Responsibilities:
- Design mechanical structures, isolations, electronic racks, and stages to support the development of next generation wafer inspection tools.
- Be responsible for the entire design process, including initial requirements, feasibility studies, cost analysis, scheduling, conceptual and detailed design, creation of detailed drawings, design review presentations, procurement of prototype parts, system integration, prototype testing, and handoff to manufacturing.
- Conduct analysis and simulations, including structural, thermal, vibration/modal Finite Element Analyses (FEAs).
- Collaborate with multi-functional engineering teams, including electronics engineers, systems engineers, and manufacturing/serving engineers, to ensure seamless integration and testing at both subsystem and system levels.
- Develop supporting documentation, such as assembly and test procedures, and actively address and resolve product issues throughout the different phases of development.
Requirements:
- In-depth understanding of mechanical engineering fundamentals, encompassing design principles, drawing specifications, materials selection, Geometric Dimensioning and Tolerancing (GD&T), and fabrication methods.
- Prior experience in structure design, sheet metal, motion, temperature control, vibration isolation, semiconductor equipment, metrology, and instrumentation is desired.
- Excellent communication and interpersonal skills, capable of growing in a collaborative, dynamic environment.
- Able to travel to US.
Minimum Qualifications:
- Doctorate (Academic) Degree and 0 years related work experience; Master's Level Degree and related work experience of 3 years; Bachelor's Level Degree and related work experience of 6 years
