Job Responsibilities:
- Responsible for technical support in Ceramic Substrate, Bonding Wire & Solder paste product (for SMT & SiP module) for APAC customers focusing on customers in Vietnam.
- This includes technical training and managing technical issues for customer projects.
- Acts as a Project Leader for customer-specific projects & solutions
- Support product marketing and R&D in specifying, characterizing and launching of new product
- Support complaint resolution process at customer site by communication of 8D reports
- Provide technical support for customers in a pre-sales through post-sales phase
- Collaborate with Sales account managers in new business development
- Support customers in Ceramic Substrate Quality issues management (for power module), Wire Bonding & SMT Process optimization for SiP and Semiconductor products
- Data collection, analysis and propose solutions and improvements for enhancing robustness of Heraeus Ceramic Substrate, Wire Bond and SMT processes
- Provide technical consultation and guidance to customers on the application of Heraeus Ceramic Substrate, bonding wires and solder pastes for customers’ product
- Provide on-site customer support for problem solving and analysis
- Frequency of travelling : 70%
Job Requirement :
- Bachelor’s Degree in Material/Mechanical Engineering or equivalent practical experience, Master’s degree will have an advantage
- At least 5 years of experience in power module assembly, wire bonding process and/or Solder paste/SMT process. Experience in power module or SiP package is preferred
- Strong skill sets in Technical Problem Solving, Design of Experiments (DOE) and knowledge on use of software like Minitab or JMP
- Good communication and presentation skill and able to converse in English
