Job Description:
Responsible for substrate technology roadmap development and substrate technology integration with a focus towards Package Technology Development, Advanced Package Technology, and Package NPI execution. The engineering position works closely with Substrate Suppliers, Assembly Technology Development, and Assembly NPI teams to develop Micron's specifications ensuring a successful launch of new substrate technology. The Substrate Team resides in the Global Design Simulation and Substrate (GDSS) group of the Package Development Engineering organization that is responsible for the design, development, and assembly of Micron's product portfolio; MCP, UFS, SSD BGA, NAND, DRAM, GDDR, LPDDR, and ASIC products. This position will be based in Singapore with primary support to NPI's launched in Singapore, Malaysia, and India.
Candidate must have extensive experience in substrate development and substrate fabrication processes with a working knowledge of packaging assembly and technology, and finally proven customer support skillset. This position requires global support resulting in work hours that support Asia time zone and reports to leadership in the US.
Qualifications:
- The applicant should have a Bachelor of Science degree or higher in Material Engineering, Mechanical Engineering, Chemical Engineering, Electrical or Electronics Engineering or related field with 15+ years of relevant experience.
- Strong influencing and stakeholder management skills - excellent executive communication skills
- Solid track record of collaboration and building and strengthening partnerships
- Excellent analytical and problem-solving skills with the ability to lead and work effectively with a team
- Good english communication skills are required
