-This position is based at ST TPY Plant.-
If you have experience in these areas and are looking for an exciting opportunity to join a dynamic team, please apply today.
Responsibilities:
- A skilled engineer to perform thermo-mechanical simulations for IC package development in the early design stage, with a focus on DFR/DFM/DFT.
- The ideal candidate will be able to conduct virtual DOE for package design optimization, material selection, and DFMEA.
- Additionally, the engineer will be responsible for creating virtual design guidelines for various package platforms and guiding test vehicle development to improve simulation correlation to empirical data and failure mechanism life prediction.
- Coordination with suppliers, external/internal customers, and suppliers for material characterization will also be required.
Requirements:
- A highly qualified engineer with a Bachelor's/Master's degree or PhD in Mechanical/Material Engineering, Physics, or a related discipline.
- The ideal candidate will have a minimum of 5 years of experience in thermal mechanical modeling for IC package development, with a good knowledge of FEA modeling and simulation.
- Hands-on experience with software such as Ansys, Abaqus, etc. is required.
- The engineer should have a good understanding of semiconductor packaging assembly processes, materials, and technology.
- Able to work in a team environment and interact with other engineers to define and implement numerical and lab experiments for feasibility and validation of concepts and solutions to support new package technology development.
- Experience with 3D CAD models is an added advantage.
