Responsibilities
- Work with MEMS Research & Development, ASIC design team & Packaging team to perform failure analysis in root cause finding for improvement or issue investigation.
- In-charge of failure analysis request from internal customers and external customers for customer returns, production/process rejects, and reliability/engineering evaluation failures.
- Advise and provide technical inputs to cross-functional teams on appropriate FA techniques to employ in order to establish failure mechanism.
- Dive issue to closure when required.
- Develop new FA techniques with third party FA vendors to enhance detection capability or productivity.
- Drive improvement activities such as robustness and device functionality optimization as well as cost reduction activities.
- Other ad-hoc activities assigned by the reporting manager.
Requirements
- Bachelor's Degree in Engineering (Material Science or Electrical/Electronic), Physics or equivalent. At least 10 years of experience in failure analysis of IC and/or MEMS at frontend and backend.
- Have excellent understanding and knowledge of physical and electrical FA techniques, including cross-section, TEM, EDX, SIMS, Obirch, EMMI, electrical fault isolation.
- Knowledge of semiconductor devices (CMOS, Bipolar, IGBT etc) are required Good understanding of semiconductor & MEMS device quality issues
- Strong leadership, communication skills & analytical mindset.
- Excellent interpersonal skills and team approach to problem-solving
- Self-driven, proactive and able to meet commitments
