Job Description:
- Carry out Bump Mask Design tasks to meet customer requirements and making sure that design outputs are aligned to bumping design guidelines and capability
- Design-need to consider all aspect to optimize layout for best possible product performance, consider impact to yield and minimize final product cost
- Responsible for the Design output and need to be in proper Bump Mask Tooling format with accurate information and promptly reviewed and approved by authorized UTAC personnel and customer
- To ensure proper documentation and maintenance of his/her design outputs according to UTAC design verification procedure
- Proficient with Auto-Cad with at least 3 years working experience using ACAD for Bump Mask Design
- Background on IC packaging / assembly processes and experience in using Cadence APD / Allegro or other PCB/ laminate substrate design software is an added advantage
Requirements:
- Degree in Engineering/Science
- Minimum 3 years' experience in Bump Mask Design with knowledge of bumping processes
- Strong understanding of bumping technologies, materials, and equipment
- Proven experience in process development, optimization, and troubleshooting
- Excellent analytical and problem-solving skills
- Ability to work effectively both independently and as part of a team
- Strong communication and interpersonal skills
- Attention to detail and commitment to quality
- Knowledge of industry standards and best practices
