Key Job Accountabilities:
- Perform failure analysis on integrated circuit (IC) package chips to identify root causes of failures
- Perform reliability tests for customer qualifications, new package development qualifications, process / material qualifications and in-house evaluations
- Participate in internal and customer meetings, issue resolution, and audits technically and effectively
- Maintain all FA & Rel equipment in laboratory and ensure functionality at all times
- Supervise a team of Associate Engineers or Technicians
- Update FA methods
- Train new staff in usage and familiarization of equipment in FA & Rel Lab
Requirements:
- Minimum Degree in Electronic and/or Electrical Engineering or any related field
- At least 2 years’ related experience in IC packaging environment
- Good working knowledge and experience in IC failure analysis techniques
- Preferably familiar with industrial reliability test standards such as Mil-Std 883 and JEDEC standards
- Some knowledge of Wafer process or Wafer BE process is an advantage
