You will collaborate with various functional teams such as silicon wafer design, package design, wafer fab to meet project requirements. You will drive the technology development through multiple phases of product maturity and contribute to Micron's strategic objectives of Technology leadership.
- Work with package design and development teams to complete chip package interaction risk assessment.
- Work with scribe designers and assembly engineers to find solutions for dicing problems and implement relevant design rules and design FMEA.
- Collaborate with R&D/manufacturing wafer fabs and packaging teams to solve relevant issues, and improve yield, quality and manufacturability.
- Contribute to development of new silicon and package technologies by engaging with Micron’s internal factories.
- Define test vehicles, plan DOEs, characterize enabling technologies, document best-known-process and hand-off to manufacturing.
- Identify technology, quality and business process gaps and develop and deploy needed solutions.
- Be the contact window to the Si design, scribe design and wafer fab regarding the progress of key projects.
- Demonstrate project management experience through academic projects.
- Possess sound methodology for organizing work, decision-making and setting priorities
- Knowledge of semiconductor fabrication or CMOS device is preferred.
- Knowledge in PFMEA, DFMEA, DOE, Fish-Bone Analysis is preferred.
- Strong analytical, problem solving, and organizational skills
- Proficiency in computer applications like Excel, Word, Power Point.
- Self-motivated and team-oriented.
- Strong interpersonal, oral and written English communications-skills.
