Job Responsibilities:-

• Utilize in-depth knowledge of Foundation IP to evaluate and qualify IP’s. Able to benchmark and optimize Std cells/IO’s/memory for optimum performance, area or power needs of a project
• Conduct Spice simulations to verify the performance and reliability of designs on RC extracted netlists
• Perform library characterization to ensure accurate timing, power, and area models. Stay up-to-date with industry trends and emerging technologies in library characterization and PPA analysis
• Help to develop and maintain EDA automation scripts to streamline CAD flow and design processes
• Modify and optimize IPQA scripts to improve efficiency and performance
• Analyze and understand both hard and soft IPs within SOC designs. Work with IP vendors to deliver custom specs needed for MXL project needs
• Review silicon reports and provide detailed analysis to identify and resolve issues
• Work closely with vendors and cross-functional teams to ensure successful project outcomes. Collaborate with design teams to ensure seamless integration of libraries and IP blocks
• Maintain comprehensive documentation of IP Vendor engagement. Troubleshoot and resolve issues related to IP, EDA tools and automation flows

Job Requirements:-

• Bachelor’s or Master’s Degree in Electrical Engineering, Computer Engineering, or a related field
• Minimum 10 years of experience in design engineering or a related field. Good understanding of the IC design flow, including front-end and back-end processes
• Proficiency in Foundation IP, Spice Simulation, Library Characterization, EDA automation scripts, and IP script modifications. Familiarity with library characterization tools such as Liberate, Cadence Genus, or Synopsys Library Compiler
• Strong ability to review and analyze silicon reports and provide detailed insights. Excellent analytical and problem-solving skills
• Excellent interpersonal and communication skills for effective collaboration with vendors and team members
• Experience with advanced node technologies (e.g., 8nm, 4nm, and below)
• Experience with SOC IP design and verification
• Knowledge of emerging technologies such as FinFET, FD-SOI, or III-V semiconductors
• Familiarity with industry-standard EDA tools and methodologies
• Experience with tools such as Synopsys PrimeTime, Cadence Genus, or Mentor Graphics Questa

Location: Next to Bendemeer MRT

Interested candidates may submit detailed CV with the following info:-

• Current salary, including AWS or Variable Bonus
• Expected salary
• Availability

As a Process Control System Engineer you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. Additional responsibilities include coordinating and carrying out process, equipment and material evaluation/optimization to implement changes at process step, leading and participating in yield improvement and cost reduction activities, handling new process baseline qualifications and managing, auditing and liaising with material suppliers to achieve quality, cost and risk management objectives.

As a PDE Network Engineering Process Control System (PCS) Engineer/Senior Engineer, we will be responsible to develop smart manufacturing solutions towards the Industry 4.0 standard. We will gain exposure and knowledge in many cutting-edge areas including Machine Learning, Advanced Control Solutions and Deep Learning. As a PDE PCS Engineer, we will have the opportunity to develop a complete solution that starts from requirements gathering, data analysis and modeling with big data platform, followed by system development and integration; and then network wide implementation. The work we do directly affects the bottom line of the entire company by providing scrap/excursion control, Statistical Process Control (SPC), Advanced Process Control (APC or Run-to-Run), Fault Detection and Classification (FDC), and overall enhanced process capability. We will meet regularly and team with Process areas to understand their tools, processes, and challenges and work with them to create process control models, strategies, and other methods for ensuring quality output.

Responsibilities

• We develop, implement and improve smart control solutions for optimum manufacturing performances.
• We provide technical oversight, guidance and support for process control implementation
• We conduct intensive data analysis and modeling to identify sources of variation in the process and translate it into control solutions.
• We support PDE KEG team in Classification, Characterization and Categorization and define Data Collection Requirements, Perform Integration and Setup Data Collection in E3 Environment.
• We define Analysis and setup Requirements and Setup Limits and OCAP and engage in periodic review with PCS team and network on BKM practices.
• We develop and deliver training on control systems and related topics.

Requirement

• PhD, Masters/Bachelor’s Degree in Electrical and Electronics Engineering/Computer Science/Statistics/ Mathematics/Physics
• At least 4 years of experience in semiconductor manufacturing advanced process control.
• Experience and knowledge in Programming and Data Analysis. Preferred experience in Python/R/SQL/Hadoop eco-system and/or in the development of web-based applications
• Familiar with Machine Learning.
• Good communication and interpersonal social skills.
• Excellent problem solving and analytical skills.
• Excellent verbal and written communications skills. Good interpersonal skill and a good teammate.
• Excellent Project management skills.
• Ambitious and ability to multi-task and balance dynamic priorities.
• Ability to participate in a multi-functional team environment.
• Willing and capable of international travel, as needed, to accomplish your objectives.

Keen on the role? Apply now!

Optics are critical at KLA and at the core of our tools that are finding defects on wafers and reticles that aren’t visible with the human eye. We do this by using different light sources and nanophotonics to capture images. As an optical engineer at KLA, you’re responsible for developing ultra-high precision optical systems and component designs for complex systems, conducting key optical simulations, modeling and analysis as well as identifying manufacturing issues and developing solutions for these.

Responsibilities:

• Facilitate the optical specifications, lens design, and supplier integration of new optics enabled products for the Optics Development Engineering group.
• Effective use of Code V or Zemax to design low residual aberration generating imaging lenses, relays, spatial/polarization beamsplitters and zoom lenses both from nominal design process to final Monte Carlo tolerance analysis and error budgeting.
• Construct complex system models using above components having all imaging paths with critical parameters needed to produce accurate and efficient raytracing simulations of Strehl/WFE performance, coherent and incoherent PSF size/shape, focal depth of field and pupil, multiple bounce ghost and non-sequential stray light analysis, and polarization ray tracing to quantify transmission, retardance, diattenuation.

Education or experience should include:

• Designing, modeling and analyzing optical systems
• Optical manufacturing processes
• Code V or Zemax Optical software advanced user
• Statistical lens tolerancing
• Ghost and stray light analysis
• Design for manufacturing based on capabilities of Optical metrology
• Specification of precision opto-mechanical assemblies; and
  Data analysis using Matlab or other programs. Any suitable combination of education, training, or experience is acceptable.

Minimum Qualifications

• Doctorate (Academic) Degree and 0 years related work experience; Master's Level Degree and related work experience of 3 years; Bachelor's Level Degree and related work experience of 5 years

Job Description

• Working with Process Engineer & Engineering team on QC requirement
• Documenting inspection criteria and quality plan
• Work with QA, Process and Product team on corrective action with quality issue
• Work with Process team on in-process audit and FQC audit

Job Requirements:

• Minimum Diploma in Manufacturing /Quality Engineering
• At least 1 year of relevant working experience in Electronics Product Manufacturing environment
• Control of Supplier Quality Assurance (SQA)
• Quality control of in-coming, in-process and out-going products
• Knowledge of ISO 9001, 14001, 13485 & 45001, FDA requirement
• Able to understand IPC requirement in PCB
• Assembly, quality requirement of plastic molding, die casting, extrusion, metal stamping and machining parts

*Please be notified that only shortlisted candidates will be notified*

By submtting your personal data and/or resume, you give consent to the collection, use, and disclosure of your personal data and/or resume by the company (or its agent) for the purpose of the processing and administration by the company relating to this job application.

EA Personnel Name: Chan Jun Wei

EA Personnel No: R1543992

EA License No: 21C0845

Working Location: Buona Vista

Working Time: 5 day work week, 8:45am - 5:30pm

Job Description

● Utilise 3D CAD design tools and perform high precision 3D printing (FDM

& DLP)

● Utilise basic microcontrollers boards such as Arduino, ESP32 or STM32

to build simple circuit boards for sensor control and data acquisition

● Testing and assembly of electronics and mechanical parts and debugging

of software using basic tools like python or C++

● Familiar with maintenance of laboratory inventory and laboratory

administrative tasks (Procurement, equipment preventive

maintenance/repairs and safety matters)

● Enthusiastic, highly motivated, able to multitask, with excellent

interpersonal and communication skills.

● Administrative works, such as ordering and payment with SAP system.

Job Requirements

● Basic experience in 3D CAD design software, like Solidworks and Fusion360.

● Basic experience with microcontroller boards like Arduino, Esp32, STM32.

● Basic experience in handling simple electronics and basic hands-on soldering skills

● Prior experience or have interest in handling administrative tasks like raising Purchase Orders, payment requests, arranging preventive maintenance of equipment and liaising with vendors.

● Diploma/Higher Nitec/ Nitec holders in Bioengineering, Biophysics, physics, mechatronics, electrical engineering, mechanical engineering, computer engineering, or any related fields.

If you do not possess the above experience, your application will still be considered on individual merits and you may be contacted for other opportunities.

By submitting your personal data and/or resume, you give consent to the collection, use, and disclosure of your personal data and/or resume by the company (or its agent) for the purpose of the processing and administration by the company relating to this job application.

Please be notified that only shortlisted candidates will be notified.

EA Personnel.: Chan Jun Wei
EA Registered no.: R1543992
Recruit Now Singapore Pte Ltd
EA License no.: 21C0845

We are looking for a Package-Silicon Integration Engineer in Micron's Package Development Engineering(PDE) Group, who will be responsible for driving advanced package development for next generation silicon and package technologies. You will collaborate with various functional teams such as silicon wafer design, package design, wafer fab to meet project requirements. You will drive the technology development through multiple phases of product maturity and contribute to Micron's strategic objectives of Technology leadership.

RESPONSIBILITIES include but are not limited to:

• Work with package design and development teams to complete chip package interaction risk assessment.
• Work with scribe designers and assembly engineers to find solutions for dicing problems and implement relevant design rules/FMEA.
• Work with die designers to enable design for manufacturing in area like die size, scribe width and pad size.
• Collaborate with R&D/manufacturing wafer fabs and packaging teams to solve relevant issues, and improve yield, quality and manufacturability.
• Contribute to development of new silicon and package technologies by engaging with Micron’s internal factories.
• Define test vehicles, plan DOEs, characterize enabling technologies, document best-known-process and hand-off to manufacturing.
• Identify technology, quality, business process gaps and develop solutions.

EDUCATION, EXPERIENCE & QUALIFICATION REQUIRED

• Masters or Bachelor’s degree in Engineering (Mechanical, Materials Science, Electrical, Chemical) or related field
• 5-7 years of semiconductor fab experience in Chip package interaction and integration
• Strong Project / Program management skills
• Possess sound methodology for organizing work, decision-making and setting priorities
• Strong analytical, problem solving, and organizational skills
• Proficiency in computer applications like Excel, Word, Power Point.
• Self-motivated and team-oriented.
• Strong interpersonal, oral and written communications-skills.

Keen on the role? Apply now!

As a Non-Volatile Memory Quality & Reliability Assurance (NVMQRA) Engineer at Micron Technology, you will be responsible for performing formal Failure Analysis of customer reported failing devices via the Returned Material Authorization (RMA) process. You will be required to summarize lab analysis results at the electrical and physical level to identify root cause and establish an associated containment plan. In this role, you will have the opportunities to collaborate with various engineering and manufacturing stakeholders to evaluate and review Corrective Actions /Preventive Actions. You will provide documentation of the RMA findings and oversee the final customer report till closure. In addition, for the senior role, you will be asked to provide guidance and lead the team when solving complex unplanned deviations reported by our customers. Project management skills are necessary and the ability to make critical decisions that directly translate to quality and timely completion of the project is highly desirable. You will also be required to spearhead the sustaining efforts and keeping up to date on new product knowledge, as well as developing and mentoring new talents.

Responsibilities and Tasks

Perform Failure Analysis of Customer Returns

• Understand customer complaint of the memory component failure
• Initiate communication with Micron Customer-facing team for further details on customer complaint, requesting additional questions to provide best opportunity for successful analysis
• Perform bench level analysis including initial data image analyis/examination
• Perform Automated Test Equipment (ATE) analysis and interpret results
• Work with the appropriate engineering teams (e.g., PE, PYE) to perform detailed fault isolation when electrical failure has been confirmed
• Summarize findings and submit for physical failure analysis (PFA).

Provide FA Reports for Micron Customer Facing Team for Communication to External Customers

• Summarize analysis at electrical and physical level into customer friendly formats.
• Work with the appropriate manufacturing Global Quality teams through the appropriate request systems (example: GPSS) for Root Cause and/or Corrective Action and a containment plan
• Identify potential risk to external customers
• Communicate with respective BU (Business Unit) on potential impact to customers
• Communicate FA updates through interim reports or during scheduled meetings with the customers.
• Provide formal FA Report with findings

Sustain Knowledge of Device Capabilities and Characteristics

• Keep up to date with latest Fab/ASM process technology
• Understand datasheet specifications for each device and the differences from previous technode for NOR * NAND product family
• Comprehension of qualification data and potential impact to customer operation
• Stay up-to-date on common customer applications and usage model
• Partnering with customer support team to resolve ongoing customer issues

Qualifications and Experience

• Excellent verbal and written communication skills in English. The ability to communicate clearly and concisely both verbally and in writing is critical in this role.
• Good organization skills and ability to multitask and coordinate between multiple issue at any given time.
• Ability to work effectively in cross-functional teams and handle pressure situations in a professional manner
• Excellent problem-solving and analytical skills with strong attention to details.
• Familiarity with NexTest /Teradyne bench analytical tools, scripting in linux console will be an added advantage.

Candidates with 2-3 years of experience in the semiconductor industry as Product or QA engineer are preferred. Relevant experienced candidates will be considered for the Senior Role.

Education

A Bachelor or Masters Degree in Electrical Engineering or similar field of study.

Perform diagnostic analysis of the network system, identify possible faulty devices, troubleshoot faulty modules, troubleshoot network problems and outages and prepare necessary documentation detailing actions taken.

-Monitor system performance and track usage and develop and deliver a trend analysis of system load, usage and response.

-Monitor the reachability of all connections within the network adhering to circuit restoral priorities and initiate troubleshooting to restore full network capability.

-Analyze system functions and failures to isolate and define problem areas

Perform diagnostic analysis of the network system, identify possible faulty devices, troubleshoot faulty modules, troubleshoot network problems and outages and prepare necessary documentation detailing actions taken.

-Monitor system performance and track usage and develop and deliver a trend analysis of system load, usage and response.

-Monitor the reachability of all connections within the network adhering to circuit restoral priorities and initiate troubleshooting to restore full network capability.

-Analyze system functions and failures to isolate and define problem areas

Job Description

Program Management and Customer Interface

Act as the main point of contact for Key Account Customer(s), managing all technical communications, status updates, and program-related inquiries.Define project scope, objectives, and success metrics in close collaboration with K&S and align cross-functional teams within Akribis Systems to meet these objectives.Develop, track, and manage detailed project plans, timelines, and milestones, ensuring transparency and accountability throughout the project lifecycle.

New Product Introduction (NPI)

Lead new product introduction projects for K&S, coordinating closely with engineering, production, quality assurance, and supply chain teams to ensure on-time and on-spec delivery.Collaborate with K&S on design specifications and performance requirements, ensuring that Akribis meets the technical and operational needs of the customer.Identify and mitigate project risks, ensuring potential issues are proactively addressed to minimize impact on project timelines and quality.

Engineering Change Management (ECM)

Oversee engineering change management (ECM) processes for Key Account Customer(s)' projects, ensuring all modifications are smoothly integrated and communicated to relevant stakeholders. Coordinate with production, quality, and supply chain teams to ensure seamless implementation of engineering changes and compliance with customer requirements.Document and track engineering changes, ensuring alignment with both Akribis’s standards and Key Account Customer(s)’s requirements.

Technical Alignment and Decision Making

Facilitate technical discussions between Akribis and Key Account Customer(s), ensuring all stakeholders understand project requirements, objectives, and progress.Serve as a technical advisor to internal teams, aligning customer requirements with Akribis’s capabilities and solutions.Drive decision-making processes related to technical aspects, balancing customer requirements with feasibility, cost, and quality.

Continuous Improvement and Process Optimization

Identify areas for process improvement and implement changes to enhance project efficiency, product quality, and cost-effectiveness.Utilize feedback from Key Account Customer(s) and internal stakeholders to continuously refine program processes and customer engagement strategies.Implement metrics to monitor program performance, analyzing data to identify trends, address issues, and support strategic goals.

Documentation and Reporting

Develop and maintain detailed documentation of project plans, schedules, risk assessments, and change orders for full transparency and traceability. Provide regular reports, updates, and technical reviews to Key Account Customer(s) and Akribis leadership, ensuring all parties have a clear understanding of project status.Maintain organized and accessible project documentation to support quality audits, compliance, and future reference.

Qualifications

• Bachelor’s degree in Engineering, Program Management, or a related technical field;
• Master’s degree is preferred.
• Minimum of 5 years in technical program management, project management, or engineering, preferably within semiconductor or precision engineering industries.

Other Information

Skillset(s) Requirement:

Technical Skills:

Strong understanding of project management methodologies (Agile, Waterfall) and proficiency in ERP/PLM systems.Experience managing complex technical programs, including new product introductions and engineering change management.Familiarity with technical drawings, engineering specifications, and quality control standards.

Customer Management Skills:

Demonstrated experience building and managing key customer relationships, with a focus on aligning deliverables to customer expectations.Analytical Skills: Strong problem-solving skills, with the ability to analyze program performance data and drive continuous improvement.

Communication Skills:

Excellent verbal and written communication skills to interact effectively with cross-functional teams and customers.

Organizational Skills:

Strong organizational skills, with a proven ability to prioritize and manage multiple projects simultaneously. Preferred Skills and CompetenciesPMP or Program Management certification is a plus.Experience in Lean, Six Sigma, or other continuous improvement methodologies.Familiarity with the semiconductor industry and engineering change management processes.Proficiency in project management software (e.g., SmartSheet,Microsoft Project, Jira) and ERP systems (e.g., SAP).

Perform diagnostic analysis of the network system, identify possible faulty devices, troubleshoot faulty modules, troubleshoot network problems and outages and prepare necessary documentation detailing actions taken.

-Monitor system performance and track usage and develop and deliver a trend analysis of system load, usage and response.

-Monitor the reachability of all connections within the network adhering to circuit restoral priorities and initiate troubleshooting to restore full network capability.

-Analyze system functions and failures to isolate and define problem areas

Perform diagnostic analysis of the network system, identify possible faulty devices, troubleshoot faulty modules, troubleshoot network problems and outages and prepare necessary documentation detailing actions taken.

-Monitor system performance and track usage and develop and deliver a trend analysis of system load, usage and response.

-Monitor the reachability of all connections within the network adhering to circuit restoral priorities and initiate troubleshooting to restore full network capability.

-Analyze system functions and failures to isolate and define problem areas

Job Responsibilities:

• Over-all project management, which includes planning and implementation of assigned projects

• Planning and monitoring of progress and timely completion of projects which includes preparation of detailed progress and status reports

• Coordination with clients & consultants to ensure smooth communication

• Directly reports to the Project Manager

• Preparation of samples according to the requirements of the project

• Ensuring smooth procurement process and timely deliveries, which includes preparation of status reports

• Coordination of deliveries on site

• Issuance delivery orders

• Attending site meetings for smooth coordination

Requirements:

• Minimum Diploma in Electrical/Electronic/Microelectronic/Mechatronic/Green Building & Sustainable or related engineering diploma.

• Minimum 1 year of experience in engineering field

• Computer knowledge in Auto CAD will be added advantage.

• Ability to plan & monitor project progress to ensure timely completion

• Ability to communicate with clients & consultants · Willingness to learn & improve personal skills through team work

• Knowledge in basic project management e.g. preparing monthly project reports, site planning, monitoring & control processes and project risk analyses.

• Good work ethics and team player

• Knowledge in lighting technology and lighting design or electrical engineering fields

• Able to start work immediately

Advance Packaging Integration – Senior Engineer (Package Development Engineering, Silicon Technology Package Integration) (PDE STPI)

We are looking for a Package Silicon Integrator in Package Development Engineering (PDE) Senior Engineer who will lead and drive Micron’s Packaging Technology Development Projects meeting Time to Market (TTM) business unit needs as well as meeting performance targets for Thermal, Electrical, Mechanical, Reliability and Cost. You will collaborate with Micron’s multi-functional team that include Product Development, Wafer level process, Assembly, Test, Manufacturing and Global Quality. Together, we will be responsible for the designing Test Vehicle Development Strategy, and execution to definition, development, and delivery of state-of-the-art product/packages that will shape the future of advanced computing, automotive and mobile products.

Responsibilities will include, but are not limited to:

• Drive package technology integration activities for the silicon test chip development projects and support NPIs to keep roadmap items on track to meet “go to market” timelines.
• Coordinate core team in Development and NPI space of advanced 2.5D/3D packages and standard packaging to drive material and BOM choices, body sizes, manufacturability, and package constructions to achieve acceptable Design for Manufacturing (DFM) and Design for Reliability (DFR) requirements.
• Evaluate wafer design inclusive of bondpad, scribe, pillars/bump and polyimide, and drive materials and BOM choices such as die thickness and mold compound to meet chip package interaction requirements.
• Drive materials characterization from both package and die components to understand chip package interaction mechanism using TMA, DMA, nanoindentation, and packaging mechanical and thermal stress stimulus.
• Drive novel solutions with silicon design and product teams to recommend the optimum package solutions to meet electrical, mechanical (1st, 2nd, and 3rd level interconnect), thermal, reliability, cost, and other system level requirements.
• Interface closely with multi-functional team that include Product Development, Wafer Level Process, Assembly, Test, Manufacturing and Global Quality and manage the product/package to mass production.

Requirements:

• Bachelor/Masters of Science in physics, materials, mechanical, chemical, or electrical engineering. MS or PhD preferred
• 5+ years of relevant experience in semiconductor manufacturing or a related field, with hands-on experience in semiconductor packaging or Frontend processes, specifically in technology on
• Appreciation for Structured Problem Solving
• Ability to interpret die-, package-, and system-level design and simulation (thermal/mechanical/electrical) methodologies and results
• Knowledge in Chip Package Interaction (CPI)
• Experience and working knowledge with 2.5D/3D heterogeneous integration technologies such as WLFO, SoIC, CoWoS, WoW, InFO, and other chiplet/SiP architectures is a plus
• Experience with wafer bumping, package assembly, substrate technology, BOM selection, testing and product development lifecycle
• Excellent communication skills with the ability to convey complex technical concepts to both technical and non-technical partners
• Demonstrated leadership experience in guiding multi-functional teams and driving technical excellence

Keen on the role? Apply now!

Remuneration: Basic Up to $7,000 + AWS

Job Description:

• Design, configure, deploy, and maintain Wintel and Linux server environments, including Windows Server (2019, 2022) and Linux distributions (RHEL, SUSE). Conduct server hardening
• Lead virtualization initiatives using industry-standard platforms such as VMware vSphere, Hyper-V, or KVM.
• Design and manage Storage Area Networks (SAN/NAS), ensuring data availability, integrity, and optimal performance.
• Ensure compliance with industry standards and regulations related to infrastructure and data storage.
• Implement and administer key management and encryption.
• Implement and administer Active Directory, including user accounts, group policies, security settings, and domain controllers.
• Implement and administer AD Public Key Infrastructure and Network
• Policy Server RADIUS services.
• Implement and administer monitoring solutions such as eG
• Innovations, PRTG, Splunk, or Kiwi Syslog server.
• Implement and administer backup solutions like Veeam or Acronis.
• Implement advanced system monitoring solutions to proactively identify and resolve performance and security issues.
• Investigate and resolve complex technical issues related to Windows Server systems, collaborating with teams and vendors.
• Coordinate with third-party vendors, IT providers, and external support for effective service delivery.

Job Requirements:

• Bachelor's degree in Computer Science, Information Systems, Information Technology, or a related field.
• Minimum of 5 years of experience in IT infrastructure engineering with a focus on Windows Server administration.
• Storage implementation experience with Dell EMC / NetApp
• Experience with Wintel servers (Dell), VMware, Microsoft server products, Symantec
• Proven experience in designing on-prem data centre architectures.
• Proficiency in configuring, managing, and troubleshooting Windows Server environments.
• In-depth knowledge of Active Directory, Group Policies, and security best practices.
• Familiarity with virtualization technologies such as VMware or Hyper-V.
• Experience with scripting and automation tools.
• Relevant certifications (e.g., MCSA, MCSE, VCP) are highly advantageous

Daniel Wilson | Reg No.: R24125247

Recruit Now Singapore Pte Ltd | EA Licence No.: 21C0845

Advance Packaging Integration – Senior Engineer (Package Development Engineering, Silicon Technology Package Integration) (PDE STPI)

We are looking for a Package Silicon Integrator in Package Development Engineering (PDE) Senior Engineer who will lead and drive Micron’s Packaging Technology Development Projects meeting Time to Market (TTM) business unit needs as well as meeting performance targets for Thermal, Electrical, Mechanical, Reliability and Cost. You will collaborate with Micron’s multi-functional team that include Product Development, Wafer level process, Assembly, Test, Manufacturing and Global Quality. Together, we will be responsible for the designing Test Vehicle Development Strategy, and execution to definition, development, and delivery of state-of-the-art product/packages that will shape the future of advanced computing, automotive and mobile products.

Responsibilities will include, but are not limited to:

• Drive package technology integration activities for the silicon test chip development projects and support NPIs to keep roadmap items on track to meet “go to market” timelines.
• Coordinate core team in Development and NPI space of advanced 2.5D/3D packages and standard packaging to drive material and BOM choices, body sizes, manufacturability, and package constructions to achieve acceptable Design for Manufacturing (DFM) and Design for Reliability (DFR) requirements.
• Evaluate wafer design inclusive of bondpad, scribe, pillars/bump and polyimide, and drive materials and BOM choices such as die thickness and mold compound to meet chip package interaction requirements.
• Drive materials characterization from both package and die components to understand chip package interaction mechanism using TMA, DMA, nanoindentation, and packaging mechanical and thermal stress stimulus.
• Drive novel solutions with silicon design and product teams to recommend the optimum package solutions to meet electrical, mechanical (1st, 2nd, and 3rd level interconnect), thermal, reliability, cost, and other system level requirements.
• Interface closely with multi-functional team that include Product Development, Wafer Level Process, Assembly, Test, Manufacturing and Global Quality and manage the product/package to mass production.

Requirements:

• Bachelor/Masters of Science in physics, materials, mechanical, chemical, or electrical engineering. MS or PhD preferred
• 5+ years of relevant experience in semiconductor manufacturing or a related field, with hands-on experience in semiconductor packaging or Frontend processes, specifically in technology on
• Appreciation for Structured Problem Solving
• Ability to interpret die-, package-, and system-level design and simulation (thermal/mechanical/electrical) methodologies and results
• Knowledge in Chip Package Interaction (CPI)
• Experience and working knowledge with 2.5D/3D heterogeneous integration technologies such as WLFO, SoIC, CoWoS, WoW, InFO, and other chiplet/SiP architectures is a plus
• Experience with wafer bumping, package assembly, substrate technology, BOM selection, testing and product development lifecycle
• Excellent communication skills with the ability to convey complex technical concepts to both technical and non-technical partners
• Demonstrated leadership experience in guiding multi-functional teams and driving technical excellence

Keen on the role? Apply now!

Summary:

• Basic up to $3800
• AWS + Variable bonus
• Location: Buona Vista
• 5 days work week @ 8.45am - 5.30pm
• Fresh grad is welcomed to apply

Key Responsibilities:

• Utilise 3D CAD design tools and perform high precision 3D printing (FDM & DLP)
• Utilise basic microcontrollers boards such as Arduino, ESP32 or STM32 to build simple circuit boards
• Testing and assembly of electronics and mechanical parts and debugging of software
• Familiar with maintenance of laboratory inventory and laboratory administrative tasks (Preventive maintenance / safety matters)
• Administrative works, such as ordering and payment with SAP system
• Other relevant ad-hoc duties

Key Requirements:

• Min Nitec in bioengineering, biophysics, physics, mechatronics, electrical / mechanical engineering, computer engineering and etc
• Basic experience in 3D CAD design

Interested applicants, please submit your updated resume in MS Words / PDF format by using the APPLY NOW BUTTON.

By submitting your personal data and/or resume, you give consent to the collection, use, and disclosure of your personal data and/or resume by the company (or its agent) for the purpose of the processing and administration by the company relating to this job application.

Please be informed that only shortlisted candidates will be notified.

Your recruiter for this job: Stella

WhatsApp me @ 8772 4117 for a prompt response to your enquiry!

Stella Aw Yong See Hui | R24121552

Recruit Now Singapore Pte Ltd | EA No: 21C0845

Job Summary:

Drives the design chain value proposition by generating the greatest number of Xilinx design wins in technologies and registrations for customers engaged in Xilinx based product design resulting in growing business. Interface with the engineering departments of customers and suppliers. Performs a variety of product, technical and engineering functions including but not limited to: pre/post sales support, research, design and development.

Principal Responsibilities:

• Work with sales to explore new customer base which use Xilinx products.
• Deliver technical solutions / proposals and provide product presentations to customers.
• Provide technical support to customer which are using Xilinx products from start of development to design win closure.
• Provide technical training to customers
• conduct seminars and workshops
• Willing to travel
• Must be proactive and constantly striving to keep abreast of latest advances in Xilinx technology.

Job Level Specifications:

• Must be highly motivated and able to work independently
• Strong interpersonal and communication skills.
• Good team player
• Good analytic and problem-solving skills
• Integrity & Trust
• Excellent in time management.

Work Experience:

• Minimum 3+ years work experience in Programmable Logic based design / ASIC / Processors / GPU
• Proficient in VHDL/Verilog/C++ programming
• Experience working on AI solutions development using Caffe, Tensorflow, Keras, Pytorch frameworks is a strong plus.
• Experience working on systems in one or more of the following areas is a highly desired: Software Defined Radios, Wireless Communication Systems, Artificial Intelligence,.

Education and Certification(s):

• Bachelor's or Masters Degree in Engineering or equivalent.

Summary:

• Basic up to $6000 (Senior), $5000 (Junior)
• Performance bonus
• Location: AMK / YCK / Central
• 5 days work week
• Familiar with ACMV
• Career advancement & stability

Key Responsibilities:

• Manage and lead the electrical team
• Perform engineering duties: design, engineering calculations, planning, tender and etc
• Perform testing and commissioning of ACMV electrical system
• QA/QC
• Resolve any technical issue during any stage of the project
• Liaise with clients, project manager, contractor and etc
• Ensure the team follows all electrical codes and standards
• Other relevant ad-hoc duties

Key Requirements:

• Min 5 years of relevant experience in Construction Electrical field, including testing and commission
• Familiar with ACMV

Interested applicants, please submit your updated resume in MS Words / PDF format by using the APPLY NOW BUTTON.

By submitting your personal data and/or resume, you give consent to the collection, use, and disclosure of your personal data and/or resume by the company (or its agent) for the purpose of the processing and administration by the company relating to this job application.

Please be informed that only shortlisted candidates will be notified.

Your recruiter for this job: Stella

WhatsApp me @ 8772 4117 for a prompt response to your enquiry!

Stella Aw Yong See Hui | R24121552

Recruit Now Singapore Pte Ltd | EA No: 21C0845

As a Non-Volatile Memory Quality & Reliability Assurance (NVM QRA) Engineer at Micron Technology, you will be responsible for performing formal Failure Analysis of customer reported failing devices via the Returned Material Authorization (RMA) process. You will be required to summarize lab analysis results at the electrical and physical level to identify root cause and establish an associated containment plan. In this role, you will have the opportunities to collaborate with various engineering and manufacturing stakeholders to evaluate and review Corrective Actions /Preventive Actions. You will provide documentation of the RMA findings and oversee the final customer report till closure. In addition, for the senior role, you will be asked to provide guidance and lead the team when solving complex unplanned deviations reported by our customers. Project management skills are necessary and the ability to make critical decisions that directly translate to quality and timely completion of the project is highly desirable. You will also be required to spearhead the sustaining efforts and keeping up to date on new product knowledge, as well as developing and mentoring new talents.

Responsibilities and Tasks

Perform Failure Analysis of Customer Returns

• Understand customer complaint of the memory component failure
• Initiate communication with Micron Customer-facing team for further details on customer complaint, requesting additional questions to provide best opportunity for successful analysis
• Perform bench level analysis including initial data image analysis/examination
• Perform Automated Test Equipment (ATE) analysis and interpret results
• Work with the appropriate engineering teams (e.g., Product Engineering, Product Yield Enhancement) to perform detailed fault isolation when electrical failure has been confirmed
• Summarize findings and submit for physical failure analysis (PFA).

Provide FA Reports for Micron Customer Facing Team for Communication to External Customers

• Summarize analysis at electrical and physical level into customer friendly formats.
• Work with the appropriate manufacturing Global Quality teams through the appropriate request systems for Root Cause and/or Corrective Action and a containment plan
• Identify potential risk to external customers
• Communicate with respective BU (Business Unit) on potential impact to customers
• Communicate FA updates through interim reports or during scheduled meetings with the customers.
• Provide formal FA Report with findings

Sustain Knowledge of Device Capabilities and Characteristics

• Keep up to date with latest Fab/ASM process technology
• Understand datasheet specifications for each device and the differences from previous technode.
• Comprehension of qualification data and potential impact to customer operation
• Stay up-to-date on common customer applications and usage model
• Partnering with customer support team to resolve ongoing customer issues

Qualifications and Experience

• Excellent verbal and written communication skills in English. The ability to communicate clearly and concisely both verbally and in writing is critical in this role.
• Good organization skills and ability to multitask and coordinate between multiple issue at any given time.
• Ability to work effectively in cross-functional teams and handle pressure situations in a professional manner
• Excellent problem-solving and analytical skills with strong attention to details.
• Familiarity with NexTest /Teradyne bench analytical tools, scripting in linux console will be an added advantage.

Candidates with 2-3 years of experience in the semiconductor industry as Product or QA engineer are preferred. Relevant experienced candidates will be considered for the Senior Role.

Education

A Bachelor or Masters Degree in Electrical Engineering or similar field of study.

Key Responsibilities:

• System Development, Implementation and Support
• Evaluate requirements and analyze impact to the application
• Involve in design and development stage
• Involve in application setup and deployment
• Provide guidance towards testing phases
• Provide level 3 production support to relevant open systems applications 
• Coordinate with internal teams and vendors to resolve application and system issues
• Execute tasks related to project / change request / maintenance request

Key Requirements:

• Degree in Computer Science or equivalent
• 5 years of UNIX/LINUX/SQL/Korn Shell programming experience
• Hands-on experience on Oracle database, Webserver such as Apache, Java platform / J2EE and Java web container such as WebLogic, JBoss EAP, Tomcat
• Relevant working experience with good working knowledge in cards, loyalty, remote commerce, portals or digital payment domains.
• A good understanding of API frameworks will also be desired.
• Ability to multi-task and perform well under pressure

- Respond to network appliances connectivity issues and resolve any issues within the confines of the office.

- Collaborate with partners and service vendors to ensure that the proxy, firewalls, and network appliances stay operational.

- Responsible for configuration and maintaining Routers, Switches, Firewalls, Proxy/Web Isolation, Load-Balancer and Security Patches for equipment.

- Troubleshoot, provide resolution and raising tickets when networking equipment face issues.

- Create, maintain, and update documentation as it relates to configuration, process, and service records.

- Monitoring security measures for the protection of computer systems, networks, and information

- Responsible for providing customer support in solving all phases of complex information security related technical problems.

- Reviews and recommends information security solutions to customer problems based on an understanding of products/systems test results.

Key Requirements

- L2: 3 to 5 years’ experience in Network Infra Setup and Operations and at least 3 to 5 full delivery cycle implementations of relevant projects

- Required to work on wee hours, weekends, and public holidays.

- Knowledge of routing, switching, firewall, proxy/web isolation and data center operation.

- Able to work well in a team environment and use tools like Visio and Wireshark.

Responsibilities

●Collaborate with the sales/business development team to understand customer requirements and use cases, and identify how company's Robotics solutions can address those needs.
● Conduct product demonstrations and presentations to potential customers, showcasing the features and benefits of our robotics solutions.
● Develop proof-of-concept capabilities through ad-hoc software development and mechanical/electrical design with the help of internal engineering teams.
● Work closely with customers to understand their specific use cases and provide expert guidance on the integration of our robots into their operations.
● Create technical proposals and documentation tailored to customer requirements.
● Develop a deep understanding of company's Robotics' products and stay up-to-date with the latest advancements in the field.
● Act as a technical liaison between customers and our internal engineering teams, ensuring a smooth transition from presales to implementation.
● Support the sales team by participating in customer meetings, technical discussions, and addressing customer inquiries.
● Provide feedback to our product development team based on customer needs and market trends.
● Excellent presentation and communication skills.
● Ability to understand and address customer requirements and translate them into technical solution

Requirements:

● Degree with a focus on robotics, mechatronics, or related fields. Background in Computer Science/Electrical Engineering/Mechanical Engineering can be considered as well.
● Strong technical knowledge in their domain and the ability to work with customers.
● Should have at least one of the following:
○ Experience in Python or Javascript or C++. (or)
○ Experience in CAD software such as SolidWorks. (or)
○ Experience in mechatronics design such as working with Arduino or custom PCBs.

Plus Qualifications (Good to have)
● Experience with cloud computing platforms (e.g., AWS, Azure, Google Cloud).
● Familiarity with Docker, Jenkins, and other deployment tools.
● Exposure to backend system design to support robotics applications.
● Previous experience in a presales or technical sales role.
● Participation in robotics-related hackathons or competitions.

HOW TO APPLY:

Interested applicants, kindly send your resume in MS WORD format to kenneth(at)trustrecruit.com.sg

We regret only shortlisted candidates will be notified.

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Trust Recruit Pte Ltd

EA License No: 19C9950

EA Personnel: Kenneth Tan Guan Quan

EA Personnel Reg No: R1550240

Key Responsibilities:

• Liaise with Solutions team to understand systems design
• Perform installation, configuration and maintenance of network devices and AD server / management server on-site
• Assist Project Managers and Engineers to prepare systems related diagram for the project implementation
• Ensure systems design conforms to contract and technical requirements
• Engage with back line support and/or with vendor’s support to diagnose and rectify technical problems to effectively resolve project implementation issues
• Attend to preventive and corrective maintenance to backend system
• Ensure all work activities comply with the company’s safe work procedures

Competence (Knowledge, Skills and Abilities):

• Skills in relating to and servicing the customers with a win-win mind set
• Skills in troubleshooting technical problems related to servers, routers, switches, and IoT devices.
• Good knowledge of the security and surveillance solutions landscape and industry trends
• Knowledge on Microsoft Clustering, Active Directory, Agent VI, Milestone, VMware and IT Security is required
• Knowledge of CentOS, Ubuntu, VMware (ESXi), Firewall, Networking, and Windows Server OS
• Proficient in Active Directory, Certificate Services, Virtualization technology, and cyber security is required
• Skills in planning and scheduling
• Professional Certificate in MCSE and CISSP would be an advantage

Requirements:

• Minimum Degree in Computer Engineering or related discipline
• At least 3 years’ experience in a similar capacity
• Experience in installation on Server / Client configuration, Network Storage and IT Network

For personal data protection (PDP) related matters, pls refer to our PDP policy via corporate website at oconnors.co Personal Data Protection Policy.

Epsilon operates a global IP/MPLS network as well as supporting transmission networks. We are seeking a candidate with strong IP/MPLS skills and experience. The candidate would be responsible for ongoing network optimization and technological development for our global IP/MPLS network which support layer2 and layer3 VPN services. The candidate should also express a willingness to participate in projects related to transmission network upgrades and planning exercises.

Responsibilities

• Responsible for the deployment and management of the global MPLS and VPLS (E-Line, E-LAN and IP-VPN) infrastructure.
• Work with solutions design, and technical sales teams to develop complex service solutions for bespoke customer applications.
• Responsible for the deployment and management of the global IP transit, IP peering, and the connection to IXP and CSP.
• Work cross-functionally with product team and project management to generate implementation plans including Method of Procedure (MOP), Bill of Materials (BOM) and Scope of Works (SOW)
• Participate in optical transmission network upgrades and migrations as needed.
• To take up the on-call rotation and out of hours work when required
• Maintain technical and training documentation and develop automation as needed.
• Provide guidance and training to NOC when required

Requirement

• 5+ years of working experience in telecom provider, ISP, CSP or content provider.
• Experience working within a multi-vendor network environment – Juniper, Alcatel-Lucent/Nokia and Cisco are relevant.
• Experience working with network automation tools (Ansible, Python, Jinja, Git) a plus
• Extensive knowledge and experience in Layer 2 switching and Layer 3 routing technologies and protocols including TCP/IP ,OSPF, BGP/MP-BGP, IS-IS, MPLS and RSVP etc.
• Experience working and knowledge in security and firewall.
• Experience working and knowledge in SD-WAN/SASE is a plus
• Knowledge or prior working experience with optical networks is a plus, but willingness to learn and understand the design and operational aspects of transmission technologies is required.
• Demonstrated ability to meet deadlines among multiple concurrent projects
• An enthusiastic and helpful attitude
• Willing to learn new technologies
• Must enjoy working in a fast-paced environment where a strong ability to multi-task is necessary
• Must be highly detail-oriented