Responsibilities:
- Fast response of any lithography process or quality related issue, troubleshoot and resolve the issues
- Owner of PMFEA, OCAP and WI/ SOP for documentation and update
- Propose and lead process CIPs for chronic issue resolving
- Plan and conduct new process/ package development and evaluations
- Perform process margin study to determine the process capability of new process/ package
- Lead all the evaluation lots and report the evaluation results in a timely manner
- Provide technical training and support to troubleshoot process issues encountered in manufacturing line
- Work closely with other departments to ensure successful implementation of new process/ package
Requirements:
- Degree in Engineering or Science
- At least 2-3 years of experience in the semiconductor manufacturing industry with exposure to dry process such as photolithography/ plasma, sputtering; or wet process such as electrochemical plating, wet etching etc
- Statistical (SPC) and analytical skills (problem solving methodologies) are essential
- Familiar with using MS Excel and PowerPoint. Prior experience in using CAD and statistical software will be an added advantage
