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Jobs in Singapore   »   Jobs in Singapore   »   Engineering Job   »   Core Engineering Module (CEM) Process Development Engineer
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Core Engineering Module (CEM) Process Development Engineer

Micron Semiconductor Asia Pte. Ltd.

As a Process Development Engineer, you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. Additional responsibilities include coordinating and carrying out process, equipment and material evaluation/optimization to implement changes at process step, leading and participating in yield improvement and cost reduction activities, handling new process baseline qualifications and managing, auditing and liaising with material suppliers to achieve quality, cost and risk management objectives.

  • Excellent execution on assembly process for 1st New Product Introduction (NPI) success and smooth transfer process from NPI to HVM
  • Excellent execution of the qualification of NPI products / packages build that proliferate from the pilot products and packages according to planned timeline
  • Full responsible on support NPI business process with process TRA, POS, PFMEA/QCP, risk mitigation and documentations.
  • Deliver BIC yield and cost on product NPI with integration of DFx BIC package solution, process guideline and design rules.
  • Collaboration with multi-functional team from NPI to LVM/HVM process transfer.
  • On-time execution of NPI Customer samples and Engineering Samples build for new products and packages

SME Process Owner Responsible for Continuous Improvement on Process Yield, Defect Elimination and Process Characterization

  • Process owner to perform on-time detection with data analysis for process yield improvement. Lead the defect elimination and continue improvement action, with problem solving methodology, statistical analysis and integration solution decision.
  • Process owner to develop process recipe for BIC UPH, conducting process characterization to define process parameters and boundary.
  • Continuous develop in depth assembly process technical knowledge, well understand process capability/tolerance//spec limit/CpK, and utilize key tools PFMEA/QCP/APC/FDC/Alarm on assembly processes Cz/Development/NPI.
  • Global leader for cross team collaboration on network BKM, process recipe spec and recipe standardization/conversion.

Technology enablement and development – Process, Material, Equipment

  • Participate and support Product Roadmap, to enable key process capability and technology development to ensure packaging solution is ready prior 1st Qual Silicon deliver.
  • Frequent engagement with equipment and material supplier (at least interval of monthly or daily/weekly for process issues)
  • Collaboration with Supplier and involvement Supplier Roadmap (Material/Equipment/OSAT), to understand market trends and competitor’s direction, ensure key process technology and capability enablement is in-line.
  • Frequent review and participant Competitor Analysis, to understand market trends and competitor’s technology/capability boundary.

Teamwork and General expectation

  • Trainer/Buddy/Mentor for new team members, build effective relationships within team and cross team (peers, counterpart)
  • Regularly review data and direction with supervisor. Demonstrate sound data analysis and judgment. Present reports and findings with appropriate conclusions, recommendations and decision making.
  • Develop, or coordinate development of, training materials for existing/new process
  • Safety Identify and promptly report hazards, follow safety procedures and area work rules including proper PPE, lockout and chemical safety.

Requirements:-

  • Masters or Bachelor's degree in Mechanical/Mechatronic/Electrical & Electronic Engineering.
  • Experience in backend engineering process or package development preferrable.
  • Good technical knowledge in component test and/or module manufacturing process.
  • Candidate must have technical knowledge in PFMEA/8D/QCP/APC or SPC/FDC methodology.
  • Must have capability to engage and follow PDE business process (TGR, TORB, KEG interlock
  • Excellent data analysis, statistical analysis, data interpretation skills
  • Ability to make sound data-driven decisions. Prioritize and apply due-diligence in day to day task.

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