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Jobs in Singapore   »   Jobs in Singapore   »   Engineering Job   »   Engineering Assistant (Wire Bond process / NPI|Tampines)
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Engineering Assistant (Wire Bond process / NPI|Tampines)

Gmp Technologies (s) Pte Ltd

Responsibilities:

  • Assist Engineers in establishing engineering specifications and production processes that meets technical, functional, and quality specifications.
  • Coordinate product development, documentation, and failure analysis.
  • Participate in new product design, function, material, and quality specification development phase.
  • Preparation and creation of ABD.
  • Periodic and constantly updating engineering records such as Change Requests, Qualification plans, ERFs, and Qualification reports status.
  • Create and update Qualification reports and approval of the reports.
  • Co‐ordinate with vendors on product reliability tests.
  • Prepare status reports on projects for management review.
  • Comply with all Quality, Environmental, Health, Safety and Security policies and procedures of the Company.

Requirements:

  • Higher NITEC/Diploma in any Engineering discipline with 1 year of experience in the Backend Semiconductor Industry.
  • Basic knowledge in AutoCAD drawings.
  • Team player with strong analytical, communication, and interpersonal skills.
  • Able to work in a fast pace environment and handle tight deadlines.


To apply, please click "Apply Now" or visit www.gmprecruit.com and search for job reference: 22368


GMP Technologies (S) Pte Ltd | EA Licence 11C3793 | EA Personnel: Novita Widjaja | Registration No: R22105960

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