Job Description
Responsible for technical transfer from Head Office (Japan) and new products testing;
- To assist customers during material evaluation and qualification phases with the Company's products.
- To lead a project to develop epoxy molding compounds and adhesive materials for automotive market.
- To work closely with R&D team in Head Office (Japan).
- To work closely with Japanese group customers (necessary to communicate in local language) in the development of suitable material configurations to meet customers’ needs and providing technical support to them.
- To conduct experimental research on properties of the Company's products, as well as conducting analysis and investigative tests .
Requirements
- Degree / Master in Polymer / Materials Engineering / Applied Chemistry
- Minimum three years of relevant work experience in semiconductor industry, and must be familiar with characteristic of epoxy molding compounds and adhesive materials for automotive use.
- Required to have a detailed knowledge on: -
- reliability requirement for automotive semiconductor.
- composite material between organic and inorganic.
- organic synthesis and adhesion between polymers and metals.
- polymer production process especially for Epoxy and Phenolic resin.
- Familiar with Japanese Patent system.
- Familiar with raw material regulation in following countries; Japan(Japan CSCL), USA(TSCA), EU(EINECS, REACH), Korea(ECL), Philippines(PICCSS), China(IECSC), Taiwan(ECN).
- Industrial experience in failure analysis (FA or polymer science and semiconductor material composition) is necessary.