· Participation in the development of hardware and software modules of "Die Bonder equipment for the semiconductor industry (analysis, modelling, calculation, measurement, qualification)
· Definition of hardware and software requirements for an interdisciplinary development team (mechanics, electronics, software, motion control)
· Conduct and analyze experiments in order to identify suitable system parameters and machine production sequences
· Optimization of the Die Bonder system with the focus on accuracy, stability and productivity
· Development of "Die Bonding" process technologies according to current or future customer requirements (analysis, modelling, calculation, measurement)
· Customer Support
· Support internal and external customers (occasional business travel)
· Support product management on customer projects
· Support manufacturing engineering on assembly and supplier issues
· Knowledge Management
· Interpretation, documentation and presentation of new results
Education
· Technical education at university. Ideally microsystem technology, mechanical, electrical or mechatronic.
Experience
· Work experience in semiconductor or mechanical/electrical engineering or in a related field is advantageous.
Expertise
· (Business knowledge, languages, MS-Office, etc.)
· Expertise in mathematics, mechatronic or material science
· Flair for practical work in the lab and with experience with measurement equipment
· Microsoft office and programming knowledge
Personal Compentences
· (Social skills, management experience or strategic awareness, etc.)
· Capacity for teamwork as well as initiative and personal responsibility
· Innovative, systematic and solution-oriented work approach
· Ability to present complex topics in appropriate ways for specific audiences
