As an Operation Central Team (OCT) CPEE ADT team member, you will be responsible in defining alignment and projects to meet goals for NPI nodes, collaborating with multi-functional teams across the globe related to Metals/Implant category – Metal thin film processes such as (not limited to) diffusion, physical vapor deposition and chemical vapor deposition and/or Implant processes. Collaborate with Technology Development and site Alpha technology Process and HVM team to improve Fab processes and equipment to meet technology node targets – such as yield ramp, cost goals, quality. Build strong relationship with internal and external stake holders to align on best practices and develop projects. Support implementation of continuous improvement efforts through process optimization, equipment performance, BKMs.
Responsibilities and Tasks:
As a process expert in Metals Process, create innovative process and equipment solutions to meet the needs of the technology as well as collaborate and develop on ideas originating form process development teams in Boise/ Japan/ Taiwan and Singapore
- Partner with Technology Development and Manufacturing fab for effective transfer, pilot ramp and ongoing development to achieve TECHNODE gate criteria. Play an active role in keeping priorities aligned with peers in TD and manufacturing fab
- Engage with Technology Development and High-Volume manufacturing and lead worldwide alignment efforts across technology to improve module effectiveness.
- Equipment Technology development – partner with TD/Fab/ Suppliers to develop and accelerate FOAK hardware maturity in support of TTMCY and product ramp goals to deliver benchmark equipment performance.
- Participate with Boise/Japan TD peers on equipment technology choices for upcoming nodes and have the ability to drive competitive pricing, machine matching and equipment technology roadmaps.
- Play an active consultant role on MOR, BAP, Doc2 related topics and new tool evaluation proposals.
- Engage with suppliers to develop the process and equipment needed to meet Micron’s technology roadmap.
Maximizes yield by working on tools, the process, or wafer fabrication recipes. Troubleshoots wafer fabrication problems and performs root cause analysis. Works with other process areas to understand and control process deviations. Long-term investigation of defect issues may require extensive work with shift engineering and other functional areas. Evaluates products to ensure they meet the required design and performance specifications. Conducts research to assess process adjustment requirements and recommends process improvements or equipment changes needed to efficiently manufacture new product or part types.
