer Engineering, or a related field
• Minimum 10 years of experience in design engineering or a related field. Good understanding of the IC design flow, including front-end and back-end processes
• Proficiency in Foundation IP, Spice Simulation, Library Characterization, EDA automation scripts, and IP script modifications. Familiarity with library characterization tools such as Liberate, Cadence Genus, or Synopsys Library Compiler
• Strong ability to review and analyze silicon reports and provide detailed insights. Excellent analytical and problem-solving skills
• Excellent interpersonal and communication skills for effective collaboration with vendors and team members
• Experience with advanced node technologies (e.g., 8nm, 4nm, and below)
• Experience with SOC IP design and verification
• Knowledge of emerging technologies such as FinFET, FD-SOI, or III-V semiconductors
• Familiarity with industry-standard EDA tools and methodologies
• Experience with tools such as Synopsys PrimeTime, Cadence Genus, or Mentor Graphics Questa

Location: Next to Bendemeer MRT

Interested candidates may submit detailed CV with the following info:-

• Current salary, including AWS or Variable Bonus
• Expected salary
• Availability

Responsibilities:

- Assess Die Overkilling In Line and Optimization of criteria

• Define Sampling Criteria for Yield Enhancement (YE) Wafer – Initial is to align with RPM lot
• Define and Create YE In Line DL2 & MRDA Flow: Full scan with tighter criteria (higher magnification) with non-die-kill
• Create Deviation flow to Route to YE Flow
• Define and Create YE Probe Flow: Full data logging and Test-to-end to capture as much data as possible
• Data Analysis:
• Correlation of MRDA (Metro Real-time defect analysis) Defect to Probe to identify in line failure mode causing probe fail and failure analysis

- Manage Risk of deviation

- Provide organizational leadership to build functional strategies & processes, and collaborate with partners to deliver strategic solutions

• Establish organizational roadmaps and strategies. Apply extensive knowledge and tenacity to carry out strategies.
• Collaborate with peers to construct global solutions.
• Ensure conflict resolution and assist with identifying escalation paths.
• Align internal strategies and communicate line of sight to corporate strategic objectives.
• Establish and communicate department capabilities to ensure partner expectations are aligned.
• Manage conflict and build effective relationships with internal and external partners.
• Initiate and sustain effective communication with internal and external partners.
• Provide advice to senior and executive management on strategic decisions
• Establishes and manages budget/finances for the team

- Ensure a Safe, Compliant, and Ethical Work Environment

• Maintain knowledge of and apply company safety, labor, and ethics policies.
• Communicate requirements and expectations to leaders and external partners.
• Ensure execution of mandatory training for organization.
• Identify and resolve and / or report potential safety, security, and labor issues.

Requirements

• Bachelors, Masters or PhD in Electrical Engineering, Materials Science, Chemical Engineering, or related field
• At least 4 years of experience in Semiconductor Manufacturing and on a leadership capacity, with focus on Advance Packaging technologies and High Bandwidth Memory (HBM) integration, in yield enhancement
• Experience in PWF (Post Wafer Fabrication), Backend engineering process, assembly package technology development and technical knowledge with die and wafer level process technology with understanding of Micron’s silicon and how it interacts at a package level through CPI (Chip Package Interaction), in yield enhancement
• Strong leadership and vision and must be able to comfortably work across organizational boundaries and geographies.
• Demonstrated ability to influence executives, senior leaders and partners on strategic decisions across multiple functions and geographies.
• Ability to effectively collaborate with multi-functional organizations to understand needs and translate them into actionable plans, deliverables, and resource requirements.
• Demonstrated ability to drive and implement a wide range of global initiatives with global teams.
• Ability to be guided by business objectives and determine best methods for delivering results.
• Organized, meticulous, and strong focus on results.
• Demonstrated ability to inspire teamwork and to effectively lead others.
• Proven facilitation skills including the ability to influence others, build consensus, and resolve conflict.
• Demonstrated track record in baseline performance improvement, business process creation, process simulation techniques, data interpretation skills and proficiency in statistical analysis/method.
• Excellent analytical skills and organizational competency
• With good oral and written English communication skill

Keen on the role? Apply now!

Job Description:

• Research, design, and develop computer and network software or specialised utility programs.
• Analyse user needs and develop software solutions, applying principles and techniques of computer science, engineering, and mathematical analysis.
• Update software, enhances existing software capabilities, and develops and direct software testing and validation procedures.
• Work with computer hardware engineers to integrate hardware and software systems and develop specifications and performance requirements.
• Collaborate with the team to create technical designs for frontend architectures using React and React Native.
• Develop and maintain frontend components and features for our main products.
• Participate in the development of management platforms related to marketing activities.
• Optimize frontend performance and implement server-side rendering techniques.
• Contribute to the improvement of development processes and coding standards.
• Stay up to date with the latest frontend technologies and best practices.\

Requirements:

• Bachelor's in Computer Science, Engineering or a related field
• Minimum 5 years of experience in Frontend Engineering.
• Experience in React or React Native.
• Experience with frontend performance optimization and server-side rendering.
• Familiarity with build tools like Webpack and Vite.
• Knowledge of Node.js and CSS.
• Excellent problem-solving and debugging skills.
• Strong attention to detail and ability to deliver high-quality code.
• Good communication and collaboration skills.
• Passion for staying up to date with the latest frontend technologies and trends.

As a Package Design Engineer within the Package Development and Engineering (PDE) organization in Micron Technology, you will provide package definition and designs for advanced semiconductor devices. You will be working with a multi-functional team across several geographies to create package design databases such as package stack-up, simulation, route-study, substrate/lead frame layout, wire bond diagrams, and other design documentation. You will be ensure the completion of design activities within the project schedule and ensure that design outputs are within Assembly and vendor capability.

Responsibilities will include, but are not limited to:

• Conduct feasibility studies for various package options and assess designs for manufacturability and reliability.
• Work closely with multi-functional team to address packaging design challenge in the area of layout, electrical, thermal, mechanical, assembly and reliability.
• Interact with PDE assembly team and external assembly subcontractor partners to recommend package solutions to meet customer and/or market requirements
• Generate and update assembly documents in database. Provide drafting and drawing support for package drawings, interposer drawings, and manufacturing drawings.
• Support package and DFMEA reviews with assembly engineering and subcon teams.
• Support package technology development, including material selection, process development, DOEs, and related activities
• Support package technology development, including material selection, process development, DOEs (Design of Experiments), and related activities.
• Track and drive program milestones to ensure timely development execution.
• Provide design support for thermal/mechanical/electrical simulation analysis.
• Support and contribute to the Global Design, Simulation and Substrate (GDSS) team on continuous improvement efforts such as:Global design alignment activities
  Continuous improvement efforts
  Package design rules
  Package roadmaps
  Competitive Analysis review

Requirements:

• Master (preferred) or Bachelor of Science degree in Electrical Engineering or Mechanical Engineering with a minimum of 5 years of experience in semiconductor packaging industry OR PhD graduates in Electrical Engineering
• Candidates must possess a strong design knowledge of high-density (Wirebond + Flip-Chip) packaging architectures, die stack-up, packaging layout optimization.
• Excellent communication skills, both oral and written in English.
• Excellent problem solving and analytic skills.
• Experience with Cadence SIP, APD and AutoCAD software tools is preferred.
• Good understanding of Silicon IP, floorplan and Signal/Power Integrity is a plus.
• Ability to work independently, prioritize and manage numerous projects with minimum supervision.
• A global perspective and the ability to work in a multicultural environment.

Performs semiconductor design engineering assignments including engineering and designing packaging stack-up, layout checking, documenting specifications, modifying and evaluating packaging risk in the areas of electrical, thermal, mechanical and reliability. Reviews package design requirements, define the package stack-up and conduct final design review. Typically responsible for projects, or portions of projects, to design, fabricate, modify, and evaluate semiconductor Packaging.

Your main responsibilities include:

• Develop and maintain product datasheet testing and characterization test programs for NAND and NOR components
• Working with product reliability engineers to define test flows for individual products
• Provide support to operation team to ensure seamless execution for generated test flow on the tester with live product
• Perform electrical failure analysis for failure validation and characterization

You are encouraged to apply if you can demonstrate some of the qualities listed below:

• Master's or Bachelor's degree in Engineering field. Microelectronic/Electrical/Computer Engineering fields are preferred.
• Positive attitude and self-motivation towards learning and development.
• Good analytical mindset and structured personality.
• Good written and verbal communication skills.
• Hands on experience with C++/Python and Object-Oriented Programming is a plus
• Understanding Automated Test Equipment and flash memory is a plus.
• Fresh graduates are welcome to apply.

Working location:

• 990 Bendemeer Road, Singapore 339942

Job Responsibilities:

1. Circuit and system design of RF/analog transceiver IC based on CMOS technology

2. Schematic design, behavioral and circuit-level simulation, circuit implementation, layout design and test

Job Requirements:

1. A master's degree or above in microelectronics, communications, electronic engineering and other related majors; more than 3 years of relevant experience

2. Good know-how on RF/analog circuit theory and analysis; Good understanding of design process of RF/analog IC

3. Solid experience in the following module/block design and test: VCO, PLL, LNA, PA, MIXER, PMU, ADC, DAC, etc.

4. Good communication skills and team spirit.

5. Fresh MS graduates are welcome.

Position Summary:

The Network Engineer supports and maintains infrastructure operations, monitors infrastructure performance and resolution of technical problems. Manage firewalls, network access control and F5 Load balancers.

Manage the firewalls (fortigate), network access control (CPPM) and F5 load balancers

Role and Responsibilities

Roles & Responsibilities:

Maintain infrastructure

• Perform activities related to ongoing maintenance of infrastructure

• Assist with the implementation of agreed infrastructure changes and maintenance routines

Optimise infrastructure performance

• Perform ongoing tuning and optimization of infrastructure hardware and software components such as updates and upgrades

• Participate in infrastructure development activities

• Assist with infrastructure testing and implementation

• Gather performance and data usage statistics for capacity planning and reporting

• Assist with piloting of new tools, technologies, and/or processes

Resolve incidents

• Perform problem/issue identification and resolution

• Assist with simulation of user problems to resolve operating difficulties

• Follow up with users to ensure problem has been resolved

• Recommend system modifications to reduce user problems

Requirements / Qualifications

- Degree in Computer Engineering or equivalent

- Minimum 3 years of Experience in Network Support

- CCNA / CCNP certification preferred

- Knowledgeable in Firewall, NAC and F5 Load Balancers

Service Desk Engineer

We are looking for experienced full-time Service Desk engineer to provide End User Computing or Service Desk support to APAC Region in Singapore.

Job Responsibilities:

• Provide level 1.5 End User Computing support and well verse in Windows OS
• Diagnosing end-user system failures and implement repair solutions.
• Diagnosing printer and other peripheral devise failures and implement repair solutions.
• Troubleshooting network devices in order to ensure connectivity from the PC to the Network.
• Providing installation and upgrading services of hardware and software.
• Configuration and troubleshooting of phones and other mobile devices, tablets, and PDAs.
• Setup and troubleshooting audio/video equipment such as projectors and video conference equipment

Job Requirement:

• Diploma/Bachelor’s degree in computer science / information technology or relevant field.
• At least 1-1.5 years of relevant working experiences.
• Knowledge of multiple manufacturers and operating systems.
• Excellent troubleshooting capability.
• Using established procedures and working under immediate supervision, performs assigned tasks.
• Work is routine and instructions are usually detailed.
• Resolves routine questions and problems and refers more complex issues to higher levels.
• A good team player.
• Excellent interpersonal skills.
• Customer centric and focus on service excellence.
• Excellent problem-solving and multitasking skills.
• Good verbal and written communication skills and ability to interact with other teams.
• Working location: Central, Singapore

It would be appreciated if you can share with me your interest on the same.

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Job Responsibilities:

• Assist Project Manager in all on-site technical/ engineering matters and authority submissions.
• Prepare submission of shop drawing / Materials / MOS/ Monthly Progress Claims and PM Reports.
• Lead in Site Coordination and execution relating to the construction project.
• Planning of micro scheduling with other trades/disciplines against Master program
• To update structural/architectural/M&E progress with scheduling tools.
• Supervise and monitor projects are carried out in accordance with the company’s operating procedures, quality standards & contractual specifications.
• Ensuring supervisors & foremen meet clients’ regulatory work requirements.
• To check and ensure compliance with TOP checklist
• Responsible for all inspection activities being carried out.
• Ensuring environmental, safety, and health practices are carried out at all times.

Requirements:

• Degree in Civil or Structural Engineering recognized by PE Board/ BCA
• 4-5 years experience in Building Engineering projects
• Experience with Precast/PPVC/MET projects will be a plus
• Proficient in MS Office, AutoCAD, and BIM
• Organized, meticulous with positive work attitude
• Able to work independently and a team player
• Good analytical, supervision, and communication skills
• Completed QM project and a registered Core-trade Foremen/ Supervisor would be an added advantage

Responsibilities

· Functional blocks and/or subsystems of digital ASICs from design to silicon verification. This includes RTL coding, verification, silicon validation, and qualification.

· Proactively work with other team members and partners to align on specifications, conduct reviews, and complete documentation.

· Contribute to ASIC roadmaps and future innovation.

· Develop technical leadership skills.

· Participate in co-development activities to help prototype ASIC designs in FPGA or other software models to support pre-silicon firmware development and verification.

Education And Experience Required

· BS or MS degree in electrical engineering or equivalent with focus on VLSI design experience

· Fresh MS graduates are welcome.

Knowledge And Skills

· Knowledge of submicron semiconductor technology

· Familiar with digital ASIC/SOC design flow from RTL to silicon characterization

· Familiar with Synopsys and Cadence EDA tools for Simulation, Synthesis, Timing (STA), Formal and Assertion based verification, etc.

· Familiar with design and programming languages: Verilog, System Verilog, Python, Perl, C, C++, etc.

· Ability to apply analytical and problem-solving skills

· Strong written and verbal communication skills, ability to negotiate design features and options

· Knowledge of embedded system design, verification, and product development lifecycle

· Deep knowledge and domain know-hows in ARM/RISC-V microprocessor subsystem

About Us:

We develop comprehensive software products and solutions ranging from IT consultancy to infrastructure and hardware setup to optimise customers' experiences. To establish ourselves as a leading provider of applications and healthcare support services for the Asian market, and partner healthcare customers to build a safe medical environment for all.

We are driven by our group philosophy as defined below:

1. Provide the best to our customers through a service-oriented culture

2. Create new value through innovation

3. Realise greater possibilities through advanced technology

Roles and Responsibilities:

• Responsible for providing technical assistance and support related to computer systems, hardware or software testing
• Responds to queries, runs diagnostic programs, isolates problem, and determines and implements solution
• Provide technical assistance and support for incoming queries and issues related to computer, systems, software, and hardware
• Respond to queries either in person or over the phone
• Write training manuals
• Maintain daily performance of computer systems
• Respond to email messages for customers seeking help
• Ask questions to determine nature of problem
• Walk customer through problem-solving process
• Install, modify, and repair computer hardware and software
• Run diagnostic programs to resolve problems
• Are required to apply information security in accordance with the established policies and procedures of the organization.

Requirements:

• Diploma or Certificate in IT/Computer Engineering with 1-2 years of working experience in technical support
• Experience in basic networking support
• Experience in supporting OS platforms such as Windows 10 and MS Office applications
• Prefer candidates who are resourceful, good working attitude & takes initiative
• Good communication skills and administrative skills

Responsibilities:

1、Responsible for the research and development of algorithms for wireless IC such as baseband algorithm, positioning algorithm, bioradar algorithm, and motor control algorithm.

2、Complete design documents, support hardware development, participate in testing, analyze and solve various problems encountered in actual development.

Requirements:

1. Majors in signal processing, microelectronics, communication, computer, control, automation, applied mathematics, etc.

2. Master's degree or above.

3. Experience in wireless IC design is a plus.

4. Good English skills, communication skills, and willingness to work with a global team;

5. Good learning competency, self-motivated, and ability to work in diverse areas in a flexible and dynamic environment.

6. Fresh MS graduates are welcome.

Position Summary:

Mainly supporting security aspect like firewall checkpoint, security appliances - configuration, troubleshooting, capacity planning. Supporting current operation and deployment of resiliency project.

Roles and Responsibilities:

• Directly reporting to Security Senior Manager
• Assist Architect team on new infrastructure design, implementation, and management of network solutions that form the core infrastructure, ensuring seamless integration across different platforms. This includes procurement of necessary equipment.
• To provide comprehensive product knowledge on the data technology required to deliver, support the networks infrastructure.
• Collaborate with the team to identify network and system needs, monitor performance metrics, troubleshoot, and resolve network-related issues, and implement improvements.
• Deliver project management for network activities encompassing upgrades, deployments, and migrations. Provide technical guidance and user support as required.
• Develop, maintain, and update documentation covering the network environment and operational procedures.
• Generate reports and detailed documentation outlining findings, implemented solutions, and recommendations for further enhancements.
• Oversee network environment to maximize performance, scalability, and minimize downtime.
• Closely coordinate and conform to Change Management policies, process, and procedures on any network changes.
• To implement approved changes, troubleshoot to identify root causes and implement effective solutions.
• Experience on Automating daily network tasks using scripting.
• Be available to provide on-call support as needed.

Qualification/ Requirements:

• Minimum Bachelor in Computer Engineering or equivalent
• Must equipped with CCNP or CCIE
• Network Infrastructure & Hardware: 5+ years experience managing large enterprise network with a strong focus on F5, Palo Alto, Cisco, and CheckPoint Technology.
• Network Devices: In-depth knowledge and proficiency with switches, firewalls, load balancers, routers, and ISE.
• Network Design & Troubleshooting: Expertise in designing, monitoring, and network & incident management (LAN, WAN, VPN).
• Experience with automation tools: Ansible, Python
• Experience with Deployment and automation, advantage to have experience building data center
• Proven track record of success in a fast-paced IT environment.
• Excellent communication and interpersonal skills, allowing you to effectively collaborate with both technical and non-technical stakeholders.
• Ability to work under pressure and delivery the project on time with minimum supervision.
• Certified and experienced with the mentioned technologies.
• 2 years contract