Substrate Engineer
This role is to support global business processes across sales, factories and business unit organizations, with a focus on assembly pricing activities.
Core Responsibilities
- Focus on OSAT pricing and costing activities for assembly packaging.
- Key responsibility for the initial 3 months will be on daily production price maintenance duties, and approving pricing issues in SAP
- Responsible on cost models preparation to provide cost estimates and manufacturing readiness inputs to business unit, engineering and factory.
- Respond timely to relevant pricing requests in RFQ systems through price benchmarking and profitability analysis.
- Oversee RFQ trend, win/loss effectiveness and RFQ cycle time efficiency
- Support critical meetings with internal cross functional teams on product costing
- Partner with Business Units, factories, and sales to assure integrated and profit maximizing approach.
- Adhoc analysis of various revenue related items
Job Specifications
- BS degree in Engineering.
- Minimum 5 years of relevant experience in semiconductor industry.
- Knowledge in assembly packaging processes will be preferred.
- Familarity with SAP system.
- Advanced Excel skills and ability to manipulate large data set is a must.
- Strategic thinker with a proven ability to translate technical requirements/issues into the business context or vice versa.
- Excellent communication and presentation skills, both verbal and written
- Independent, able to multi-task, and collaborate with cross functional and cultural groups.
Interested applicants, please kindly email your update resume to [email protected]. We regret to inform that only shortlisted candidates will be notified.
