Responsibilities
- Work with package design and development teams to complete chip package interaction risk assessment.
- Work with scribe designers and assembly engineers to find solutions for dicing problems and implement relevant design rules and design FMEA.
- Collaborate with R&D/manufacturing wafer fabs and packaging teams to solve relevant issues, and improve yield, quality and manufacturability.
- Contribute to development of new silicon and package technologies by engaging with Micron’s internal factories.
- Define test vehicles, plan DOEs, characterize enabling technologies, document best-known-process and hand-off to manufacturing.
- Identify technology, quality and business process gaps and develop and deploy needed solutions.
- Be the contact window to the Si design, scribe design and wafer fab regarding the progress of key projects.
Requirements
- PhD, Masters or Bachelor’s degree in Engineering (Mechanical, Materials Science, Electrical, Chemical)
- 4-5 years of work experience in the semiconductor industry, either in assembly or fab wafer fabrication.
- Possess sound methodology for organizing work, decision-making and setting priorities
- Knowledge in PFMEA, DFMEA, DOE, Fish-Bone Analysis is preferred.
- Strong analytical, problem solving, and organizational skills
- Proficiency in computer applications like Excel, Word, Power Point.
- Self-motivated and team-oriented.
- Strong interpersonal, oral and written English communications-skills.
