Overall Job Objectives
This role is to support global business processes across sales, factories and business unit organizations, with a focus on assembly pricing activities.
We are looking for a resourceful teamplayer who is adept at utilizing and integrating data from multiple systems to put together pricing proposals. The candidate should be highly adaptable to changing business needs and possess strong analytical skills.
Core Responsibilities
· Key focus on pricing and costing activities for assembly packaging for Memory, MEMs and sensors market.
· Responsible on cost models preparation to provide cost estimates and manufacturing readiness inputs to business
unit, engineering and factory.
· Respond timely to relevant pricing requests in RFQ systems through price benchmarking and profitability analysis.
· Responsible for daily production price maintenance duties, and approving pricing issues in SAP.
· Oversee RFQ trend, win/loss effectiveness and RFQ cycle time efficiency.
· Support critical meetings with internal cross functional teams on product costing.
· Partner with business units, factories, and sales to assure integrated and profit maximizing approach.
· Adhoc analysis of various revenue related items.
Job Specifications (Qualifications/Experience/Skills & Knowledge/Personal Qualities)
· BS degree in Engineering.
· Minimum 10 years of relevant experience in semiconductor industry.
· Demonstrated understanding of semiconductor substrate design.
· Knowledge in assembly packaging processes will be preferred.
· Familarity with SAP system.
· Advanced Excel skills and ability to manipulate large data set is a must.
· Strategic thinker with a proven ability to translate technical requirements/issues into the business context or
vice versa.
· Excellent communication and presentation skills, both verbal and written.
· Independent, able to multi-task, and collaborate with cross functional and cultural groups.
