As a Yield Enhancement Failure Analysis (FA) Technician, you will be responsible for daily physical analysis of memory devices to support the fab needs. You will perform sample preparation analysis. This could include: X-sections and overviews with chemical staining techniques, taking appropriate pictures for Fab targets and providing timely feedback to keep production tools running. You will also support the analysis of wafers with functional failures by using various Failure Analysis tools and techniques to isolate the possible defects and identify the primary cause of the failure.
Responsibilities and Tasks:
- Perform cross-section analysis and Scanning Electron Microscopy (SEM) inspection for process health monitoring.
- Handle Transmission Electron Microscopy (TEM) sample preparation using Focus Ion Beam (FIB) for TEM inspection.
- Identify defects and failure mechanism through physical failure analysis using various sample de-processing techniques and wide range of failure analysis equipment.
- Perform physical fault isolation techniques.
Requirements:
- Diploma in Electrical/Electronics/Microelectronics/Mechatronics Engineering or any related field.
- Experience in Real-Time Defect Analsysis (RDA) or Failure Analysis related areas will be helpful!
- Able to work on permanent 12-hour shift.
