THE ROLE:
The candidate is required to drive end-to-end board-level and silicon physical failure analysis and develop new FA techniques to enhance productivity rates.
THE PERSON:
You will have strong written and verbal communication skills and a systematic approach to your job. A team player, you are used to delivering results in a fast-paced environment.
KEY RESPONSIBILITIES:
- End-to-end board-level and silicon physical failure analysis (PFA).
- Responsible for electrical FA and physical FA from AMD AECG global RMA, production rejects, reliability, and engineering evaluation failures.
- Collaborate with cross-functional teams on failure root cause investigation and drive continued improvement plans.
- Develop new FA techniques to enhance productivity and hit rate.
- Equipment owner of FA tools.
- Candidates must take on the role of an AMD Company Emergency Response Team (CERT) member for critical lifesaving.
PREFERRED EXPERIENCE:
- Minimum 5 years of experience in package or silicon failure analysis.
- Knowledge of semiconductor circuit analysis is required.
- Knowledge of Optics Fault Isolation, such as OBIRCH, PEM, thermal, SDL, LADA, and LPV is required.
- Hands-on physical FA, such as silicon/package delayering, chemical etching, and cross-sectioning.
- Equipment knowledge of SEM/EDX, 3D X-Ray, SEM-based nano-probing, and AFP analysis.
- Strong problem-solving and communication skills.
- Proactive and able to work with minimum guidance.
ACADEMIC CREDENTIALS:
- Bachelor’s Degree in Electronics Engineering or equivalent.
LOCATION:
Singapore
