Duties & Responsibilities:
1.1 Responsible for manufacturing process at Lamination and UV Exposure for lead frame at PES.
1.2 To resolve all daily process and products’ quality issue.
1.3 Responsible for Yield, Capacity, Cycle Time and Capability improvement programs to achieve cost reduction.
1.4 Perform 5W1H methodology to determine root cause and implement improvement actions on daily production lot rejects.
1.5 Perform evaluation to optimize and improve manufacturing process capability and yield.
1.6 Qualify new materials; processes, equipment and system.
1.7 Establish and generate the process control, process FMEA and operation work Instruction documentation.
1.8 Perform SPC review.
1.9 Perform other duties that may be assigned by the superior from time to time
Qualification :
Bachelor Degree in Engineering (Mechanical, Electronics or Manufacturing)
Job Requirements :
Knowledge in copper etching process and photosensitive film imaging processes. Experience in lead-frame or PCB etching manufacturing processes. Skillful in problem solving techniques using statistical tools and data analysis. Familiar with Microsoft Office software and project management skill. Must have basic knowledge in Design of Experiment (DOE), SPC and other quality tools. Fresh grads are welcome. 2-3 years of experience in Leadframe manufacturing environment would be an advantage
