Job Description
- Achieve targeted market share via technical excellence.
- Ensure customers' satisfaction in technical aspects via technical support and customer relationship management.
- Supporting in sharing latest technical trends and roadmaps internally and externally.
- Aligning company’s latest technical roadmaps with customers.
- Investigation of material modification to fit local requirements.
- Leads and manages all technical matters related to back-end semiconductor materials, to ensure market leadership via technical competence.
- Experience in handling Epoxy Molding Compound for assembly encapsulation transfer/ compression process and back end assembly.
Job Requirements
- Provide technical support to existing and new customers and to ensure our product functionality / feasibility for customers application.
- Attend customers' evaluation to assist customers in process optimization consideration for product manufacturability.
- Recommend suitable products and advise on design changes to existing products when necessary.
- Provide support in problem-solving activities.
- Provide customers' technical trend information / package trend to R&D for new product development.
- Project Management - to manage key projects to increase POA success rate.
- Product Management - to collect competitor’s information and customer’s future packaging trend.
- Involve in co-work activities to find collaboration chances with fabless, corporate R&D, machine makers, etc.
- Cluster Products Support - to support all other back-end materials during co-evaluation.
- Analyze customers’ requirements and set targets. Specification for new products and improved existing products according to customer requirement.
- Create activity / theme list for each theme/customer to monitor the ongoing activities and plan further actions required.
- Monitor the progress of each theme and ensure that progress is relative to set targets.
- Follow-up, monitor and determine suitable actions to achieve new project realization plan.
