Job description:
In your new role you will:
- Technical Lead for Package Technology specific to Package Platform(Power DSO).
- Lead and define definition activities (Design rule, DFMEA, Delta assessment, Cost) for new package projects.
- Coach package design engineers in technical packaging design activities such has generating conceptual drawings, definition of package parameters affecting Assembly processes.
- Act as a technical expert in package reliability know how during definition stage, know how on influences of package design towards customer reliability.
- Key contact partner for package definition to Business Division in Europe especially on Back-End Assembly technologies.
- Actively contribute technical competence to Infineon by publishing technical papers/ journals within Infineon network and contribution towards international community in Asia.
Your profile:
You are best equipped for this task if you have:
- PhD / Masters / Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics)
- Minimum 6 years’ experience in Semiconductor Back-End Assembly Development (R&D) experience.
- Experience in Isolated Gate Driver, Current Sensing and Power Package Design is preferred.
- Knowledge in System-in-Package integration and Product System/Application understanding is an added advantage.
- Proficient in Mold flow, Thermo-mechanical, Thermal and Electrical Simulation Interpretation (e.g. Ansys).
- Proficient in AutoCAD and Inventor 3D drafting preferred.
- Able to demonstrate creative thinking in problem solving and generate ideas (IP).
- Good communication and presentation skills.
