- Perform machine setup, calibration, testing and mechanical assembly of active devices to the interposer
- Test assembled devices and generate test report and summary
- Troubleshoot assembly issues and document findings for failures analysis
- Liaise with internal teams to manage incoming materials for assembly
- Perform analysis on packaging process specs performance, yield, manufacturing cost and cycle-time; and contribute to planning and execution of essential improvement program
- Able to manage Wafer Preparation including process characterization and improvement
- Hands on Disco Back Grinding and Stealth Dicer equipment with basic maintenance
- Perform die-assembly tool, flip chip bonder, wire bonder, solder ball jetting and CAD drawing
- Knowledge of Analytical Software such as JMP SAS. TIBCO
- Basic knowledge on Advance Package interconnection, Flip Chip, Wafer Bumping, Eutectic Bonding and Solder Ball jetting
Requirements:
- Hand-on experience with die-assembly tools, flip-chip bonder, wire bonder, and CAD drawing is strongly recommended.
- Have Disco Back Grinding and Stealth Dicer, flip chip bonder, wire bonder skills
- Understanding the packaging of semiconductor wafers is a plus.
- Good written and verbal communication skills
Graduates from Engineering faculty may be considered
