Responsibilities:
- Perform on-site installation, commission, maintenance, troubleshoot, and repair of customer’s semiconductor manufacturing equipment.
- Provide training to customers on the use and maintenance of the equipment.
- Coordinate and communicate the status of assigned jobs to internal and external stakeholders.
- Prepare field service reports on customer support activity and supports the preparation of quotation (services, parts, upgrade and retrofit packages and etc).
- Support pre-sales activities.
- Promote maintenance contract, machine enhancements and value-added services.
Requirements:
- At least a NITEC, diploma, degree or related certification in engineering.
- At least 2 years of relevant working experience with semiconductor or PCB assembly equipment.
- Experience with front-end wafer fab or semiconductor back-end packaging manufacturing equipment. Knowledge of tape lamination, tape removal, wafer mounting, wafer grinding, wafer dicing, wafer inspection or chemical processing systems would added advantage.
- Ability to travel overseas on short notice.
- Opportunities for overseas training.
- Good interpersonal, communication, and negotiation skills in understanding customer needs.
- Shows initiative and is a lifelong learner.
- Can work independently and yet is a strong team player.
