Job Description:
Candidate will be part of Far-Backend Of Line (Far-BEOL) team of process module engineers, advancing specialty microelectronics technologies at IME. His or her main roles and responsibilities include:
- Develop and support bonding process capabilities, including vacuum bonding, metal-metal bonding, fusion bonding, hybrid bonding, and temporary bonding for MEMS, silicon photonics, and advanced packaging applications.
- Deliver innovations involving process methodologies, materials, or approach, and generate intellectual property related to various aspects of wafer-to-wafer and die-to-wafer bonding.
- Participate in discussions with industry partners to align and develop the building blocks required for next generation advanced packaging platforms, including equipment capabilities.
- Participate as team member with process integration teams to actively support bonding process optimization and process troubleshooting for various industry and grant projects.
- Support preparation of competitive grant research project proposals and execution of these projects.
- File patents/know-hows on new development activities.
- Publish research findings in prestigious journals and conferences.
Job Requirement:
- PhD with specialization in Electronic / Microelectronics / Material Engineering / Material Science/ Chemistry / Physics or equivalent.
- 10 years of experience in wafer bonding technologies, either in an academic or industrial setting.
- Prior hands-on experience in wafer bonding with in-depth technical knowledge in atleast one or more bonding processes and mechanisms (vacuum bonding, metal-metal bonding, fusion bonding, hybrid bonding, temporary bonding) is required.
- Knowledge of MEMS, silicon photonics, or advanced packaging technology platforms is preferred.
- Strong experimental design (DOE) and data analysis skills is preferred
- Good interpersonal skills and strong demonstrated skills in collaborating with internal and external stakeholders.
- At least 2 years of demonstrated experience in managing projects of moderate complexity is preferred
- Good oral and written communication skills, with ability to deliver clear and concise messages to both internal and external stakeholders.
- Self-driven with strong interest in next-generation applications of wafer bonding technologies and industry trends.
