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Jobs in Singapore   »   Jobs in Singapore   »   Engineering Job   »   Bumping Process Engineer (Semiconductor, IC)
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Bumping Process Engineer (Semiconductor, IC)

Alwayshired Pte. Ltd.

Responsibilities:


Carry out Bump Mask Design tasks to meet customer requirements and making sure that design outputs are aligned to bumping design guidelines and capability

  • Design-need to consider all aspect to optimize layout for best possible product performance, consider impact to yield and minimize final product cost
  • Responsible for the Design output and need to be in proper Bump Mask Tooling format with accurate information and promptly reviewed and approved by authorized UTAC personnel and customer
  • To ensure proper documentation and maintenance of his/her design outputs according to UTAC design verification procedure
  • Proficient with Auto-Cad with at least 3 years working experience using ACAD for Bump Mask Design
  • Background on IC packaging / assembly processes and experience in using Cadence APD / Allegro or other PCB/ laminate substrate design software is an added advantage

Requirements:

  • Degree in Engineering/Science
  • Minimum 3 years' experience in Bump Mask Design with knowledge of bumping processes
  • Strong understanding of bumping technologies, materials, and equipment
  • Proven experience in process development, optimization, and troubleshooting
  • Excellent analytical and problem-solving skills
  • Ability to work effectively both independently and as part of a team
  • Strong communication and interpersonal skills
  • Attention to detail and commitment to quality
  • Knowledge of industry standards and best practices


Interested candidates please apply online or send your latest CV to [email protected]


AlwaysHired Pte Ltd

Reg No: R1549345

EA: 24C2293


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