Key Job Accountabilities:
· Responsible for maintenance and repair on any of the following equipment such as DISCO Wafer SAW (DFD 6360 and DFD6361) and DISCO laser groove.
· Provide technical support to manufacturing that includes machine conversion, device setup and line sustaining.
· Ensures 100% support to engineering group on device & recipe creation, equipment buy-off, evaluations, qualifications and support new product introduction NPI.
· Communicates with Manufacturing, Process, QA, Central Engineering (NPI) to solve issues involving other group.
Required Experience and Qualifications:
· Possess wide application of most major concepts of specialization and ability to apply these concepts to a wide range of complex assignments.
· Requires through knowledge of practical applications of concepts, procedures and guidelines to solve extremely complex problems.
· Diploma in Electrical/ Electronics/ Mechanical / Mechatronics, Chemical, Material, Science or its equivalent Hands on experience in handling Wafer saw and Laser groove machine.
