Job Description:
As a Process Integration Engineer, be part of an exciting research and development team to work on cutting-edge Advanced Packaging process technologies. In this role you will develop integrated process modules to enable advanced packaging process technologies for Mobile, IoT, Consumer and High-Performance Computing market segment. Work with various teams from inside and outside of Applied Materials to help develop leading-edge packaging solutions bringing them from concept to mass production. Responsibilities will include conducting gap-analysis, risk-assessment and mitigation, and integration process flow development to make sure projects are completed successfully and delivered on time.
This position is based in Singapore.
Responsibilities:
- Develop 2.5D/ 3D process technologies and solutions for Advanced Packaging including Bump/ Re-Distribution Layer, Through-Silicon Via, Backside Via Reveal, Hybrid Bonding
- Plan wafer splits/ lot run with design of experiment methodology for co-optimization of unit process to enable overall successful integrated module development.
- Process and manage wafers/ lots through integrated lines/ process flow and collect metrology data to ensure meeting requirements such as yield, reliability.
- Collect on-wafer data, perform data analysis, and provide outcome, learnings and plan for the next process steps.
- Owns, manage, and drive technical programs/ project, report out timely status and interface with various stakeholders/management leading to completion.
Experience:
- Minimum 5 years of hands-on experience, deep knowledge in semiconductor technology and processing in cleanroom environment either: Front-end of Line/ Back-end of Line/ Packaging or Assembly.
- Knowledge of Advanced Packaging architecture and process flow such as flip-chip, Through-Silicon Via, Re-Distribution Layer, Singulation, Hybrid Bonding, assemblies, reconstitution, etc will be advantageous.
- Hands-on Experience in Unit Processes BEOL & Packaging Assembly Unit Process (e.g. Reconstitution, Litho, Etch, CVD, PVD, Plating, Back Grinding, Dicing, Molding, P&P, Wire Bonding etc.) will be advantageous.
- Good understanding on enabling high-density interconnects, associated mechanical, thermal and reliability issues and cost tradeoffs of various interposers process technologies.
- Demonstrate ability and experience to work, solve complex problems and drive projects to end goals completions.
- Demonstrate ability, experience, and good communication skills to work across different functions/ unit process owners and geographies to achieve technical outcome.
- Bachelor, Master, Doctorate in STEM disciplines e.g. Physics, Chemistry, Electrical, Mechanical, or Materials Science Engineering.
