Key Job Accountabilities (Actual daily deliverables):
- Oversee the performance of new Process/Product qualification and robustness of Product quality and reliability performance by means of failure analysis.
- Liaise with customers & potential customers on development & improvement of process, material and equipment capabilities.
- Manage new product development by means of product design optimization and reliability assessment.
- Assess process capability for each CTQ for LVM lots and explore opportunity for improvement in quality/cycle time/yield and cost before product HVM phase transfer.
- Monitor and validate effectiveness of action plan for CTQ enhancement.
- Maintain database for new Process/Process qualification [eAPQP system, Qual/LVM/HVM Automation Report system].
Required Experience and Qualifications :
- Requires minimum Degree in Chemistry, Material Science, Mechanical/Chemical/Electrical Engineering.
- Relevant experience in wafer bumping or wafer fabrication will be an advantage.
