Reports to : Director, Business Operations
Must-Have knowlegde on Substrate - fcCSP or fcBGA
Overall Job Objectives
This role is to support global business processes across sales, factories and business unit organizations.
We are looking for a resourceful candidate with a strong analytical capability, and able to utilize various systems for data evaluation. This position is based at our Regional Singapore office.
Core Responsibilities
- Build up cost models to provide package cost estimates and manufacturing readiness inputs to business unit, engineering and factory
- Support critical meetings with internal cross functional teams on product / package costing
- Develop relationships with factory, sales and business units to ensure alignment with industry and customer trends
- Responsible for production pricing maintenance duties, including approving pricing issues in SAP
- Assist global sales take-or-pay coordination and reconciliation
- Adhoc analysis of various revenue related items
Job Specifications
- BS degree in Engineering.
- Minimum 3 years of relevant experience in semiconductor industry.
- Direct experience and/or strong familiarity with semiconductor FlipChip opportunities is a plus.
- Demonstrated understanding of manufacturing processes and raw materials.
- Advanced Excel usage and large data set manipulations.
- Strategic thinker with a proven ability to translate technical requirements/issues into the business context or vice versa.
- Able to work independently and to multi-task, excellent communication and presentation skills and working across functional groups as well as cross-culturally.
Interested applicants, please kindly email your update resume to [email protected]. We regret to inform that only shortlisted candidates will be notified.
