Interested applicants are invited to apply directly at the NUS Career Portal

Your application will be processed only if you apply via NUS Career Portal

We regret that only shortlisted candidates will be notified.

Job Description

1. Conduct lab-based research and perform experiments.
2. Collaborate with colleagues both inside/outside the group.
3. Assist in daily lab management duties.
4. Present and report research results and publish scientific results in peer-reviewed journals in a timely manner.
5. Ensure compliance with environment, safety, health and quality program requirements from all levels (e.g. university, faculty of engineering and the department of MSE).
6. Translation and commercialization. Training will be provided

Job Requirements

A bachelor and a master degree in Chemical Engineering, Material Engineering or related field is required. The candidate should have 2-3 years of experiences in doing research.

Job Responsibilities:

• Schematic capture, optimization and simulation.
• Develop efficient circuit designs and digital STD cell library meeting performance, power and area target.
• Study and invent new digital STD cell circuit architecture.
• Work with a layout designer to implement the layout of circuit.

Requirements:

• Bachelor's degree or above in Electronics, Computer Science, or related fields.
• Experience on high performance and low-power analog design.
• Experience on deep sub-micron process technology (12nm and below) taped outs.
• Excellent interpersonal and communication skills.

ROLE:

A*Star-IME is currently working on establishing a hybrid fabrication platform for 150mm and 200mm Silicon Carbide (SiC) power MOSFETs as a new pillar on Singapore"s Future of Microlectronics in wide-bandgap. The main objective of this SiC RnD program is to advance 200mm SiC technologies in various areas, such as epitaxy, device design, process integration & fabrication, and power module packaging. The ultimate aim is to drive disruptive innovations in power device research, specifically focusing on >1.7KV power MOSFETs. These innovations will have significant applications in enhancing automotive technologies, vehicle electrification, safety measures, sustainable energy grids, data centers, and industrial & aerospace automation. Key aspects for this role to be successful include the development and integration of several process modules, such as gate oxidation, implantation, implant activation, layout design verification, lithography, and ohmic contact formation. We are actively looking for individuals with extensive industry experience in device physics and process integration to join our team. The candidate will contribute to process integration, E-test and module process related data analysis, yield enhancement, and device physics.

RESPONSIBILITIES:

• Lead develop process technology for SiC power MOSFETs and ensure it meets the requirements for prototyping manufacturing

• Collaborate with advanced process module development team to establish a process flow for fabricating specific MOS devices

• Responsible to develop and improve test structures that enable fast and rigorous characterization of process

• Accountable to improve device performance and yield through the design, execution, and analysis of experiments for each specific device and product

• Work with cross-functional teams to minimize defects and address technical and yield concerns

• Drive CIP (Continuous improvement plans) to deliver integrated process modules and specific device per project goals

• Make decisions regarding the delivery of process, active and passive devices to multiple customers

REQUIREMENTS:

• MS/PhD Degree in Electrical Engineering or related field

• >3 years industrial experience for MOSFET process integration and device physics

• Proactive, self-motivated, and results-oriented professional with the ability to make efficient contributions to and lead technical discussions

• Extensive expertise in material and process integration

• Comprehensive understanding of semiconductor materials and the physics of MOSFET devices

• Strong communication skills to effectively communicate information about module integration for device fabrication and with customers

• Excellent analytical skills for interpreting process and device data, coupled with strong presentation abilities

Job Description:

• Developing and optimizing thin film processes, such as Physical Vapour Deposition (PVD) and e-Beam Evaporation for Micro-Electro-Mechanical-Systems (MEMS), Wide-Band-Gap (WBG) and Photonics applications.
• Thin film property characterization and process issue troubleshooting.
• Develop film defect reduction and yield improvement strategies.
• Act as a subject matter expert and resource for colleagues in integration teams.
• Work with Fab team in establishing statistical process control for thin film module.
• Generate and present reports to both internal and external customers.

Job Requirements:

• Bachelors/Masters in Materials Science and Engineering, Physics, Electrical Engineering, or closely related fields are welcome to apply.
• 3+ years direct industry experience in PVD and evaporation is preferred.
• Good understanding of thin film deposition techniques, defect reduction methodologies, yield improvement and thin film property characterization is desired.
• Understanding of thin film tool hardware, especially PVD and evaporation, is advantageous.
• Knowledge and prior hands-on experience on basic process characterization techniques such as SEM/TEM, EDX, SIMS, FTIR, XPS, ellipsometry is advantageous.
• Good understanding of thin film deposition techniques, defect reduction methodologies, yield improvement and thin film property characterization is desired.
• Possess good interpersonal and oral/written communication skills, with ability to deliver clear and concise messages to both internal and external stakeholders.

As the Research Engineer (Equipment/Operations), you are directly involved in tool installation activities for semiconductor process tools. You would need to work proactively to coordinate with the contractor on the ground for the execution and take corrective and preventive actions of lessons learned, due diligently to prevent reoccurrence. You are responsible for performing utilities turn-on after installation is completed. You must perform the activities per ASTAR site procedure and safety policies to ensure all tool-install-related activities are completed, meeting safety, quality, schedule and budget requirements. You will also be required to perform other activities such as operations for the different semiconductor modules (Diffusion, Litho, Dry/Wet Etch, Thin Film, Implant, etc).

Responsibilities:

• Coordinate with all tool-install base contractors to execute equipment hookup for new tools, to meet the high-quality standards, dynamic schedule, and forecasted budget.
• Coordinate with the Project owner (NGTC/APM) to facilitate utility release as per the planned schedule and update tool release status timely
• Follow all safety and environmental procedures to ensure compliance with EHS-related regulations, risk assessment, safe work procedures, and permit-to-work system.
• Play an active role in safety, actively participating in safety discussions and safe work practices.
• Establish regular area walks to identify opportunities for improved safety, cleanliness, housekeeping and efficiency
• Establish regular, working interaction with peers as well as vendors in tool installation & facilitation, communicating clearly and respectfully all relevant information.
• Keep the reporting officer informed regarding the progress of assigned work and any abnormalities observed in your area.
• Demonstrate ability to understand drawing and highlighting discrepancies
• Follow area-specific procedures and documentation
• Prioritize work tasks to meet schedule and expectations, minimum guidance
• Perform tool tool-relativities and cleanroom systems troubleshooting during the hookup phase
• To perform equipment trouble-shooting of the equipments in NGTC when the need arises
• To perform utility-on after installation completion and to work closely with LCAM for complete closure
• To perform tests balancing of exhaust for new tools whenever necessary
• To perform measures for tool consumption during the hookup phase and to work closely with LCAM
• Use methods to organize, calculate, and display data accurately for utility and flowrate measurement
• Perform site activities in accordance to the Discipline

Requirements:

• Degree/Diploma in Mechanical/Electrical/Chemical engineering or equivalent
• Semiconductor experience (Equipment & Process)
• Facilities field or Wafer Fab Manufacturing equipment background will be an advantage.
• AutoCAD

As a University of Applied Learning, SIT works closely with industry in our research pursuits. Our research staff will have the opportunity to be equipped with applied research skill sets that are relevant to industry demands while working on research projects in SIT.

The primary responsibility of this role is to deliver on an industry-partnered Ignition research project where you will be part of a collaborative team exploring innovative ways of characterizing the physical and rheological properties of liquid personal care products and understanding the impact of these properties in product design and process development.

Key Responsibilities

• In this role, you will perform shear and extensional rheological characterization of a large variety of liquid personal care products including lotions, topical oils, and more. We will explore innovative and emerging methods of rheological characterization and analyzing rheological data to extract material parameters to build a database of materials. Working with our industrial partner we will establish an understanding of rheological properties that are useful for product formulation and process design related to lab and larger scale extrusion/dispensing applications.More specific responsibilities include:
  • Participate in and manage the research project with Principal Investigator (PI), and the research team members to ensure all project deliverables are met.
  • Undertake development of rheological protocols and characterization of liquid personal care products
  • Formulate model materials with various additives to understand their impact on product rheology
  • Design, execute, and interpret experiments independently and with support from the PI.
  • Prepare and deliver written articles, reports, and presentations for industrial partners and external audiences.
  • Attend and present at regular group meetings to receive feedback on work done and future plans
  • Carry out Risk Assessment, and ensure compliance with Work, Safety and Health Regulations.
  • Coordinate procurement and liaison with vendors/suppliers.
  • Work independently, as well as within a team.

Job Requirements

• Have relevant competence in the areas of rheological characterization and analysis, wet lab work, material formulation
• Have a degree in pharmaceutical engineering, chemical engineering, mechanical engineering, food or materials science/engineering, or a related field. Possessing a Master’s degree will be advantageous.
• Knowledge of any of the following will be advantageous: material dispensing/extrusion processing, material science, textural and sensory analysis

Key Competencies

• Able to build and maintain strong working relationships with people within and external to the university.
• Self-directed learner who believes in continuous learning and development.
• Proficient in communicating via technical writing and presentations.
• Possess strong analytical and critical thinking skills.
• Show strong initiative and take ownership of work.

What you will do

1. DFT architecture exploration & evaluation for next-gen process node & package technology of MediaTek:

• Scan chain insertion & ATPG pattern generation
• Pattern validation through simulation & silicon analysis(pass/fail, shmoo, fail log, etc.)
• Diagnosis to help manufacture process improvement

2. Co-work with SoC architect, RTL designer, physical design engineer, and package engineer to define best architecture for 3D-IC:

• PPA(Performance/Power/Area) impact analysis & mitigation via DFT innovation
• Develop & integrate DFT-related RTL design modules to test chip

What you will bring

1. Master's Degree in EEE/ EE/ CE
2. Expertise in Synopsys and/or Mentor DFT tools, and HDL simulators like Synopsys VCS
3. Fluency in script language including but not limited to TCL/Perl/Python
4. Experience about MBIST with state-of-the-art SRAM structure & EDA tools is big plus
5. Skill for RTL design & integration, and physical failure analysis(PFA) will also be plus
6. Ability to think and work independently with different teams
7. Interest in understanding more details in entire design flow
8. Ability to use English for discussing technical details
9. More than 4-year industrial work experience is preferred

Interested applicants are invited to apply directly at the NUS Career Portal

Your application will be processed only if you apply via NUS Career Portal

We regret that only shortlisted candidates will be notified.

Job Description

The job holders are to work with PI and the research team to process air quality data and study small-scale dispersion of airborne pollutants in urban environment.

Qualifications

One or more of (but not limited to) the following:

• Bachelor Degree in Engineering or relevant field
• Experiences of (small-scale) simulations of air pollutant dispersion, meteorology modelling, data processing
• Demonstrating as a fast learner of conducting literature study and literature summary
• Experiences of handling big data via R, Python, Matlab, etc.
• Experience with UNIX-based operating systems and bash script or similar
• Strong interests in applying machine learning models and applications to atmospheric research
• Proactive in assisting and contributing to quality scientific research publications
• Proficient in technical presentation, slide making, report writing, etc.
• Proven rounded and effective team player with strong initiative and ownership of the research project

Fabrica AI Full time Electrical Engineer - Invention of Automatic Tile Grouting Robots

Fabrica AI is reinventing how robots are developed. Currently novel robots take 5-20 years. We are building a design automation platform to bring it down to a month, and have already demonstrated significant progress by developing tile grouting robots in record time. Robotics simulation and reinforcement learning has been advancing a lot making it 1000x cheaper to train robots compared to 5 years ago, and as Jensen Huang said at Nvidia GTC 2024, "the ChatGPT moment for robotics may be just around the corner." A couple other companies are building on the same paradigm shift but we are the only ones using it to automate hardware design, not just software.

Building robots and a design automation platform together brings great synergy - the platform helps us develop robots faster than anyone else and the robots allow us to gather data and do experiments at scale. Data gathering can be done through partnerships with other robotics companies, but doing experiments is crucial for grounding the platform in reality and ensuring its usefulness. The grouting robots are already deploying daily at construction sites and bringing value to clients. We are currently negotiating sales worth around 500k USD. With manufacturing cost multiple times lower than companies using a traditional robotic arm, our robots have an ROI in weeks. Our robot is also small and simple to use, operating from a single button without the need to upload floorplans or do any complex setup. Soon we would be expanding into other simple and valuable robots for the construction industry.

We’ve raised over 2.5m USD from Hoxton Ventures, Credo Ventures, our Professor from Cambridge University, Woh Hup, and the owner of BHCC (listed construction company). We’ve 2500sqft of space in Singapore where we have over 20 team members, and 1200sqft of space in Czechia where we have our software team.

Jakub Suchanek (CEO) has an engineering degree from the University of Cambridge and experience working on self-driving cars at Wayve and machine learning at Granta Innovation and Wacker. He is a worldwide winner of NASA SpaceApps and has won bronze medals in International Olympiads in Informatics and Physics.

Ronald Luc (CTO) earned a degree in Math and Computer Science from Masaryk University, where he was a teaching assistant, and supervised several deep learning theses. He has years of industry experience in both machine learning and self driving cars. With Jakub he won TechFest Munich, one of the EU’s top hackathons; and represented Czechia at the International Olympiad in Informatics.

Keefe Wayne Teo (COO & CFO), a University of Cambridge engineering graduate, served as president of Hackbridge.io, promoting entrepreneurship in tech. He has 100+ citations in research journals and four papers on sustainable energy. He previously worked at Entrepreneur First and has business development experience from other companies.

Website: https://www.fabrica.ai/ (and various press releases, awards, etc.)
Latest Grouting Robot Demo: https://www.youtube.com/watch?v=AVWjmaMuYM0

Fabricator videos

https://www.youtube.com/watch?v=4aoQ4QaEOPQ

https://www.youtube.com/watch?v=xnENP7zWzEM

https://youtu.be/qXpkFeEidac

https://www.youtube.com/watch?v=5SBiEBLMQ9k

Your role would revolve around real-world industry deployments taking us from a TRL of 7 to 9. You may be remunerated with a combination of salary and share options. The following tracks are available:

Core responsibilities:

• PCB, electronics design
  • Working with both hobbyist and industrial microcontrollers, single board computers, motor drivers etc.
  • Integrating motor systems of different types (DC, BLDC, with encoder feedback…), sensor modules etc.
  • PCB design
• Embedded programming

Possible additional responsibilities:

• Testing our robot on construction sites
• Managing external PCB production
• Harness design
• Overseeing a team doing all the above

Requirements:

• Experience with electronics design and embedded software at at least one industrial level project
• Value the direct impact on the product and proximity to clients at a startup and the growth potential of a startup more than having a stable job at a reputable company
• Willing to work without a very well defined job scope and willing to adapt to changes week on week
• Ability to think of metrics to measure progress and deciding based on back on the envelope calculations
• Keenness to do more than is expected, impact driven, past side projects
• Excited about robotics and similar technical areas and exploring them in work and other projects
• Growth mindset driven

Our development process is very iterative and agile. Thus your role/tasks is/are likely to evolve over time. You would play a significant part in deciding how your work would contribute to our overall goals. If you like this process, you’d be a good fit for us.

Check out the link above for more information, and send your CV to [email protected]

Product area

Whether it is paying online with Autofill, using tap and pay in stores, or using the Google Pay app, the Payments team at Google is focused on making payments simple, seamless, and secure. In addition to consumer payment technologies, the Payments team also powers the money movement between Google and its consumers and businesses.

Job description

Google's software engineers develop the next-generation technologies that change how billions of users connect, explore, and interact with information and one another. Our products need to handle information at massive scale, and extend well beyond web search. We're looking for engineers who bring fresh ideas from all areas, including information retrieval, distributed computing, large-scale system design, networking and data storage, security, artificial intelligence, natural language processing, UI design and mobile; the list goes on and is growing every day. As a software engineer, you will work on a specific project critical to Google’s needs with opportunities to switch teams and projects as you and our fast-paced business grow and evolve. We need our engineers to be versatile, display leadership qualities and be enthusiastic to take on new problems across the full-stack as we continue to push technology forward.

Qualifications

Job responsibilities

• Build out data infrastructure and data pipelines in a secure and privacy compliant manner.
• Work with feature teams to provide reliable data and infrastructure.
• Maintain existing data infrastructure and ensure critical data is available and reliable.

Minimum qualifications

• Bachelor's degree or equivalent practical experience.
• 1 year of experience with software development in one or more programming languages (e.g., Java, C++).

Preferred qualifications

• Experience working with large data and creating and making available data cubes for other teams.
• Experience in optimizing data processing pipelines and data serving.
• Experience with data analysis and visualization tools (e.g., SQL, Colab).

Interested applicants are invited to apply directly at the NUS Career Portal

Your application will be processed only if you apply via NUS Career Portal

We regret that only shortlisted candidates will be notified.

Job Description

The Coastal Protection and Flood Resilience Institute (CFI) Singapore is actively seeking a Research Engineer to contribute to a groundbreaking research project. This research explores the efficacy of integrated nature-based solutions in sediment erosional control and coastal protection. The goal is to develop innovative, physically based models that quantify the protective benefits a vegetation meadow can offer to shorelines.

The Research Engineer will participate in experimental research, with a specific focus on studying sediment flux in hybrid solutions to coastal protection. He/she will lead and execute flume experiments, data analysis and field sampling as well as specific tasks which includes planning and conducting experiments, running laboratory analyses, collection and analysis of data, and performing basic administrative duties.

He/she will work need to work with Assistant Professor Gary Lei from Civil and Environmental Engineering and Dr. Ow Yan Xiang from the Tropical Marine Science Institute (TMSI) at NUS. Ideally, we are interested in candidates with prior experience with laboratory experiments.

Job Requirements

• Possess a bachelor’s degree in environmental engineering /Environmental Science/ Mechanical Engineering, or a closely-related field.
• Priority will be given to applicants who have prior research experience in coastal engineering, aquatic plants science, eco-hydraulics, and/or environmental fluid mechanics.
• Strong verbal and written communication skills.
• Proficient with Microsoft Suite and R, or other equivalent analytic software.
• Open to fixed-term contract.

· Directs and/or coordinates electronic engineering and/or technical personnel in fabrication and design of testing and test control apparatus and equipment, or software and systems testing.
· Directs and coordinates electronic engineering activities concerned with development, procurement, installation, calibration and maintenanceof instruments, equipment and control devices required to test, telemeter and record test data.
· Determines conditions under which tests are to be conducted and sequences and phases of test operations.
· Conduct and support Validation activities on Test System/Equipment and/or process setup.
· Interfaces and confers with scientific, engineering and technical personnel to resolve testing problems such as product or system malfunctions, incomplete test data, data interpretation or coding issues.
· Analyzes and interprets test data and prepares technical reports for use by electronic or software engineering, and management personnel.
· Develops or uses computer software and hardware to conduct tests on electronic products and systems or software.
· Trains and instructs floor support, test technicians and test operators on test hardware and/or software, as well as proper problem solving techniques.
· Resolves test yield problems by performing analysis of root causes, developing and coordinating corrective action measures and monitoring improvements.
· Coordinate equipment/tester maintenance and repair support as required.
· Contribute to the workplace safety and health improvement for the employees, as well as environmental protection, by adhering to the company’s Environmental, Health and Safety policies and procedures, and helping to achieve EHS objectives and targets through participation of EHS programs.
· Participate and adhere to Corporate Social and Environmental Responsibility (CSER) policy, programs and procedures.

Requirement

· Technical knowledge of PCBA and / or System box build
· Able to read and understand 2D drawings, schematics for components
· PC Literate: Word, Excel, Power Point, AutoCAD etc.
· CAD system basics
· Good technical and commercial communication skills. Excellent verbal and written communication skills.
· Ability to work in a customer oriented environment and work well with all internal functional areas, customers and suppliers.
Good team player

As a PDE Central Process Integration Principal Engineer, you will lead the development and integration of assembly and packaging processes for cutting-edge semiconductor products, such as DRAM, NAND, controllers, graphics, 3D-stacked (3DS) technologies, and High Bandwidth Memory (HBM). The ideal candidate will drive innovation in packaging technology and ensure seamless process integration during new product introductions.

This position involves working closely with multi-functional teams to research, design, and implement new packaging solutions while optimizing production yields and ensuring the successful commercialization of next-generation semiconductor technologies.

JOB RESPONSIBILITIES

Promote worldwide synergy

• Improve benchmark performance and efficiency gains through global project management and execution
• Network BKM leveraging and enhancement, business process creation and re-engineering
• Maintain a strong and open relationship with peer group and managers in other functional areas within central team and outside in areas such as Sites, TD, Product Engineering, Global Quality
• Help drive and fix the issue where necessary

Drive FE-AT Integration initiatives

• Business process governance between Fab – Assembly (WSPEC, FE2BE forum, WPSWAT)
• Lead & drive FE-AT excursions
• Yield, DPM related issues that involves both Fab – Assembly

Cross sites benchmark & achieve BIC yield performance

• Lead PI programs, PI Loop taskforce and/or team in network to address yield and quality challenges, optimize process flow

Identify, Propose & Drive new initiatives programs

• Propose & lead strategic programs to shift left/ shorten cycle learning across TN phase (PD, NPI, HVM)
• Process flow simplifications & standardizations
• Cross technology streamline (Process, tools, etc)
• Sites expansions process & qualification requirements
• Drive roadmaps with multi-functional teams (FE, AT Procurement, APTD, APPDE)

JOB QUALIFICATIONS

• Bachelor's degree in Engineering (Electrical, Mechanical, Materials Science, or related field).
• 3+ years of experience in semiconductor packaging technology development, process integration, or new product introduction (NPI)
• Strong background in frontend fabrication processes (FAB)
• Proven experience in data analysis, statistical process control (SPC), and process optimization.
• Strong problem-solving skills, attention to detail, and a proactive approach to technology development.
• Excellent communication and teamwork skills, with the ability to work across departments and with external partners.
• Hands-on experience in the development and implementation of cutting-edge semiconductor packaging technologies.
• Experience leading multi-functional teams in process development, technology transfer, and ramp-up.
• In-depth knowledge of the latest industry standards and trends in semiconductor packaging and assembly.

As a PDE Central Process Integration (PI) Senior Engineer, you will lead the development and integration of assembly and packaging processes for cutting-edge semiconductor products, such as DRAM, NAND, controllers, graphics, 3D-stacked (3DS) technologies, and High Bandwidth Memory (HBM). The ideal candidate will drive innovation in packaging technology and ensure seamless process integration during new product introductions.

This position involves working closely with multi-functional teams to research, design, and implement new packaging solutions while optimizing production yields and ensuring the successful commercialization of next-generation semiconductor technologies.

JOB RESPONSIBILITIES

Promote worldwide alignment

• Improve benchmark performance and efficiency gains through global project management and execution
• Network BKM leveraging and enhancement, business process creation and re-engineering
• Maintain a strong and open relationship with peer group and managers in other functional areas within central team and outside in areas such as Sites, TD, Product Engineering, Global Quality
• Help drive and fix the issue where necessary

Drive FE-AT Integration initiatives

• Business process governance between Fab – Assembly (WSPEC, FE2BE forum, WPSWAT)
• Lead & drive FE-AT excursions
• Yield, DPM related issues that involves both Fab – Assembly

Cross sites benchmark & achieve BIC yield performance

• Lead PI programs, PI Loop taskforce and/or team in network to address yield and quality challenges, optimize process flow

Identify, Propose & Drive new initiatives programs

• Propose & lead strategic programs to shift left/ shorten cycle learning across TN phase (PD, NPI, HVM)
• Process flow simplifications & standardizations
• Cross technology streamline (Process, tools, etc)
• Sites expansions process & qualification requirements
• Drive roadmaps with multi-functional teams (FE, AT Procurement, APTD, APPDE)

Requirements

• Bachelor's degree in Engineering (Electrical, Mechanical, Materials Science, or related field).
• 3+ years of experience in semiconductor packaging technology development, process integration, or new product introduction (NPI)
• Strong background in frontend fabrication processes (FAB)
• Proven experience in data analysis, statistical process control (SPC), and process optimization.
• Strong problem-solving skills, attention to detail, and a proactive approach to technology development.
• Excellent communication and teamwork skills, with the ability to work across departments and with external partners.
• Hands-on experience in the development and implementation of cutting-edge semiconductor packaging technologies.
• Experience leading multi-functional teams in process development, technology transfer, and ramp-up.
• In-depth knowledge of the latest industry standards and trends in semiconductor packaging and assembly.

Keen on the role? Apply now!

What you do

Be part of the team that validates the physical sign-off of our chips, powering the brands we love every year with 2 billion consumer electronic products such as digital TVs, home audio devices, DVD/Blue-ray players, smartphones, tablets, networking and connectivity products, and many more. As a member of the MediaTek Physical Verification Sign-off team, you will be responsible for ensuring the manufacturability and reliability of IC designs through rigorous physical verification processes to enable the success of our chips tape-out. Join us in shaping the future of technology and making a real impact on the world!

• Responsible for assembling of various design system into a full chip.
• Perform design rule checking (DRC) to identify and resolve System-on-chip layout violations and ensure compliance with manufacturing rules and constraints.
• Conduct layout versus schematic (LVS) verification to ensure the accuracy and consistency between full chip layout and schematic of the IC design.
• Execute electrical rule check (ERC) to identify potential electrical issues and ensure the integrity of the design.
• Perform antenna and electrostatic discharge (ESD) checks to prevent potential reliability, latch-up, leakage issues.
• Collaborate with design and layout teams to address and resolve physical design issues and optimize the layout for manufacturability and reliability.
• Contribute to the development and improvement of physical verification methodologies and flows.
• Work closely with process technology teams to understand and address process-related challenges and constraints.
• Participate in tape-out activities and ensure that the physical design meets the required quality and reliability standards for fabrication.

What you bring

• With minimum 8 years of relevant experience.tronic Engineering / Computer Science or equivalent..
• With minimum 8 years of relevant experience
• Solid understanding of physical design concepts, IC manufacturing processes, and semiconductor device physics.
• Proficiency in using physical verification tools such as Calibre, IC Validator, or other industry-standard DRC/LVS tools.
• Experience with scripting languages such as TCL, Perl, or Python for automation and tool customization.
• Strong problem-solving skills and the ability to analyze and debug complex physical design issues.
• Excellent communication and teamwork skills to collaborate effectively with cross-functional teams.
• Familiarity with EDA (Electronic Design Automation) tools and design methodologies is a plus.
• Proficient in UNIX (Linux) platforms.
• Strong communication skills, problem solving and analytical skills.

Location: One North, Singapore

Who We Are

MediaTek Incorporated (TWSE: 2454) is the world’s 5th largest global fabless semiconductor company. Joining MediaTek means becoming part of a team that powers over 2 billion ICs worldwide, enriching and enhancing everyday life. Our chipsets are integral to a wide range of products, from smartphones, mobile devices to home and IoT devices, in entertainment and multimedia products, and provide connectivity and communication solutions that keep people connected with friends and their families with access to online resources. Working at MediaTek offers you the opportunity to contribute to the world through the devices we use in our daily lives – it’s more than just a job, it’s a chance to make a meaningful impact. – Join us now!

Responsibilities

• Support and provide mechanical engineering design
• Handle design works and/or project management relevant to ACMV, Fire Protection, Sanitary and Plumbing.
• Supervise and coach a team of engineers in mechanical services for the project from concept stage, design development, contract documentation, authority submissions, site administration to project completion
• Act as either Project Manager or Team Leader in projects.
• Act as mentor to new employees.
• Provide technical assistance to engineers.
• Advise engineers on the project administration and contractual issues.
• Conduct technical discussion on common design problems with engineers

Requirements

• Recognised Degree in Mechanical Engineering with PEB Singapore
• Candidate must have min 6 years of relevant working experience in design engineering of ACMV / HVAC, Fire Protection and Plumbing services with Engineering Consultancies in Singapore
• Proven track record of working across organization boundaries to define requirements, solve complex problems and drive programs to successful completion
• Good understanding of Singapore Code of Practice and local authority submission process (LTA / PUB / BCA)
• BIM and CAD capabilities (REVIT / Microstation / Autocad) will be added advantage

Job Description:

• Be involved in project plan, Coordination operation
• Attend the project meeting if required
• Day-to-day site operation to ensure works are constructed as per project & safety requirement
• Supervise site works
• Liaise with clients on site works/project
• Other ad hoc duties as assigned
• Initiate and co-ordinate projects according to schedule.
• Assist engineering analysis and attend the site meeting.
• Any other duties as assigned by the project managers.

What you will do

• Develop and review test plans.
• Develop verification environment/testbench in Module/IP/SOC level.
• Develop verification IP and reference model.
• Implement test with randomization based coverage driven verification methodology.
• Implement functional and functional/code coverage closure.
• Hands-on code/debug with UVM, SystemVerilog, Verilog and SystemC.
• Low Power verification.
• Verification automation flow.
  

What you will bring

• Bachelor's/Master's Degree in EEE/Computer/IC design/equivalent.
• With min. 2 years of relevant experience in similar field.
• With IC/ASIC design verification experience on SOC, Ethernet, PCIe, DDR, USB, ARM CPU.
• Strong experience and debugging ability on SystemVerilog/UVM.
• Skilled in Synopsys/Cadence/Mentor Simulator and debugging flow.
• Experience on Low Power and formal verification is a plus.
• Strong in UNIX scripting with Pyhon, Perl, makefile Cshell.
• Fast learner and a good team player.
• Candidates with more years of experience will be considered for a more senior role.

About the team

Our ASIC DV Team focus on developing full and advanced verification methodology IP/SOC. You will have chance to work on challenging projects that attractive and be immersed in leading tech e.g.: WiFi, 5G, AR/VR, AI, Cloud Networking. A comprehensive program for professional development / career growth will be provided to the new joiner and he/she will have chance to learn from the best expert in this area.In MediaTek, we promote diversity and inclusiveness. Passionate talents who love new challenges and keen on learning new technologies, do send us your cv our way today and join our multicultural team that consists of talents from all over the world!

Job Description

• Understanding of Project Specifications, construction drawings and to ensure that all site activities comply with the regulations and client’s requirements
• Monitor site works to ensure the method statements and work procedure are strictly followed.
• Competent in carrying out supervision of structural works by identifying any non-conformity of contractor’s work site
• Ensure the Builder (incl. technical supervisors) executes the work in accordance to Consultant’s instructions
• Check drawings for discrepancies and highlight to Consultant, suggesting possible solutions to prevent delays
• Conduct quality inspections and quality control of materials used for the project
• To ensure proper documentation of site inspection records, safety records and approved /as-built drawings
• Maintaining and updating site records on progress of work, housekeeping and preparing reports
• Verify the contractors’ progress payment, claim in terms of work done and materials/equipment delivered and stored on site
• Witness all the inspection, testing and commissioning sessions performed by the contractors to ensure compliance with designs and specifications
• Report to project QP / Project Consultants Team on quality and progress
• Supervision of demolition of basement/foundation, ERSS construction and all other design works
• To manage & coordinate with the site supervisors (incl. RTO) with respect to C&S engineering works, architectural and M&E engineering works
• Possesses a complete understanding of local requirements, especially to comply with BCA's criteria for build-ability and safety assurance system
• To carry out regular site checks on Builder and ensure compliance on health and work safety in accordance with MOM
• To attend site, progress, variation and coordination meetings.
• Period: 36 months
• Start from: January 2025

Requirements:

• min. Degree in Civil / Structural Engineering or equivalent
• At least 8 years of relevant experience in supervision of commercial buildings
• Resident Engineer Certificate accredited by IES / ACES is a must, candidate without RE certificate need not apply
• Conversant in statutory code and requirements
• Good team player with strong interpersonal and communications skills essential

Please indicate project involved, expected salary and notice period required in CV.

We regret that only short-listed candidates will be notified.

For more posting, please refer to https://www.facebook.com/profile.php?id=61566487478500&mibextid=LQQJ4d

As an NPI Engineer, you will be responsible for overseeing the transition of new products from design to full-scale production. You will work closely with cross-functional teams, including Product Development, Manufacturing, Quality, and Supply Chain, to ensure the smooth introduction of new products while maintaining efficiency, quality, and cost-effectiveness. Your role will be instrumental in implementing new processes, optimizing manufacturing methods, and ensuring product manufacturability.

Key Responsibilities:

• Product Introduction & Process Development: Collaborate with the design and engineering teams to evaluate product designs for manufacturability, scalability, and cost efficiency.
• Cross-Functional Collaboration: Partner with Product Development, Quality Assurance, and Supply Chain to define project requirements and timelines, supporting a seamless transition to manufacturing.
• Production Line Setup: Develop and implement production line processes, workflows, and assembly instructions to achieve quality and production targets.
• Process Validation & Optimization: Conduct process validation tests, analyze data, and implement adjustments to optimize production yields and reduce waste.
• Supplier Management: Work with suppliers to ensure components and materials meet required specifications and quality standards.
• Continuous Improvement: Drive continuous improvement initiatives for production processes, focusing on quality, efficiency, and cost savings.
• Documentation: Develop and maintain technical documentation, including process flow diagrams, PFMEA, work instructions, and BOMs.
• Troubleshooting: Investigate and resolve production issues, providing timely solutions to minimize downtime and production delays.

Qualifications:

• Education: Bachelor’s degree in Mechanical Engineering, Industrial Engineering, or related field.
• Experience: 3+ years of experience in NPI, process engineering, or manufacturing engineering, ideally within precision engineering.
• Technical Skills: Strong understanding of production process development, validation, and troubleshooting. Experience with lean manufacturing principles and Six Sigma is a plus.
• Communication Skills: Ability to work cross-functionally and communicate complex technical information effectively.
• Analytical Skills: Proven ability to analyze data, identify trends, and make recommendations for process improvements.

Job description

• Design, develop, test, deploy, maintain and improve of software application

• Documentation of software design and description required in a software process life cycle

• Create and maintain documentation for software installations, changes and upgrades

• Involve in the setup and deployment of software for developmental, testing and operational use

• Manage individual project priorities, deadlines and deliverables

• Evaluate system architecture and make recommendations as required

• Perform peer-to-peer code reviews

Requirement

• Proficient in C, C#, NodeJS, Augular or ReactJS

• Familiar with working in Windows environment

• Good knowledge in Javascript / RESTful API / HTML5 / CSS3 / Typescript will be added advantage

• Good knowledge in SQL / NoSQL databases would be added advantage

• Good knowledge in Network Communication and configuration would be added advantage

• Team player with good interpersonal, written and verbal communication skills

Job Description:

• Perform electrical and mechanical assembly work for the semiconductor industry.
• Perform equipment assembly according to engineering drawings.
• Perform installation, repair, inspection, reassembly, refitting, and adjusting products as required.
• Coordinate M&E engineering work and work closely with other department staff to resolve site discrepancies and technical issues.
• Maintain work area clean, safe, and orderly.
• Perform repair pipe and plumbing if needed.
• Planning / Scheduling and coordination of M&E works.
• Oversee and ensure works are carried out by the approved drawings, materials, and method statements.
• Liaise with clients, consultants, relevant authorities, and sub-contractors on M&E issues.
• Update maintenance daily schedule.
• Any other duties as may be assigned.

Job Requirements:

• Minimum 3 years of relevant experience in the Construction industry.
• Diploma/ Degree in Mechanical & Electrical Engineering or related fields.
• Strong building and M&E knowledge with hands-on experiences.
• Positive attitude, willingness to learn, and good team player.
• Entry-level candidates are welcome to apply.

Others:

• Working hours: Monday to Friday - 8:30 am to 5:30 pm
• Saturday - 8:30 am to 12:00 pm
• Salary range: $2500 - $5000 (Price Negotiation)
  

Job requirement:

• Degree in Mechanical or Electrical Engineering.
• Must have at least 3 years of related experience.
• Proficient in Microsoft Office and AutoCAD.

Responsibilities:

• Responsible for all on-site technical and engineering matters.
• Determines project schedule by monitoring project progress, coordinating activities, resolving site problems.
• Prepares project status reports.
• Coordinates structural details and design features within the project.
• Flexible and able to work well in a fast-paced environment.
• Ensure works carried out meet Company's quality standard and contractual requirements.

• Software Development, Implementation and Deployment in the area of industrial automation systems, with Human Machine Interface (HMI), including but not limited to the following sub-systems: Motion Control System, Vision System, Digital and Analog Input/output Control, Device control and Database.
• Work with customer and application team to configure, install and test new equipment.
• Provide software user training to customers
• Field service support, field deployment and on-site / remote debugging
• Overseas travel is required with short notice period.

Qualifications

• Candidate must possess at least Bachelor's Degree and/or equivalent, preferrably in Electrical / Computer Engineering and/or any other relevant course of study.
• Preferably with [1 - 3] Year(s) of working experience in Engineering in automation and/or any other related field/industry is required for this position.
• Fresh graduates with relevant knowledge in their course of study are welcome to apply.

Other Information

Skillset(s) Requirement:

• Required Knowledge: Sofware development
• Required Skill(s): C#, C++, VB.NET, WPF, Winform, MFC, MySQL Database
• Preferably Entry / Junior specialized in [Engineering] - [expertise, Electrical / Mechatronics / Computer Engineering] or equivalent.

Attributes:

• Can do attitude
• Adaptable to a fast-paced environment
• Able to work independently
• Good team player
• Highly logical

• Provide engineering support to various telecommunication equipment installations, testing, patching, and migration.
• Responsible for implementing Outside Plant Cable Networks, such as RF cable, structured cable, Fiber optic cable installation, and testing.
• Responsible for fixing and troubleshooting ADSL Modem, CISCO Routers, and wireless APsPerf
• Perform fault diagnosis, analysis & rectification of LAN, WAN, and Telephone issues
• Perform site acquisition, site survey, acceptance test plan(ATP), and network planning of new sites to roll out and reconfiguration of sites
• Provide engineering support activities either remotely, or on-site.
• Rotational 24x7 standby duties required