As a GQ (Global Quality) Package Reliability Process Engineer, you will be responsible to setup new product package reliability requirement. This includes board level reliability to emulate customer PCB design. As process engineer, you are required to ensure the process control during package reliability and establish procedures to the operation team for execution. Process improvement is also required to ensure cost and productivity gain.
Coordinating with various functional parties and ensuring the reliability process is compliance to industrial standards such like JEDEC and this will not limit to Micron specification. Additionally, you will respond to inquiries from internal and external customers as a subject matter expert for package reliability activities.
Responsibilities and Tasks
Package Reliability Process Development
- To work with engineering team for enablement of new product (NPI)
- Ensure hardware readiness for package reliability process like Temperature Cycling, HAST, HTS and etc.
- Modify and improve reliability process for existing products
Evaluate and Improve Processes, Materials, and/or Equipment
- Identify, investigate, and document process deviations.
- Troubleshoot process deviations using systematic troubleshooting techniques.
- Perform risk assessment at all decision points within the qualification cycle
- Develop Process Reliability Methodology and Qualification
Lead development/improvement of Process, Equipment and/or Material
- Establish engineering evaluation (DOE)
- Identify factors that impact process quality and propose solutions
- Identify and evaluate interactions between equipment, processes and resolve potential issues
- Identify and implement equipment process control methods
- Develop process limits and capabilities (CpK) and lead process improvement
Introduction of New Process and Process Changes to Operation
- Implement new standard to align with changes of industrial standard for reliability process procedure.
- Conduct training/briefing for operation team on operation procedures
- Develop process reliability tests to assess new process failure mechanisms
- Ensure that test methodology follows industry standards, such as the Joint Electron Devices Engineering Council (JEDEC)
- Define process sampling plan and instruction.
- Strong trouble shooting skill using 8D
- Analyze and report results
- Analyze failures and coordinate failure analysis
- Develop process monitor plan
- Support Excursion Material Disposition
Establish documentation and procedure
- To establish document for new process and revise existing procedure whenever applicable.
- To ensure compliance to internal and external audit
- Observe all established EHSS policies, requirements, and procedures
- Follow EHSS guidelines included in work instruction
Education
Required
Bachelors Degree or equivalent experience
Engineering – Electronics/Electrical
Engineering - Materials Science
Engineering - Mechanical
Related field of study
Experience
Required
- Fresh graduates are welcome.
Familiarity with basic semiconductor processing, device physics, quality, and reliability fundamentals
The high degree of self-initiative and ability to think and act independently
Good multi-tasking and problem-solving skills
The ability to work under tight timeframes and prioritize competing activities
Excellent organizational and management skills and outstanding interpersonal and teamwork skills
The proven ability to collaborate well with team members and drive for results
Strong verbal and written communication skills
The ability to collaborate with cross-functional teams to understand needs and translate them into actionable plans, deliverables, and resource requirements
The ability to effectively interact with a wide range of personalities
The ability and willingness to travel when required.
