R&D Manager
Backend semiconductor
Responsibilities:
- Identify new packaging technologies through customer meetings, supplier meetings, and technical conferences in SEA.
- Work with the relevant organizations such as R&D, BU, TPM, Account teams, etc. to collect and consolidate necessary information, and deploy the final roadmap to the Company WW twice a year.
- Present and promote the Company’s leading-edge technologies to local customers.
Requirements:
- Bachelor/Master’s Degree in Engineering
- Minimum of 8 years of working experience in semiconductor packaging industry
- In-depth knowledge on a wide range of packaging technologies such as WB, FC, WLCSP, WLFO, SiP
- Sufficient familiarity with package design, process, material, reliability, and quality
- Knowledge on relevant technologies preferred – semiconductor design, fabrication process, testing, etc.
- Effective and strong communication and presentation skills to manage and influence various stakeholders
- Understanding of multinational culture and interpersonal skills to work with R&D teams located in Asia
- Able to travel around 20%
Interested applicants, please kindly email your update resume to [email protected]. We regret to inform that only shortlisted candidates will be notified.
