Responsibilities:
- Responsible for Production Planning/ Scheduling/ prioritizing in Wafer Bumping
- Responsible for recovery planning to mitigate impact of line performance issue to customer
- Monitor forecasted plan, track and report on machine utilization and performance and drive operations to meet output and shipments and revenue to ensure timely delivery to customers and meet KPI such as cycle time and on time delivery
- Provides input to Customer Service department in term of forecast loading, revenue attainment, shipment and performance
- Collaborate with cross functional teams to ensure that customer requirements can be met for current and future demand
- Responsible for documentation of Processes and Procedure for continuity and training purposes
- Continuous Improvement and Innovation
- Address issues and exercise judgement within broadly defined practices and approaches to solve complex problems on production performance, outputs and requirement
- Participate in all continuous improvement and/or automation projects to fully optimize the manufacturing process, improving CT, improving flow and cost effectiveness
- Responsible to improve the planning processes in Bumping
Requirements:
- Degree in any discipline
- Minimum 3 - 5 years of relevant experience in planning, preferably in semiconductor industry
- Good leadership, communication and interpersonal skills
- Able to work in a dynamic and fast moving environment
